Pre-packaged non-conductor platable lead frame packaging structure and manufacturing method thereof
A technology of electroplating leads and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as affecting product life, increasing high-frequency signal emission and mutual coupling, and increasing signal loss. The effect of emission and mutual coupling, improving reliability level, and increasing wiring space
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[0058] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0059] see Figure 14 , 15 , a pre-encapsulated lead frame packaging structure without wires in this embodiment, which includes a metal circuit layer 1, a metal pin layer 2 is arranged on the back of the metal circuit layer 1, and the metal circuit layer 1 and the metal circuit layer 1 The outer periphery of the pin layer 2 is encapsulated with a first plastic encapsulant 3, the back side of the metal pin layer 2 is provided with an etching groove 4, and the front side of the metal circuit layer 1 is provided with a pre-plated copper layer 5, and the pre-plated copper layer 5. A surface treatment electroplating layer 6 is provided on the front side, and a chip 7 is mounted on the surface treatment electroplating layer 6, and a second plastic encapsulant 8 is encapsulated on the periphery of the pre-plated copper layer 5, the surface treatment...
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