Substrate structure and manufacturing method therefor
A manufacturing method and substrate technology, which are used in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., can solve the problem of increasing the connection path between electronic components and substrates, unable to meet the requirements of fine circuit wiring, and poor electrical characteristics of the substrate structure, etc. problem, to achieve the effect of combining rigidity, reduced substrate size, and high heat dissipation
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[0077] The content of the present invention will be explained by the following examples. The examples of the present invention are not intended to limit the present invention to be implemented in any specific environment, application or special method as described in the examples. Therefore, the descriptions about the embodiments are only used to illustrate the purpose of the present invention, not to limit the protection scope of the present invention. It should be noted that in the following embodiments and drawings, components not directly related to the present invention have been omitted and not shown; and the dimensional relationship between the components in the drawings is only for easy understanding, and is not used to limit the actual scale .
[0078] The first embodiment of the present invention is as figure 1 , figure 2 as well as image 3 shown. figure 1 is a schematic diagram of a substrate structure 1; figure 2 is a partial schematic diagram of the subs...
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