53results about How to "Meet wiring requirements" patented technology

The invention discloses a method for laying out circuit board line. A data processing device assists a routing application program to carry out linear distance calculation and ground wire layout. The method comprises the steps: the linear distances between two signal lines with different line characteristics are respectively read from the corresponding routing parameters of the two signal lines and compared, and the larger linear distance is chosen as the linear distance of the two signal lines; at the same time, the line width of the ground wire to be laid out is calculated according to calculation rules; the line width calculated is compared with the line width regulated in the routing parameters of the line characteristics of the ground, if the comparison result is not in accordance, the line width regulated in the routing parameters of the line characteristics of the ground is corrected into the line width calculated to have the routing application program lay out the ground wire between the two signal lines according to the corrected ground wire width, thereby improving the correctness of the calculation and working efficiency, simplifying operation process and saving operation time.

The invention discloses a brush carrier plate for an automobile radiator fan motor. The brush carrier plate comprises an insulation brush carrier plate body and an electric conduction connecting plate, wherein four brush box mounting holes are uniformly distributed in the circumference of the brush carrier plate body; the connecting plate is plastically packaged in the brush carrier plate body, and comprises a first electric conduction section, a second electric conduction section, a third electric conduction section and a fourth electric conduction section which are used for correspondingly and electrically connected with brushes on the brush carrier plate body one to one, wherein the first electric conduction section and the second electric conduction section are connected with each other end to end, the third electric conduction section and the first electric conduction section are connected with each other end to end, and the fourth electric conduction section and the second electric conduction section are connected with each other end to end; and the tail end connection section of the first electric conduction section and the second electric conduction section, the tail end connection section of the third electric conduction section and the first electric conduction section, the tail end connection section of the second electric conduction section and the fourth electric conduction section and the head end connection section of the first electric conduction section and the second electric conduction section are all exposed out of the brush carrier plate body. The brush carrier plate has strong universality, not only is suitable for different variable-speed motors to use, but also is reasonable in internal wiring, and has a compact motor structure.

Disclosed are a substrate structure and a manufacturing method therefor. The substrate structure comprises a metal substrate, a first connecting layer, a metal core layer, a second connecting layer, an inner connecting assembly and a dielectric material layer, wherein the first connecting layer is arranged on one surface of the metal substrate; the metal core layer is arranged on one surface of the first connecting layer, and has an opening; the second connecting layer is arranged on a partial surface of the metal substrate and positioned in the opening; the inner connecting assembly is arranged on one surface of the second connecting layer and positioned in the opening, and comprises multiple electrode cushions; and the dielectric material layer is arranged on the surface of the metal substrate and used for partially packaging the first connecting layer, the metal core layer, the second connecting layer and the inner connecting assembly. The metal core layer is electrically connectedwith one of the electrode cushions through the metal substrate, the first connecting layer and the second connecting layer.

The invention discloses an ultra-miniature multilayer chip balun, wherein an internal circuit layer comprises first to seventh circuit layers; the first circuit layer comprises four mutually insulated conductive metal sheets which are electrically connected with a bonding pad respectively; the second circuit layer comprises two mutually insulated flaky metal sheets; the third circuit layer comprises two mutually insulated flaky metal sheets; the flaky metal sheets in the second layer are arranged corresponding to the insulated metal sheets in the third layer so as to form two capacitors; the flaky metal sheets in the second layer and the flaky metal sheets in the third layer are electrically connected with the bonding pad respectively through a conducting post; the fourth to seventh circuit layers comprise two mutually insulated dual rectangular-shaped metal sheets respectively; the metal sheets in the fourth to seventh layers are connected end to end respectively in sequence through the conducting post to form two inductors; ends of the dual rectangular-shaped metal sheets in two inductors are electrically connected with the bonding pad respectively.

The invention discloses a winding device for multi-layer uniform winding and its control system and control method, including a frame, a wire feeding wheel, a router, a cable drum, and a wire feeding wheel respectively driven on the frame. , wire feeding wheel motors for screw rods and cable drums, screw motors and cable drum motors. The invention starts the motor according to the set timing, and develops a multi-motor speed matching method suitable for the winding device, which can make the cable arrangement more regular, reliable and adjustable, and has higher control precision, and The invention enables the cables to be evenly arranged in multiple layers, and the arrangement is neat and orderly, the volume of winding and unwinding is increased, and the winding effect is stable and efficient.

