2801 results about "Memory chip" patented technology

A semiconductor storage employs a base substrate (101) having a command/address external terminal group (CA), a data input/output external terminal group (DQ), and a single chip select external terminal (CS), and also comprises a plurality of memory chips (110) to (113) mounted on a base substrate (101), each of which can individually carry out read and write operations. The terminals (CA), (DQ), and (CS) are connected to an interface chip (120). The interface chip (120) has a chip select signal generation circuit that can individually activate a plurality of memory chips (110) to (113) on the basis of an address signal fed by way of the terminal (CA) and on the basis of a chip select signal fed by way of the terminal (CS).

Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement. The carrier may be of the same material as the chip stacks to match coefficients of thermal expansion. High-density circuit packages may also be in the form of removable memory modules in generally planar or prism shaped form similar to a pen or as a thermal conduction module.

A computer memory system provides a double data rate (DDR) memory output while requiring memory chips with only half the frequency limit of the prior art DDR memory chips. The system contains a first memory bank having data lines and a second memory bank having data lines. The first and second memory banks are associated with first and second clock signals, respectively, where the second clock signal is delayed from the first clock signal such that the data lines of the first memory bank are connected to a data bus in synchronism with the first clock signal while the data lines of the second memory bank are connected with the data bus in synchronism with the second clock signal. In one embodiment, a first FET switch connects the data lines of the first memory bank with the data bus and a second FET switch connects the data lines of the second memory bank with the data bus. The second FET switch is connected to the data bus at a time delayed from the beginning after the start of each clock cycle of the second clock signal. As a result, the data bus is never connected to the data lines of both memory banks at the same time, but rather, the data bus is alternately connected with the first memory bank and then the second memory bank.

A memory module includes a plurality of memory chips on the module; first logic for configuring the memory module to operate in a selectable mode; second logic for storing initial presence detect (PD) data; and third logic for storing modified PD data that corresponds to a requested mode of operation of the memory module received from a system controller.

A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection. Such a system and method is employed in a memory system comprising integrated circuit chips disposed in a stacked relation, with each chip including: a layer of active circuitry formed at a first layer of each chip; a plurality of through conducting structures disposed substantially vertically through each chip for enabling electronic connection with active circuitry at the first layer; second conducting device disposed at an end of the through conducting structure at an opposite side of a chip for connection with a corresponding through conductive structure of an adjacent stacked chip, the stacked chip structure formed by aligning one or more through conducting structures and second conducting devices of adjacent chips, whereby a chip of the stack is electronically connected to active circuitry formed on other chips of the stack. The stacked chip structure is ideal for reducing data access latency in memory systems employing memory chips such as DRAM.

The present invention provides a memory chip for use in an oximeter sensor, or an associated adapter or connector circuit. The memory chip allows the storing of different data to provide enhanced capabilities for the oximeter sensor. In addition to providing unique data to store in such a memory, the invention describes unique uses of data stored in such a memory. The data stored in the memory chip may include information relating to use of the oximeter sensor. For example, the memory chip may encode a sensor model identification that can be displayed on a display screen when the sensor is connected to an oximeter monitor. The memory may also encode a range of operating parameters such as light levels over which the sensor can function or a maximum drive current. The operating parameters are read and interpreted by a controller circuit to control the pulse oximetry system.

A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling.

Improved plastic article having an integral radio frequency identification (RFID) as an integral, permanent part of the article. The RFID can be molded onto an article; as a memory chip-antenna combination molded onto a desired location on an article.

Two memory chips mounted over a base substrate have the same external size and a flash memory of the same memory capacity formed thereon. These memory chips are mounted over the base substrate with one of them being overlapped with the upper portion of the other one, and they are stacked with their faces being turned in the same direction. The bonding pads BP of one of the memory chips are disposed in the vicinity of the bonding pads BP of the other memory chip. In addition, the upper memory chip is stacked over the lower memory chip in such a way that the upper memory chip is slid in a direction (X direction) parallel to the one side of the lower memory chip and in a direction (Y direction) perpendicular thereto in order to prevent partial overlapping of it with the bonding pads BP of the lower memory chip.