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A kind of film removing agent for IC carrier board and application thereof

A technology of removing film agent and carrier plate, which is applied in the directions of detergent composition, detergent compounding agent, surface active detergent composition, etc. It can solve the problems of poor film removal effect, sheet line falling off, and inability to remove film by the same process. , to achieve the effect of high removal efficiency and efficient removal

Active Publication Date: 2022-03-18
深圳市点石源水处理技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Ordinary PCB circuit board film removal process uses sodium hydroxide or organic amine to achieve the film removal effect, but the IC substrate is relatively more difficult to remove the film because the board is a flexible board and has a smaller aperture line width and line spacing. Even simple ultrasonic treatment may cause the lines on the board to fall off, and the same process cannot be used to remove the film
Therefore, it is of great significance to develop a film remover to remove the film on the IC substrate by conventional soaking method. Although there are the following improved IC substrate treatment agents on the market today, the film removal effect is generally poor. , low efficiency or high requirements for equipment and reaction conditions

Method used

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  • A kind of film removing agent for IC carrier board and application thereof
  • A kind of film removing agent for IC carrier board and application thereof
  • A kind of film removing agent for IC carrier board and application thereof

Examples

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Embodiment 1

[0037] An embodiment of the film remover for IC substrates of the present invention includes the following components in mass percentage: 15% film remover A, 9% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 13% sodium hydroxide, 12% potassium hydroxide, 5% sodium carbonate, 22% triethylenetetramine, 5% dimethylamine, 8% ethylene glycol monobutyl ether and the rest Measure water; the film remover B includes the following components in mass percentage: 3% polyoxypropylene glyceryl ether, 9% dimethyl phosphoric acid aminomethanesulfonic acid, 2% polynaphthaldehyde sulfonic acid sodium salt, 8% 2-hydroxyphosphonoacetic acid, 2% N-lauroyl sarcosine, 0.8% iminodiacetic acid, 25% triethylamine and the balance water.

Embodiment 2

[0039] An embodiment of the film remover for IC substrates of the present invention includes the following components in mass percentage: 20% film remover A, 5% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 14% sodium hydroxide, 11% potassium hydroxide, 5% sodium carbonate, 20% triethylenetetramine, 2% tetraethylenepentamine, 6% dimethylamine, 10% ethyl Glycol monobutyl ether and the remaining amount of water; the film remover B includes the following components in mass percentage: 3% polyoxypropylene glyceryl ether, 10% dimethyl phosphoric acid, 2.3% polynaphthaldehyde Sulfonic acid sodium salt, 5% 2-hydroxyphosphonoacetic acid, 3% S-carboxyethylsulfosuccinic acid, 1% N-lauroyl sarcosine, 0.9% iminodiacetic acid, 28% triethylamine and other Measure water.

Embodiment 3

[0041]An embodiment of the IC carrier film remover of the present invention includes the following components in mass percentage: 12% film remover A, 10% film remover B and the remainder of water; the film remover A Comprising the following components in mass percentage: 13% sodium hydroxide, 13% potassium hydroxide, 5% sodium carbonate, 23% tetraethylenepentamine, 6% dimethylamine, 10% ethylene glycol monobutyl ether and the rest Measure water; the film remover B includes the following components in mass percentage: 3.5% polyoxypropylene glyceryl ether, 9% dimethyl phosphoric acid aminomethanesulfonic acid, 1% polynaphthaldehyde sulfonic acid sodium salt, 1% Sodium N-oleoylmethyl taurate, 9% 2-hydroxyphosphonoacetic acid, 1% N-lauroyl sarcosine, 0.4% iminodiacetic acid, 0.3% tetrasodium glutamate diacetate, 20% trisodium Ethylamine and the remainder of water.

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Abstract

The invention discloses an IC carrier film remover and an application thereof, belonging to the technical field of film removal technology. Among the components of the IC carrier film remover product of the present invention, the inorganic alkali in the film remover A can directly break the covering film on the IC carrier, while the organic alkali can make the film layer swell, and the penetrating agent With synergistic assistance, the film layer can be completely peeled off without curling and sticking; the B component of the film remover can realize the penetration of the microstructure on the product carrier, and at the same time protect these microstructures from being damaged or peeled off. With the combination of the two film removers, the resulting product can efficiently remove the film on the IC substrate. The invention also discloses the application of the product on the removal of the film on the IC carrier board. When the product is applied, it does not need to use other auxiliary equipment or add an additional pretreatment process, and the film layer on the circuit can be removed by direct immersion. Complete removal, which has high removal efficiency and does not damage the wiring on the carrier.

Description

technical field [0001] The invention relates to the technical field of film-removing technology, in particular to an IC carrier film-removing agent and its application. Background technique [0002] IC carrier board is a substrate used to package IC bare chips. Its function is to carry semiconductor IC chips. There are lines inside the product to conduct the connection between the chip and the circuit board, protect, fix, support the IC chip, and provide cooling channels. Compared with ordinary circuit boards, IC carrier boards require finer, higher density, smaller volume, smaller holes, disks, and lines on the carrier board, and thinner core layers, so it must have precise interlayer alignment technology, Line imaging technology, electroplating technology, drilling technology and surface treatment technology. [0003] Ordinary PCB circuit board film removal process uses sodium hydroxide or organic amine to achieve the film removal effect, but the IC substrate is relative...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/10C11D3/04C11D3/10C11D3/30C11D3/20C11D3/37C11D3/36C11D3/06C11D3/34C11D3/33C11D3/60H05K3/22
CPCC11D1/10C11D3/044C11D3/10C11D3/30C11D3/2068C11D3/3707C11D3/364C11D3/06C11D3/361C11D3/3472C11D3/33H05K3/22
Inventor 吴春丽石宗武
Owner 深圳市点石源水处理技术有限公司
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