The invention discloses a method for eliminating solder mask ink in a via hole of a printed circuit board, which comprises the steps of S1, cleaning a substrate and a conductive copper layer on the surface of the substrate, roughening the surface of the conductive copper layer through a polishing device, and cleaning the substrate and the conductive copper layer again; S2, carrying out silk-screenprinting, specifically, printing an ink layer with a preset color on the conductive copper layer; S3, conducting pre-baking, specifically, pre-baking the silk-screen printed circuit board; S4, performing primary exposure, specifically, performing alignment exposure by using a film, performing photocuring on the solder mask ink, and shielding the via hole and the periphery by using a shading partof the film; S5, developing for the first time, and removing the ink at the position shielded by the shading part of the film; S6, drying the circuit board. S7, performing secondary exposure, specifically, performing secondary alignment exposure by using a film, and performing secondary photocuring on the ink layer; S8, developing for the second time, and removing the residual solder resist ink inthe via hole; and S9, drying the circuit board. The solder mask ink in the via hole can be effectively eliminated, the integrity of an ink layer is ensured, and assembly welding bridge partition is prevented.