128results about How to "Increase wiring space" patented technology

The embodiment of the invention provides a shifting register unit, a driving method thereof, a grid driving circuit and a display device, relating to the technical field of display, and solving the problem that the wiring space of a non-display region is relatively small because multiple different signals ends of an OLED pixel circuit respectively correspond to one grid driving circuit. The shifting register unit comprises at least two of a first output sub-circuit, a second output sub-circuit and a third output sub-circuit, wherein the first output sub-circuit is used for outputting voltage of a signal output end to a reset signal output end; the second output sub-circuit is used for outputting the voltage of the signal output end to a gating signal output end; and the third output sub-circuit is used for outputting voltage of a second voltage end to a lighting control signal output end or outputting the voltage of a first voltage end to the lighting control signal output end. The shifting register unit is used for supplying at least two of a reset signal, a gating signal and a lighting control signal to the OLED pixel circuit.

Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.

A rotor structure of a drive motor is provided. In the rotor structure of a driving motor, a rotor core is divisionally formed in a plurality of core blocks and the core blocks may be combined around an outer side of a rotary shaft.

A wiring design system when applied to wiring boards having various wiring restrictions, has a rough wiring plan at the floor plan stage so as to complete a wiring design satisfying the wiring restrictions in a short period of time while evaluating the congestion degree of the wiring. Logical connection information for wiring parts and signal group information for handling the connection information is input as a signal group. The signal group is handled as a wiring unit for a wiring path search and the signal group is divided into smaller groups. An optimum path is then determined in such a way that the divided smaller groups run adjacent to one another whenever appropriate.

The invention provides a touch display panel which sequentially comprises a TFT (Thin-Film Transistor) substrate, a liquid crystal layer, a special-shaped CF (Color Filter) substrate and a touch sensor from bottom to top. The CF substrate comprises a rectangular CF mainboard region and at least one CF externally expanded region; a black matrix of a certain width is arranged on the periphery of the CF mainboard region; the CF externally expanded regions are convexly arranged at one side of the CF mainboard region and above a terminal region of the TFT substrate; a touch flexible circuit board bonding region is arranged on one CF externally expanded region; the touch sensor is led to the touch flexible circuit board bonding region by routing of inclined wires in the black matrix region; and then the touch flexible circuit board bonding region is electrically connected with a touch flexible circuit board. According to the touch display panel, due to arrangement of the CF externally expanded regions and increase of an available space, the touch flexible circuit board bonding region is arranged in the CF externally expanded regions and a routing space of the inclined wires in the black matrix region is increased; and meanwhile, the requirements of the touch flexible circuit board are weakened, and cost of the touch flexible circuit board is reduced.

The invention provides a capacitance compensation switch. A silicon controlled module is installed on a heat dissipation base and is arranged in a casing; the control circuit on a control circuit board is provided with a signal input end and a signal output end; the signal input end of the silicon controlled module is electrically connected with the signal output end of the control circuit; the heat dissipation base is provided with a heat dissipation base plate and two side plates and heat dissipation fins; the heat dissipation fins and the two side plates are arranged in parallel; the two ends of the heat dissipation base plate is provided with a protrusion part which is provided with an installation through hole; the side plate of the heat dissipation base plate is provided with an installation groove which is provided with installation screw holes; the lower part of the side plate of the casing is inserted into the installation groove and is fixedly connected onto the side plate through screws and installation screw holes; two connecting terminal rows are installed on the heat dissipation base plates; the silicon controlled module is arranged between the two connecting terminal rows; the controlled silicon module and the connecting terminal rows are electrically connected through an electric conductor; and the control circuit board is installed on the inner wall of the top plate of the casing. The invention has simple and stable structure, convenient installation, easy maintenance, little electromagnetic interference and high reliability.

A two-D display is characterized by that its upper and lower base plates have the leading wire regions at both sides and a display region between two leading wire regions. The part of electrode wiresin the display region and the part of leading wires in the leading wire regions are directly connected. The rest of them are connected with each other via the electric conducting material in peripheral frames, so reducing the area of non-display region.

