The invention belongs to the technical field of
laser surface modification, and discloses a fast and efficient
semiconductor laser cladding device with a wide
light beam and an adjustable
powder feeding angle. The fast and efficient
semiconductor laser cladding device with the wide
light beam and the adjustable
powder feeding angle comprises a
semiconductor laser (1), a
light beam shaping and Fresnel focusing
system (2), an adjustable wide light band
powder feeding head (3), a powder feeder (6), a high-speed
machine tool (5), a six-axis linkage
robot (4) and a central
control system (9), wherein the light
beam shaping and Fresnel focusing
system (2) is used for shaping a
laser light and focusing to form a wide-light-band
laser light; the adjustable wide light band powder feeding head (3) is used for conveying powder and the wide-light-band
laser light on the surface of a large-scale shaft type workpiece to be processed; and the
diameter of a workpiece is larger than 1000mm, and the length of the workpiece is not lower than 10m. According to the fast and efficient semiconductor laser cladding device with the wide light beam and the adjustable powder feeding angle provided by the invention, through improving structures and arrangement manners of key components, outer surface strengthening and surface repairing can be carried out aiming at the large-scale shaft type workpieces such as
petroleum pipelines, ocean facilities,
natural gas conveying, mining and tunnel piercing, so that the
wear resistance and the
corrosion resistance of the surface are improved, and the service life is greatly prolonged.