31results about How to "Protective Adhesion" patented technology

A cart grip sanitary cover is provided having multiple layers each with a top face, a bottom face, and a periphery formed therebetween. The bottom face of each layer has adhesive formed thereon for adhering to a top face of an adjacent layer therebeneath. The layers are stacked with a bottommost layer being attachable to a grip of a cart. In use, a topmost layer of the sanitary cover is removable for exposing another layer therebeneath for providing a sanitary surface to be gripped by a user.

A floor cover guard for protection of a corner formed by a pair of adjoining walls and a floor against debris accumulation. The floor corner guard has an elongated wall portion having sufficient vertical dimensions to extend above conventional baseboard, molding, and similar architectural details. A sloping base extends from the wall portion, downwardly and forwardly at an angle of between 25 and 75 degrees in relation to a vertical axis of the wall member. The wall portion has an upper edge and the base has a tapered forward edge to facilitate sealing engagement of the wall portion and the base with the walls and the floor, respectively. Some embodiments provide for a support brace extending outwardly from the wall portion opposite the base; the support brace is designed to fit under the baseboards, moldings and the like. During cleaning, the curved protector allows for easy removal of debris.

To provide interlinked staples which are made possible to be fed accurately in the inside of a stapler and a staple cartridge which houses these interlinked staples.The interlinked staples 1a are constituted by interlinking a plurality of staples 2a each of which has an elongated and straight-formed shape. The vicinities of the edge portions in the longitudinal direction of the each staple 2a are formed in trapezoidal shapes, and the widths are tapered toward the tips thereof. Also, adhesion portions 31 coated with adhesive agent are provided on the rear surfaces of the vicinities of both the edge portions in the longitudinal direction of the each staple 2a. Also, there are provided elliptical feeding holes 32 at predetermined positions from both the edge portions of the side by which each staple 2a is interlinked. A portion between two feeding holes 32 is made to be a slit portion 33 and the respective staples 2a are cut off perfectly thereby. Portions on the outside of the two feeding holes 32 and until both the edge portions of the side by which each staple 2a is interlinked are operated as staple interlinking portions 34 and the respective staples 2a become in a state of being interlinked.

The invention discloses a method for cleaning and reusing microdissection sample-collecting tubes. The method can be implemented according to the following steps in turn: (1) adding xylene to a collecting tube, capping and oscillating the collecting tube and discarding the xylene; (2) adding suspension A to the collecting tube, oscillating and then emptying the collecting tube; (3) adding double-distilled water to the collecting tube while adding silica particles, oscillating and then emptying the collecting tube; (4) repeating the step (2) and the step (3) twice in turn; (5) adopting the double-distilled water to wash the collecting tube; (6) uncapping the collecting tube and placing the collecting tube in a refrigerator till liquid completely evaporates; (7) taking the collecting tube out, smearing polylysine on the surface of a viscous module on the inner surface of a tube cap, putting the collecting tube back into the refrigerator and keeping the collecting tube standing; and (8) repeating the step (7). The method can effectively maintain and repair the adhesion property of the viscous module on the inner surface of the tube cap of the collecting tube, and can effectively remove superfluous substances remaining in the collecting tube so as to repeatedly recycle the collecting tube and save a large amount of experiment funding.

The invention provides a GaN-based LED and a method for manufacturing the GaN-based LED. The method for manufacturing the GaN-based LED comprises the following steps: (a) an n-type GaN, a multi-quantum well and a p-type GaN are successively formed on a substrate; (b) a transparent conductive layer is formed on the p-type GaN; (c) mesa etching is performed on one part of the transparent conductive layer, the p-type GaN and the multi-quantum well until one part of the n-type GaN is exposed; (d) an oxide protective layer is formed on the transparent conductive layer and the exposed part of the n-type GaN; (e) the oxide protective layer is etched on a position with no mesa etching so that one part of the transparent conductive layer is exposed, and the oxide protective layer is etched on the position with mesa etching so that one part of the n-type GaN is exposed; (g) and a p electrode and an n electrode are formed on a rough surface and the part that n-type GaN is exposed respectively. The probability and the degree of losing an electrode can be reduced by using the GaN-based LED.

The invention relates to a preparation process of a composite abrasion-resistant layer on a metal component. The preparation process comprises the steps (1) producing a two-stage combined assembly mold comprising a first-stage mold and a second-stage mold; (2) preparing silicon carbide particles with surfaces coated with thermosetting resin, and adopting the silicon carbide particles as an abrasion-resistant layer shaping filling material of a workpiece; (3) preparing silicon carbide particles with clean surfaces, and adopting the silicon carbide particles with clean surfaces as an abrasion-resistant layer dipping filling material of the workpiece; (4) assembling the first-stage mold, filling the mold with the abrasion-resistant layer shaping filling material, and compacting the abrasion-resistant layer shaping filling material, heating the mold, and solidifying the thermosetting resin; (5) assembling the second-stage mold, filling the second-stage mold with the abrasion-resistant layer dipping filling material, and vibrating and compacting the abrasion-resistant layer dipping filling material; (6) preparing the thermosetting resin into a grouting sizing agent, pouring the grouting sizing agent into holes of the abrasion-resistant layer shaping filling material on the shaped workpiece and gaps of the abrasion-resistant layer dipping filling material; and (7) heating and curing the grouting sizing agent. By adopting the preparation process of the composite abrasion-resistant layer on the metal component, the abrasion resistance is remarkably high.

