Packing structure with stacking platform

Abstract

The invention is concerned with the sealing structure, including: the first base panel, the first sealing piece, the second sealing piece and the sealing glue. It is: the first base panel is with the first surface; the first sealing piece includes the first CMOS chip and the liquid sealing glue; the first CMOS chip sets on the first base panel and electric connects with the first base panel by the first metal line; the liquid sealing glue covers the second surface of the first CMOS chip, and covers the first metal line partly, forms the flat at the surface of the liquid sealing glue; the second sealing piece sets on the flat, the sealing glue covers at least part of the first surface of the first base panel, the first sealing piece and the second sealing piece.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a packaging structure with a stacking platform. Background technique [0002] With the evolution of chip packaging, the current packaging technology can complete extremely thin packaged chips. The thin chip can be packaged together with multiple thin chips using chip stacking technology to form a so-called package in package chip or multi chip module (MCM). Please refer to FIG. 1 , which is a cross-sectional view of a traditional repackaged chip structure. The package structure 100 includes a substrate 10 , a first package 20 , a second package 30 and a sealant 40 . The first package 20 includes a chip 21 , a chip 23 and a spacer 50 . The chip 21 is disposed on the substrate 10 and is electrically connected to the substrate 10 through gold wires 22 . The chip 23 is disposed above the chip 21 and is electrically connected to the chip 21 and the substrate 10 by gold wires 24 a...

AI Technical Summary

Problems solved by technology

[0003] However, the current chip stacking technology does not provide proper protection for semi-finished chips with gold wire bonds on the substrate. Therefore, the stacked chips are easy to tilt and the connecting wires will be crushed, resulting in package failure. , reduce the production pass rate, and increase the production cost

As shown in Figure 1, since the spacer 50 only contacts the second package 30 with the surface 51, due to insufficient contact area, it is easy to make the second package 30 tilt due to loss of balance or slight vibration or impact, and press the gold wire 22 , gold wire 24 and gold wire 25, resulting in package failure

Furthermore, due to the obstruction of the spacer 50 and the gold wire 22, the gold wire 24 and the gold wire 25, it is easy to cause the sealant 40 to not completely cover each component during the mold filling process, resulting in holes, especially between the chip 23 and the spacer 50. , it is very easy to have gas holes

This hole may cause the popcorn effect (popcorn effect) during the temperature change of the subsequent process, resulting in the rupture of the sealant and reducing the product qualification rate

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