The invention provides an 800G optical module, which is simple and reliable in structure, increases the layout space, avoids the over-compact arrangement of optical chips or circuits and greatly reduces the crosstalk between signals. The optical module comprises a main heat dissipation shell and an auxiliary heat dissipation shell which can be spliced into a whole, wherein an accommodating cavity is formed between the main heat dissipation shell and the auxiliary heat dissipation shell. An accommodating cavity is formed in the main heat dissipation shell, a PCB is arranged in the accommodating cavity, a control chip is arranged on the PCB, and the LED lamp is characterized in that the PCB comprises an electric port part and a thickening part, the electric port is formed in the electric port part, a transmitting end is arranged on one side, close to the main heat dissipation shell, of the thickening part of the PCB, and the transmitting end is connected to an optical port after being connected with an optical fiber. A receiving end is arranged on one side, close to the auxiliary heat dissipation shell, of the thickened part of the PCB, and the receiving end is connected to the optical port after being connected with an optical fiber.

The invention discloses a low-voltage switch cabinet body, comprising a frame, three side plates, door plates and a cabinet top plate; the frame comprises upright columns, an upper crossbeam and a lower crossbeam which are horizontally arranged at upper and lower ends of the upright columns as well as middle crossbeams horizontally arranged for connecting the upright columns. The side plates, the cabinet top plate and the door plates define the interior space of the cabinet body; a bus chamber, an instrument chamber, a cable chamber and a breaker chamber are arranged in the interior space of the cabinet body; multiple square modular holes capable of clamping floating nuts are formed in the upright columns in the height direction; multiple connection holes are formed in the middle crossbeams along the length direction; the middle crossbeams are fixed on the upright columns in a mode that screws penetrate through the connection holes and are matched with the floating nuts clamped in the modular holes in the upright columns. A base is arranged below the frame and is provided with a wire walking space for controlling wire walking. The wire walking space is communicated with the interior space of the cabinet body, so a wire is controlled to enter the wire walking space.

The invention discloses a manufacture method of an embedded circuit board. The method comprises that an accommodation groove is formed in a motherboard into which a board is embedded; the inner wall of the accommodation groove and the sidewall of an embedded daughter board is browned or blackened; the embedded draught board is embedded into the accommodation groove, the daughter board and the mother board are compressed to form a first compression board; and the size expansion and contraction value of the first compression board is measured, and external lines of the daughter board and the motherboard are prepared according to the size expansion and contraction value. According to the manufacture method, the external lines of the daughter board and the motherboard are prepared together, the problem of offset does not exist in the daughter board and the motherboard, and the aligning precision of patterns of the daughter board with patterns of the motherboard is greatly improved.

The invention discloses a driving platform framework and a driving platform. The driving platform framework comprises two side cabinet frameworks symmetrically arranged along the width direction of avehicle and a center console framework arranged on the two side cabinet frameworks; and the driving platform comprises a driving platform framework, pedal plates, a hat brim, a center console surface,a central control equipment panel and two side cabinet doors which are connected to the driving platform framework in a detachable manner. The driving platform framework is beneficial to overhaul andmaintenance, and is suitable for different driving requirements. The corresponding driving platform only needs to dismantle the panel, the cabinet doors, the hat brim and the like to replace the dismantled parts or overhaul the equipment in the framework, so that the replacement and maintenance are convenient and economical.

The invention relates to a touch control screen, a touch control display screen and a mobile terminal. The conductive pattern layer is arranged on the inner side of the substrate and distributed on the horizontal part and the bent part. The bent part is far away from the side of the conductive pattern layer and separates the conductive pattern layer from the antenna so as to reduce the interference of the conductive pattern layer to the antenna. The invention enlarges the trace space of the lead pattern and improves the signal interference caused by the lead pattern to the antenna. Compared with the prior art which uses insulating glue to isolate the lead pattern and the antenna, the manufacturing process is simpler, and there is no risk of crushing the lead pattern when the antenna is assembled.

The invention provides a manufacturing method of a circuit board. The method comprises the steps that a substrate is provided, wherein the substrate comprises a substrate layer and a continuous first copper foil layer formed at one side of the substrate layer; a conductive layer is formed through electroplating in one part of area of the first copper foil layer; a surface treatment pattern is formed through electroplating on one part of surface of the conductive layer; the first copper foil layer which is not covered by the conductive layer is etched and removed, and meanwhile, the conductive layer which is not covered by the surface treatment pattern is thinned; and the left first copper foil layer on the surface of the substrate layer and the conductive layer become conductive line patterns to obtain the circuit board free of an electroplating wire. The invention further relates to the circuit board, obtained by the manufacturing method, free of the electroplating wire.