The invention discloses a chip DRAM (dynamic random access memory) pad arrangement structure for improving encapsulation compatibility. The DRAM pads of a chip include a plurality of first pads, a plurality of second pads and a plurality of third pads; the plurality of first pads are arranged at intervals so as to form an inner-row pad group; the plurality of second pads are arranged at intervals so as to form a middle-row pad group; the plurality of third pads are arranged at intervals so as to form an outer-row pad group; the inner-row pad group is located between the center of the chip and the middle-row pad group; the middle-row pad group is located between the inner-row pad group and the outer-row pad group; and the outer-row pad group is located between the middle-row pad group and the boundary of the chip. The chip DRAM pad arrangement structure for improving encapsulation compatibility has the advantages of strong compatibility and no need for encapsulation cost increase, and can satisfy wire bonding requirements of frame-class encapsulation such as WB BGA encapsulation and eLQFP encapsulation.

The invention discloses a high-altitude test clamp. An upper clamp jaw is fixed on a sliding seat through an upper clamp sleeve, a sliding groove is arranged in the sliding seat, a screw rod and a nut which can slide along the sliding groove matching with the screw rod are arranged in the sliding groove, a lower clamp jaw is fixed on the nut through a lower clamp sleeve and arranged opposite to the upper clamp jaw, a portion, stretching out of the sliding seat, of the screw rod is connected with a connecting rod, and binding posts are arranged on the upper clamp jaw and the lower clamp jaw. By means of the high-altitude test clamp, defects of a common test clamp can be overcome, high-altitude operation is completely achieved, the risks caused by the fact that a worker has to climb high for operation due to special shapes of connectors can be avoided, wiring requirements of multiple test items such as loop resistance tests and circuit parameter tests in electrical tests can be satisfied, and work conditions of on-site workers are greatly improved.

The invention relates to a phase change method of insulating tube buses. The phase change method of the insulating tube buses comprises the steps that (1) a run layout plan of the insulating tube buses to be laid is made according to the layout of a main transformer and inflatable switch cabinets, and (2) according to electric connection situations, a phase change design is carried out in a space range meeting phase change requirements, wherein phase change design is carried out in a space not less than 80cm above three-phase insulating tube buses A, B and C, and the sideward three-phase insulating tube buses A and C are selected from the three-phase insulating tube buses A, B and C to carry out phase change. The phase change method of the insulating tube buses meets the wiring requirements when two rows of the inflatable switch cabinets are arranged face to face, due to the fact that the insulating tube buses are bent at an angle in a specific range, it is ensured that the carrying capacity, heating and deformation of the insulating tube buses are in a reasonable range, and normal use of the insulating tube buses is not affected.

The invention provides a soft and rigid combination plate and a mobile terminal. The soft and rigid combination plate comprises a first flexible substrate layer, a first copper foil layer, a rigid layer and a second copper foil layer, wherein the first copper foil layer is laminated on the first flexible substrate layer; the first copper foil layer comprises a reinforcing region and a connection region which is separated from the reinforcing region; the ridged layer covers the reinforcing region; the second copper foil layer is laminated on the connection region; and the second copper foil layer extends along the direction far away from the rigid layer. According to the soft and rigid combination plate and the mobile terminal, provided by the invention, the first copper foil layer comprises the reinforcing region and the connection region, and the reinforcing region and the connection region are connected with the rigid layer and the second copper foil layer respectively. With the adoption of the manner, the second copper foil layer is laminated on the connection region of the first copper foil layer, so that the first copper foil layer and the second copper foil layer can be subjected to wire arrangement, and furthermore, a wire arrangement space of a soft plate part of the soft and rigid combination plate can be increased and wire arrangement requirements on different electronic components by the soft and rigid combination plate are met.

The invention discloses a connector with a wire and an emergency power supply box with the same. The connector is arranged on the outlet end of the emergency power supply box. The connector comprisesa conductive portion and a fixed portion. The fixed portion is fixed on the outlet end of the emergency power supply box. The fixed portion extends to one end away from the emergency power supply boxto form a connecting portion. The outer wall of the connecting portion is provided with a screwing portion screwed to a corrugated hose. One end of the conductive portion runs through the fixed portion and extends out of the fixed portion to be electrically connected with the control board of the emergency power supply box. The other end of the conductive portion extends out of the connecting portion to be connected with an electrical appliance. The portion, which extends out of the connecting portion, of the conductive portion is covered by soft rubber. According to the emergency power supplybox provided by the invention, due to the outer soft rubber of the wire and the screwing portion of the connecting portion, the emergency power supply box can meet the wiring requirement of China, and can be screwed to the corrugated hose to meet the wiring requirement of the United States; and the risk of job production is avoided.