Vertical interconnection design method for special-shaped cavity fuzz button assembly and tile type transmitting-receiving assembly

A design method and technology of sending and receiving components, applied in computer-aided design, computing, special data processing applications, etc., can solve problems such as the difficulty of vertical interconnection of multi-channel signals

Pending Publication Date: 2021-07-06
CNGC INST NO 206 OF CHINA ARMS IND GRP
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Problems solved by technology

[0005] Aiming at the problem of difficult vertical interconnection of multi-channel signals in tile-type transceiver components, the present invention proposes a design method for realizing vertical interconnection of interlayer signals based on special-shaped cavity button components

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  • Vertical interconnection design method for special-shaped cavity fuzz button assembly and tile type transmitting-receiving assembly
  • Vertical interconnection design method for special-shaped cavity fuzz button assembly and tile type transmitting-receiving assembly
  • Vertical interconnection design method for special-shaped cavity fuzz button assembly and tile type transmitting-receiving assembly

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0033] The invention proposes that the tile-type transceiver module adopts the arrangement form of L×L structure and realizes the stacking of three layers of circuit substrates, and arranges power circuits, digital circuits and radio frequency circuits on different levels, and each layer of circuit substrates is assembled in its own metal cavity. , The three-layer metal cavity is tightly and fixedly connecte...

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Abstract

The invention relates to a vertical interconnection design method for a special-shaped cavity fuzz button assembly and a tile type transmitting-receiving assembly, which can be applied to the design field of a two-dimensional active phased array radar transmitting-receiving assembly or a transmitting-receiving sub-array. In the design, a three-layer circuit substrate laminated structure is adopted to realize tile-type multi-channel transceiving assembly integration, and the tile-type multi-channel transceiving assembly has the characteristics of modularization, splicing, conformality, easiness in maintenance, low cost and the like, and is easier to integrate a system array. The vertical interconnection of multi-path radio frequency microwave signals and multi-path power supply signals between layers is realized by adopting the special-shaped cavity fuzz button assembly, the vertical interconnection of multiple power supplies and control signals between layers is realized by respectively adopting the multi-core fuzz button connector and the multi-core mixed fuzz button connector, welding is not needed, the signal transmission is stable and reliable, the connection mode is flexible and convenient, and the expandability is strong.

Description

technical field [0001] The invention relates to the field of radar technology, in particular to a design method for vertical interconnection of special-shaped cavity fur button components and tile-type transceiver components, which can be applied to the design field of two-dimensional active phased array radar transceiver components or transceiver sub-arrays. Background technique [0002] With the development of miniaturization of phased array radar systems, the tile-type transceiver components developed on the basis of three-dimensional high-density integration technology have the advantages of small size, light weight, and high integration, which are incomparable compared with brick-type transceiver components. Compared with other advantages, its 3D mode greatly reduces the volume and weight of the system, which can realize modularization, splicing, conformal, easy maintenance, low cost, and easier system array integration. The tile-type transceiver module adopts a three-d...

Claims

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Application Information

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IPC IPC(8): G06F30/3953
CPCG06F30/3953
Inventor 崔敏雷国忠王洁
Owner CNGC INST NO 206 OF CHINA ARMS IND GRP
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