The embodiment of the invention discloses a Fabric switch card independent from MCH and a Micro Telecommunications Computing Architecture (MicroTCA) system. The Fabric switch card comprises a Fabric switch module, a power port and an MMC, wherein the Fabric switch module is connected with the Fabric port of the AMC card via a back panel, the power port is connected with the power module of the MicroTCA system, and the MMC is connected with the MCMC of the MCH. The embodiment of the invention also discloses a back panel of the MicroTCA system. The Fabric switch card independent from MCH and the MicroTCA system provided in the embodiment of the invention reduces routing density of the MCH and the one board technique, and meanwhile due to the flexible port number configuration of the Fabric switch card, the limitation for ports and routing space is reduced.

The invention discloses a touch screen. The touch screen comprises a substrate, a plurality of touch electrodes and electrode leads which are electrically connected with the touch electrodes correspondingly; the substrate comprises a visible area and a frame area which surrounds the visible area; the touch electrodes and the electrode leads are formed in the surface of the substrate; the electrode leads comprise lead bodies, connecting blocks which are in lap joint with the touch electrodes and offset portions which connect the lead bodies and the connecting blocks; the touch electrodes comprise touch electrode bodies which are arranged at the visible area of the substrate and terminals at the frame area; the connecting blocks comprise lap joint portions and extension portions; the extension portions are arranged on the lap joint sides which are close to the lead bodies and deviated from the touch electrodes; the extension portions play roles in extending the touch electrodes and accordingly the length of the touch electrodes is reduced appropriately, the touch sensitivity of the touch screen visible area is reduced, meanwhile the offset space is saved, and a touch screen with a narrow frame is easy to prepare.

The invention discloses a bottom routing and wire-arranging apparatus for combining outdoor communication machine cabinets. The bottom routing and wire-arranging apparatus is characterized by adopting a three-dimensional structure; a structure that a bottom plate of a machine cabinet is concavely arranged in a base is utilized to expand a routing space in the base; the specific structure comprises a routing / wire-arranging slot, a routing / wire-arranging slot cover plate, and adhesive-passing coils, wherein the routing / wire-arranging slot is formed in a machine cabinet base through an M4 stainless steel screw; the routing / wire-arranging slot cover plate is mounted above the routing / wire-arranging slot through a knurled screw; and the adhesive-passing coils are fixed in cable-inlet / outlet holes of the routing / wire-arranging slot cover plate. The bottom routing and wire-arranging apparatus has the advantages as follows: the thee-dimensional space structure is adopted; a slot channel routing constraint way is utilized; the routing and wire-arranging between cabinets in the combining and routing of the machine cabinets is clearer, and more regular and tidy wire orders and a better routing effect are achieved; and in addition, a cable fixing and bundling function is added in the routing and wire-arranging apparatus, so that various cables in the machine cabinet can bundled separately without causing mutual influence when the cables are threaded at bottoms.

The present application relates to the technical field of electronic products, in particular to a printed circuit board and electronic equipment. The printed circuit board includes a body board and a shielding cover, the body board has a connector mounting portion, the shielding cover includes a cover body and a protection plate, one side of the protection plate is fixedly connected to the cover body, and the other The side is fixedly connected with the body board, and an accommodation space is formed between the protection board and the connector installation part, and the accommodation space is used for accommodating a board-to-board connector. When the board-to-board connector is installed on the printed circuit board, the protection board can provide protection for the board-to-board connector, and one side of the protection board is fixedly connected to the cover, so this side does not need to be connected to the printed circuit board. The body board of the board is fixed, so fewer holes need to be opened on the body board, so that the effective space on the body board is increased, thereby increasing the wiring space on the printed circuit board.

The invention discloses a PCB manufacturing method and a PCB. The PCB manufacturing method comprises the steps that through holes serving as initial pressure welding holes are processed in the positions, with pressure welding holes to be processed, on the PCB, wherein the hole diameters of the initial pressure welding holes are smaller than those of the pressure welding holes to be processed; the initial pressure welding holes are counterbored on the pressure welding side of the PCB, pressure welding holes with the preset depth are obtained, and the hole diameters of the pressure welding holes with the preset depth are equal to those of the pressure welding holes to be processed; metal coating fabrication processing is carried out on holes formed by the initial pressure welding holes in the non-pressure-welding side of the PCB and the pressure welding holes with the preset depth so as to obtain pressure welding holes of the PCB. According to the PCB manufacturing method and the PCB, wiring density can be improved, the wiring space of pressure welding pins can be enlarged, and the wiring capacity is enhanced.

