The invention provides a
wafer detection method, which comprises the following steps: a scanning
machine scanning a
wafer by taking a virtual unit as a unit to generate a coarse
wafer graph; wherein one
exposure unit is composed of an integer number of virtual units greater than 1, and one virtual unit comprises a plurality of chips; removing a virtual unit containing a test
chip from the coarse wafer graph to generate a standard wafer graph; the scanning
machine scanning the defects of the main
chip units according to the standard wafer diagram, and the SEM
machine searching the defective main
chip units on the wafer according to the defect scanning generation file and detects the defective main chip units. Compared with the mode that chips are scanned one by one by taking a
single chip as a unit, the number of scanned virtual chips is reduced, so that an SEM machine table has the capability of calculating a corresponding wafer graph to carry out point-to-point automatic detection. Compared with the mode of scanning the wafer by taking the
exposure unit as the unit, the contour size of the scanning unit is reduced by taking the virtual unit as the unit, and the edge of the wafer can be covered by more virtual units, so that a scanning machine can scan the wafer. As the scanning unit range is reduced, the scanning precision is improved.