Low-silver-copper-phosphorus brazing material containing trace indium

Abstract

The invention relates to a low-silver-copper-phosphorus brazing material containing trace indium. The low-silver-copper-phosphorus brazing material is characterized by comprising the following components in percentage by weight: 1.0-3.0% of silver, 6.7-8% of phosphorus, 0.05-0.2% of indium, 0.01-0.05% of mixed rare earth and the balance of copper, wherein the melting temperature range of the brazing material is 600-780 DEG C. The low-silver-copper-phosphorus brazing material has the advantages that the low-silver-copper-phosphorus brazing material can be used for replacing a BCu80AgP copper-based brazing material during brazing copper alloys, the content of the silver is reduced, the low-silver-copper-phosphorus brazing material has appropriate spreadability and liquidity, the low-silver-copper-phosphorus brazing material has appropriate liquidity during brazing copper and copper alloys, the brazing process is high in performance, stable in quality and smooth in surface, the technique performance index is equivalent to that of the Bag15CuP copper-based brazing material, and the brazing material can be prepared into various forms such as filaments, rings and strips by improving the molding technique.

Description

technical field [0001] The invention relates to a low-silver copper-phosphorus solder containing a small amount of indium, which is suitable for brazing between copper and copper alloys, and belongs to a medium-temperature brazing material. Background technique [0002] In recent years, due to the overall increase in the price of precious metal raw materials, and to save the limited domestic precious metal materials, it has become a major development direction of the industry to develop new solder with lower silver content to replace conventional solder with higher silver content. [0003] Copper-based solders such as BCu80AgP (15% silver content) are commonly used in the brazing of copper and copper alloys in the refrigeration industry. However, due to their excessive fluidity on the surface of the base metal in the molten state, it is easy to cause the solder to overflow and affect the appearance or even Cause welding workpiece unqualified and cause material waste. Conte...

AI Technical Summary

Problems solved by technology

[0003] Copper-based solders such as BCu80AgP (15% silver content) are commonly used in the brazing of copper and copper alloys in the refrigeration industry. However, due to their excessive fluidity on the surface of the base metal in the molten state, it is easy to cause the solder to overflow and affect the appearance or even Resulting in unqualified welding workpieces and waste of materials