The invention relates to a pre-packaged non-conductor platable lead frame packaging structure and a manufacturing method thereof. The structure comprises a metal circuit layer (1), wherein a metal pin layer (2) is arranged on the back face of the metal circuit layer (1); a first molding compound (3) is packaged on the periphery of the metal circuit layer (1) and the metal pin layer (2); a groove (4) is etched on the back face of the metal pin layer (2); a pre-plated copper layer (5) is arranged in the front face of the metal circuit layer (1); a surface treatment electroplated layer (6) is arranged in the front face of the pre-plated copper layer (5); a chip (7) is pasted on the surface treatment electroplated layer (6); a second molding compound (8) is packaged on the periphery of the pre-plated copper layer (5), the surface treatment electroplated layer (6) and the chip (7). The pre-packaged non-conductor platable lead frame packaging structure provided by the invention adopts a whole-surface pre-plated copper material as a base material so as to electroplate an electroplating area required to be processed on the surface of the metal circuit layer, and the redundant pre-plated copper material is etched after electroplating is finished, so that the non-conductor platable structure is realized, and high density, high reliability and an excellent performance of a lead frame are improved.

The invention discloses a display panel and a display device. The display panel is provided with a display area and a non-display area surrounding the display area, the display panel further comprisesa fan-out area and a driving chip, a datum line is preset below the driving chip, the datum line is parallel to one side edge, connected with the fan-out area, of the display area, and the side, awayfrom the fan-out area, of the non-display area is further provided with flat cable areas which are distributed on the two sides of the driving chip. The display panel further comprises a plurality ofbonding pads and wires. The bonding pads are distributed in the flat cable area and located on the two sides of the driving chip, each bonding pad is connected to the driving chip through a wire, andon each side of the driving chip, the heights of the bonding pads on the datum line are gradually increased in the direction from the position close to the driving chip to the position away from thedriving chip.

The invention relates to a railway vehicle control relay panel which comprises a main body framework, and primary panel assemblies and secondary panel assemblies which are arranged in the main body framework, wherein the main body framework comprises a panel surface mounting framework and a secondary panel mounting framework which protrudes out of the panel surface mounting framework; primary panels are arranged in the panel surface mounting framework; multiple groups of secondary panel assemblies perpendicular to the primary panels are arranged in parallel in the secondary panel mounting framework; the secondary panel assemblies and the primary panels are in circuit connection; and multiple first connectors used for outputting to the outside are arranged on the primary panels. According to the mounting structures of the secondary panels, the mounting strength is improved, the wiring space is widened, the arrangement number of relays is increased, the looseness faults of the secondary panels are reduced, the secondary panels are of double-plate structures, the double plates are enhanced by each other, and the strength of the secondary panels is improved.

The invention discloses a hard disk fixing device. The hard disk fixing device comprises a base, which comprises a base fixed on a mainboard and a first pair of elastic buckles which are vertical to the base and are arranged on two sides; a first supporting seat which comprises a main body and an extension part extending out of the main body, wherein the extension part can be clamped between first pair of elastic buckles, a first guide groove is formed in the main body, and a through hole is formed in the side surface of the main body and communicated with the first guide groove; a first adjusting buckle which comprises a sliding rod and a limiting rod connected with the sliding rod, wherein the limiting rod is aligned with a connector, used for being connected with a hard disk to be fixed, on the mainboard, and the sliding rod slides in the first guide groove so as to adjust the distance between the limiting rod and the connector; a locking piece which is arranged in the through hole and can abut against the sliding rod so as to lock the sliding rod. The invention further provides a server. According to the scheme, only the base needs to be fixed to the mainboard, and the number of holes in the mainboard is reduced.

The invention discloses a compact brushless electric power steering system (EPS) controller. The compact brushless EPS controller comprises a base, an upper cover and a PCB, a male buckle is arrangedon the surface of the upper cover, a female buckle is arranged on the surface of the base, and the upper cover and the base are connected in a clamped mode through the male buckle and the female buckle; four screw holes are formed in the surface of the base, four fixing holes are formed in the positions, corresponding to the screw holes, of the surface of the PCB, the PCB is fixedly mounted at thetop of the base through screws, and the surface of the base is fixedly connected with a power MOS tube; and a first connector and a second connector are fixedly connected to the bottom, close to thetwo sides, of the PCB correspondingly, and a motor driving module is further mounted on the upper surface of the PCB. According to the compact brushless EPS controller, the safety performance of the controller in the working process is improved, and the gate drive power MOS tube is further effectively protected. The larger PCB wiring space can be released in design, and the design and manufacturing costs are greatly lowered.