The invention is concerned with the sealing structure, including: the first base panel, the first sealing piece, the second sealing piece and the sealing glue. It is: the first base panel is with the first surface; the first sealing piece includes the first CMOS chip and the liquid sealing glue; the first CMOS chip sets on the first base panel and electric connects with the first base panel by the first metal line; the liquid sealing glue covers the second surface of the first CMOS chip, and covers the first metal line partly, forms the flat at the surface of the liquid sealing glue; the second sealing piece sets on the flat, the sealing glue covers at least part of the first surface of the first base panel, the first sealing piece and the second sealing piece.

The invention discloses an IC carrier film remover and an application thereof, belonging to the technical field of film removal technology. Among the components of the IC carrier film remover product of the present invention, the inorganic alkali in the film remover A can directly break the covering film on the IC carrier, while the organic alkali can make the film layer swell, and the penetrating agent With synergistic assistance, the film layer can be completely peeled off without curling and sticking; the B component of the film remover can realize the penetration of the microstructure on the product carrier, and at the same time protect these microstructures from being damaged or peeled off. With the combination of the two film removers, the resulting product can efficiently remove the film on the IC substrate. The invention also discloses the application of the product on the removal of the film on the IC carrier board. When the product is applied, it does not need to use other auxiliary equipment or add an additional pretreatment process, and the film layer on the circuit can be removed by direct immersion. Complete removal, which has high removal efficiency and does not damage the wiring on the carrier.

Disclosed are hydrogels polymerized with or around a solid biofunctional moiety, biodegradable or permanent, designed to be implantable in a mammalian body, intended to block or mitigate the formation of tissue adhesions, and intended to aid in functional healing. The hydrogels of the present invention are characterized by comprising multiphasic structural elements: a) at least one gel phase, b) at least one solid phase, c) optional polymeric chains connecting gel and solid phases, d) optional shape designs that provide for an interpenetrating geometry between gels and solids, e) optional shape designs that enhance a tissue-hydrogel interface, and f) optional shape designs that provide a biofunctional aspect. The hydrophobicity of the various phases is chosen to reduce tissue adhesion and enhance tissue healing. The morphology of the polymers comprising the gel phase is typically of high molecular weight and has morphology that encourages entanglement. Useful polymeric structures include branching chains, comb or brush, and dendritic morphologies.

The invention relates to a double-side-squeezing water squeezing device. The water squeezing device comprises a water squeezing frame with a squeezing opening; two sets of squeezing components are arranged in the squeezing opening and oppositely arranged in a front-back spaced mode; and during water squeezing, a mop head with the bottom face directly or indirectly bonded with foamed cotton is rotated to be aligned with the squeezing opening and passes through the squeezing opening, water squeezing is carried out on the front side surface and the rear side surface of the foamed cotton by moving oppositely arranged squeezing components along the length direction of the foamed cotton. The water squeezing device is characterized in that the squeezing components can be movably arranged in the squeezing frame relative to the squeezing frame; during water squeezing, the foamed cotton and / or the mop head firstly promote the squeezing components to move, and a squeezing channel is formed between the squeezing components after movement; and when the foamed cotton passes through the squeezing channel and is squeezed by the squeezing channel, and the squeezing force of the squeezing channel on the two sides of the outer end of the foamed cotton is larger than the squeezing force of the squeezing channel on the two sides of the inner end of the foamed cotton. According to the water squeezing device, in the cleaning and dry-squeezing operation process, the bonding face of the foamed cotton is not prone to being torn. The invention further relates to a cleaning tool and a self-squeezing foamed cotton mop.

The invention relates to a conveyor belt, and particularly to a prescription and a structure of an anti-burning conveyor belt. The conveyor belt comprises a central framework layer, a working surface cover adhesive layer which is arranged on the periphery of the central framework layer and contacted with a material, as well as a non-working surface cover adhesive layer and a side adhesive layer which are not contacted with the material; and the conveyor belt is characterized in that an anti-burning layer is further arranged on the surface of the working surface cover adhesive layer, and the anti-burning layer is composed of constituents in the following parts by weight: 100 parts of rubber, 8-12 parts of zinc oxide, 2-4 parts of stearic acid, 0.8-1.5 parts of sulphur, 1.5-1.8 parts of TMTD (tetramethyl thiuram disulfide), 2-2.5 parts of DM, 2-4 parts of paraffin, 6.5 parts of the mixture of anti-aging agent MB, 4020 and RD, 12-18 parts of coumarone, 5-10 parts of pine tar, 50-60 parts of wear-resistant carbon black, 10-16 parts of solid chlorinated paraffin, 15-25 parts of aluminium hydroxide, 5-40 parts of intumescent flame retardant, and 5-60 parts of asbestos fibres. Tests indicate that the anti-burning conveyor belt disclosed by the invention is simple in structure, low in material cost, and long in service life.