47results about How to "Improve caulking ability" patented technology

The invention discloses a high-reliability cathode component for a vacuum electron device, wherein the ruthenium-vanadium binary alloy high-temperature cored solder taking refractory metal tungsten and molybdenum as base materials consists of the following materials in weight percentage: 23 to 40 percent of vanadium, and the balance being ruthenium and inevitable micro impurities; and the contents of Zn, Pb, Bi and Mg elements in the micro impurities are no more than 0.001 percent respectively. The cored solder can be used to braze-solder refractory metal w, Mo and alloy of w or Mo in the H2 or Ar gas atmosphere or in a vacuum state, the cored solder does not absorb hydrogen, can spread over base metal, and has good wettability; the wet angle is less than 10 degrees; and when a soldering piece is soldered under the vacuum working condition with a temperature of between 1,000 and 1,200 DEG C, the vapor pressure of the cored solder is lower than 1x10<-5>Pa; moreover, the cored solder islow in price, and is the first choice of solder replacing the Pt and Pt-based solder for the braze solder of the cathode component for the vacuum electron device, and the melting temperature of the cored solder is between 1,750 and 1,850 DEG C.

The invention discloses a fluorine-containing resin prepreg and a circuit substrate using the same. The fluorine-containing resin prepreg comprises the following components in parts by weight: 100 parts of fluorine-containing resin and 20 to 110 parts of inorganic filler, the fluorine-containing resin includes polytetrafluoroethylene (PTFE) at a weight percentage concentration of 10% to 80%, a perfluoroethylene propylene copolymer (FEP) at a weight percentage concentration of 10% to 50%, and a tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer (PFA) at a weight percentage concentration of 0.1% to 40%. The circuit substrate comprises a fluorine-containing resin substrate and a circuit layer formed on the fluorine-containing resin substrate. The fluororesin prepreg and the circuit substrate using the same disclosed by the invention can improve the gummosis property and the caulking property of the fluororesin prepreg during pressing, so that the fluororesin prepreg is suitable for manufacturing a high-frequency circuit substrate.

The invention discloses a variable-scale boron-nitrogen graphene modified layer brazing filler metal. The brazing filler metal comprises a variable-scale modified layer composed of a boron-nitrogen graphene reinforced alloy layer which is formed in an upper surface layer, a brazing filler metal layer which is formed in a middle layer and a boron-nitrogen graphene coated foam metal layer which is formed in the lower surface layer, and the preparation method comprises the following steps that a silver brazing material sheet or a gold brazing filler metal sheet is selected, firstly, a boron-nitrogen graphene reinforced nickel-based alloy is sputtered on the upper surface of the brazing filler metal sheet, wherein the nickel-based alloy is a binary or ternary nickel-based alloy consisting of nickel, palladium, gold and copper, then a boron-nitrogen graphene coated foam metal layer is subjected to vapor deposition on the lower surface of the brazing filler sheet, wherein the foam metal is binary nickel-based alloy consisting of nickel-chromium, nickel-gold, nickel-silver or nickel-copper; and the prepared modified layer brazing filler metal can be used for connection of high-nitrogen steel and high-strength steel, the tensile strength of the high-nitrogen steel and the high-strength steel subjected to braze connection is not lower than 500 MPa. The brazing filler metal prepared through the method has a variable-scale layer and can generate a nano-scale effect, so that the mechanical property of the brazing filler metal can be synergistically enhanced, and the welding strength ofthe high-strength steel and the high-nitrogen steel can be improved.