572results about How to "Large grain" patented technology

A highly-oriented diamond film which has a flat surface but does not have non-oriented crystals in the surface can be provided by depositing a first diamond layer on a substrate by {111} sector growth of diamond crystals by a CVD method using a gaseous mixture of methane and hydrogen as material gas, and then depositing a second diamond layer on the first diamond layer by {100} sector growth of diamond crystals by a plasma CVD method using a gaseous mixture of methane, hydrogen, and oxygen as material gas under the conditions that the pressure of the material gas is 133 hPa or more; the material gas composition is determined such that ([C]−[O]) / [CH3+H2+O2] is −0.2×10−2 or more and [O] / [C] is 1.2 or less; and the substrate temperature is between 750° C. and 1000° C.

To provide a laser apparatus and a laser annealing method with which a crystalline semiconductor film with a larger crystal grain size is obtained and which are low in their running cost. A solid state laser easy to maintenance and high in durability is used as a laser, and laser light emitted therefrom is linearized to increase the throughput and to reduce the production cost as a whole. Further, both the front side and the back side of an amorphous semiconductor film is irradiated with such laser light to obtain the crystalline semiconductor film with a larger crystal grain size.

A method for fabricating a thin film solar cell includes providing a soda lime glass substrate comprising a surface region and a concentration of sodium oxide of greater than about 10 wt % and treating the surface region with one or more cleaning process, using a deionized water rinse, to remove surface contaminants having a particles size of greater than three microns. The method also includes forming a barrier layer overlying the surface region, forming a first molybdenum layer in tensile configuration overlying the barrier layer, and forming a second molybdenum layer in compressive configuration using a second process overlying the first molybdenum layer. Additionally, the method includes patterning the first molybdenum layer and the second molybdenum layer to form a lower electrode layer and forming a layer of photovoltaic material overlying the lower electrode layer. Moreover, the method includes forming a first zinc oxide layer overlying the layer of photovoltaic materials.

A method of fabricating polysilicon film is described. An amorphous silicon layer is formed on the substrate, an optical layer is formed on the amorphous silicon layer, wherein the optical has a first region having a first thickness and a second region having a second thickness, and the reflectivity of the first region for an excimer laser is higher than that of the second region. A laser annealing process is then preformed to transform the amorphous silicon layer into a polysilicon film.

A method for fabricating a thin film solar cell includes providing a soda lime glass substrate comprising a surface region and a concentration of sodium oxide of greater than about 10 wt % and treating the surface region with one or more cleaning process, using a deionized water rinse, to remove surface contaminants having a particles size of greater than three microns. The method also includes forming a barrier layer overlying the surface region, forming a first molybdenum layer in tensile configuration overlying the barrier layer, and forming a second molybdenum layer in compressive configuration using a second process overlying the first molybdenum layer. Additionally, the method includes patterning the first molybdenum layer and the second molybdenum layer to form a lower electrode layer and forming a layer of photovoltaic material overlying the lower electrode layer. Moreover, the method includes forming a first zinc oxide layer overlying the layer of photovoltaic materials.

Disclosed is a thin film transistor which includes, over a substrate having an insulating surface, a gate insulating layer covering a gate electrode; a semiconductor layer which functions as a channel formation region; and a semiconductor layer including an impurity element imparting one conductivity type. The semiconductor layer exists in a state that a plurality of crystalline particles is dispersed in an amorphous silicon and that the crystalline particles have an inverted conical or inverted pyramidal shape. The crystalline particles grow approximately radially in a direction in which the semiconductor layer is deposited. Vertexes of the inverted conical or inverted pyramidal crystal particles are located apart from an interface between the gate insulating layer and the semiconductor layer.

A crystallizing method of causing a phase shifter to phase-modulate a laser beam whose wavelength is 248 nm or 300 nm or more from an excimer laser unit into a laser beam with a light intensity profile having a plurality of inverted triangular peak patterns in cross section and of irradiating the pulse laser beam onto a substrate to be crystallized for crystallization. The substrate to be crystallized is such that one or more silicon oxide films which present absorption properties to the laser beam and differ in the relative proportions of Si and O are provided on a laser beam incident face.

The invention relates to the technical field of polysilicon ingot furnace designing and manufacturing, and aims to provide a follow-up heat insulation ring thermal field structure for the vertical oriented growth of polysilicon. The thermal field structure comprises a furnace chamber with a side surface enclosed heat insulation cage body, a crucible and a thermal field are arranged in the heat insulation cage body, and the upper end of the heat insulation cage body is connected with a lifting device; the upper part and the lower part of the heat insulation cage body are respectively provided with a top heat insulation board and a lower heat insulation body, wherein the top heat insulation board is fixedly suspended on an electrode, the lower heat insulation board and a heat exchange are fixed on a support column, the top heat insulation board and the upper end of the heat insulation cage body are movably connected, and the lower heat insulation board and the lower end of the heat insulation cage body are movably connected; and a circular follow-up heat insulation ring is fixed in the heat insulation cage body through a plurality of connecting devices. The follow-up heat insulation ring thermal field structure for the vertical oriented growth of polysilicon has reasonable design, can increase the grain size of polysilicon, reduce grain boundary and improve the verticality of the growing direction of polysilicon so as to improve the quality of polysilicon ingots, and simultaneously the follow-up heat insulation ring also plays the role of energy consumption reduction.

The invention relates to a method for improving mechanical properties of an aramid fiber in a supercritical fluid through stretching orientation. A supercritical carbon dioxide fluid is utilized for partially destroying interaction of a PPTA (poly-p-phenylene terephthamide) molecular chain in the aramid fiber under the action of certain tension, and the molecular chain is further oriented, so that the aramid fiber with good properties is obtained. The method for improving the mechanical properties of the aramid fiber in the supercritical fluid through stretching orientation mainly comprises the following steps: ensuring that the aramide fiber maintains certain tension in a closed container, introducing CO2 into the container at a certain temperature, so that the internal space of the closed container is in a supercritical CO2 state, carrying out swelling reaction for a period of time, and slowly releasing pressure, thus the highly stretching-oriented aramid fiber is obtained. The method for improving the mechanical properties of the aramid fiber in the supercritical fluid through stretching orientation guarantees that the aramid fiber is in a stretched state in a reaction process, so that orientation degree and crystallinity of a molecular chain are increased while stretching tension is changed, crystal particles are largened, and crystals are more and more complete.

A method and an apparatus for controlling a grain size of a component generated using an additive manufacturing process. Construct a first fused layer of the component by fusing a plurality of layers of a fusible material, wherein the first fused layer has a thickness T1. Thereafter, introduce stress through the first fused layer of the component. The component is generated by repeating the aforementioned steps. Further, the component is heated to a temperature above a recrystallization start temperature (Rxst) to control the grain size of the component.

The invention provides a display device having a thin film transistor and a storage capacitor storing a display signal applied to a pixel electrode through this thin film transistor on a substrate, where dielectric strength between electrodes forming the storage capacitor is enhanced for increasing the yield. In the storage capacitor, a lower storage capacitor electrode, a thin lower storage capacitor film, a polysilicon layer, an upper storage capacitor film and an upper storage capacitor electrode are layered. The polysilicon layer is formed by crystallization by laser annealing. The polysilicon layer of the storage capacitor is microcrystalline and thus the flatness of its surface is enhanced. The pattern of the polysilicon layer (storage capacitor electrode) is formed larger than the bottom portion of an opening, and the edge of its peripheral portion is located on a buffer film on the slant portion of the opening or on the buffer film on the outside of the opening.