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2273 results about "Flash-lamp" patented technology

The electric flash-lamp uses electric current to start flash powder burning, to provide a brief sudden burst of bright light. It was principally used for flash photography in the early 20th century but had other uses as well. Previously, photographers' flash powder, introduced in 1887 by Adolf Miethe and Johannes Gaedicke, had to be ignited manually, exposing the user to greater risk.

Semiconductor thin film forming method, production methods for semiconductor device and electrooptical device, devices used for these methods, and semiconductor device and electrooptical device

An object of the present invention is to provide a method for easily forming a polycrystalline semiconductor thin-film, such as polycrystalline silicon having high crystallinity and high quality, or a single crystalline semiconductor thin-film at inexpensive cost, the crystalline semiconductor thin-film having a large area, and to provide an apparatus for processing the method described above. In forming a polycrystalline (or single crystalline) semiconductor thin-film (7), such as a polycrystalline silicon thin-film, having high crystallinity and a large grain size on a substrate (1), or in forming a semiconductor device having the polycrystalline (or single crystalline) semiconductor thin-film (7) on the substrate (1), a method comprises forming a low-crystallization semiconductor thin-film (7A) on the substrate (1), and subsequently heating and cooling this low-crystallization semiconductor thin-film (7A) to a fusion, a semi-fusion, or a non-fusion state by flash lamp annealing to facilitate the crystallization of the low-crystallization semiconductor thin-film, whereby a polycrystalline (single crystalline) semiconductor thin-film (7) is obtained. A method for forming the semiconductor device and an apparatus for processing the methods are also disclosed.
Owner:SONY CORP

Semiconductor thin film forming method, production methods for semiconductor device and electrooptical device, devices used for these methods, and semiconductor device and electrooptical device

An object of the present invention is to provide a method for easily forming a polycrystalline semiconductor thin-film, such as polycrystalline silicon having high crystallinity and high quality, or a single crystalline semiconductor thin-film at inexpensive cost, the crystalline semiconductor thin-film having a large area, and to provide an apparatus for processing the method described above. In forming a polycrystalline (or single crystalline) semiconductor thin-film (7), such as a polycrystalline silicon thin-film, having high crystallinity and a large grain size on a substrate (1), or in forming a semiconductor device having the polycrystalline (or single crystalline) semiconductor thin-film (7) on the substrate (1), a method comprises forming a low-crystallization semiconductor thin-film (7A) on the substrate (1), and subsequently heating and cooling this low-crystallization semiconductor thin-film (7A) to a fusion, a semi-fusion, or a non-fusion state by flash lamp annealing to facilitate the crystallization of the low-crystallization semiconductor thin-film, whereby a polycrystalline (single crystalline) semiconductor thin-film (7) is obtained. A method for forming the semiconductor device and an apparatus for processing the methods are also disclosed.
Owner:SONY CORP

Thermal processing apparatus for substrate employing photoirradiation

A lamp house storing a plurality of flash lamps and a chamber storing and holding a semiconductor wafer are fitted to each other in an openable / closable manner. The lamp house and the chamber are fixed to a closed state with male screws. In order to process a semiconductor wafer, a shutter plate is drawn out to open an irradiation window. In this state, the shutter plate shields a space located above the male screws so that the male screws cannot be detached for opening the lamp house and the chamber. In order to open the lamp house and the chamber, the shutter plate must be inserted for shielding the irradiation window while opening the space located above the male screws. Thus, a thermal processing apparatus capable of preventing the lamps from breaking during maintenance thereof is provided.
Owner:DAINIPPON SCREEN MTG CO LTD

Control of a flash unit in a digital camera

The invention is based on a method for controlling a flashlight in connection with a digital image sensor without a mechanical shutter, wherein the exposure of the image sensor is performed in sub-areas, such as pixel rows or columns, or in another order, by using a rolling electronic shutter or the like. Thus, the exposure of said sub-areas of the image sensor takes place at least partly at different times. According to the invention, during the time of exposure of one image, i.e. substantially all the sub-areas of the image sensor, several discrete, successive flashes of the flashlight are used to achieve even exposure of the image area, which the flashes are timed in such a way that each single flash is triggered at a point of time which is common to the integration or exposure time of as many successive sub-areas of the image sensor as possible. According to the invention, the successive light flashes are also timed in such a way that one and only one flash of the flashlight occurs during the integration or exposure time of each single sub-area. By the present invention, the significant advantage is attained that the invention minimizes the number of light flashes required for one image while it also secures that each sub-area of the sensor to be exposed at a different time is illuminated as evenly as possible.
Owner:NOKIA TECHNOLOGLES OY

Optical closed-loop control system for a CMP apparatus and method of manufacture thereof

For use with a chemical mechanical polishing apparatus for polishing a semiconductor wafer having a platen, a polishing pad and a wafer carrier, an optical closed-loop control system. In one embodiment, the system includes a plurality of optical probes impacting a corresponding probe window and rigidly mountable through the platen. The system also includes a flash lamp configured to provide light to each of the plurality of optical probes and minimize an exposure time of the light onto the semiconductor wafer, a spectrograph configured to spatially image light received by each of the plurality of optical probes to a common charge-coupled device and produce real-time spectral reflectometry data therefrom. The system further includes a control subsystem configured to analyze the real-time spectral reflectometry data and determine at least one wafer state parameter therefrom, and cause the polishing to be adjusted based upon the at least one wafer state parameter.
Owner:VERITY INSTR

Heat treatment apparatus for heating substrate by exposing substrate to flash light

A semiconductor wafer to be treated is placed in a horizontal position on a holding plate held by a susceptor. Six bumps are mounted upright on the upper surface of the holding plate. The semiconductor wafer is supported by the six bumps in point contacting relationship, and is held at a distance ranging from 0.5 mm to 3 mm from the upper surface of the holding plate. Light is directed from halogen lamps onto the semiconductor wafer held by the holding plate to preheat the substrate until the temperature of the semiconductor wafer is increased up to a predetermined temperature. Thereafter, flash light is directed from flash lamps onto the semiconductor wafer. A thin gas layer lying between the back surface of the semiconductor wafer and the upper surface of the holding plate acts as a resistance to suppress the motion of the semiconductor wafer, thereby preventing a crack in the semiconductor wafer.
Owner:DAINIPPON SCREEN MTG CO LTD

Pulse train annealing method and apparatus

The present invention generally describes apparatuses and methods used to perform an annealing process on desired regions of a substrate. In one embodiment, pulses of electromagnetic energy are delivered to a substrate using a flash lamp or laser apparatus. The pulses may be from about 1 nsec to about 10 msec long, and each pulse has less energy than that required to melt the substrate material. The interval between pulses is generally long enough to allow the energy imparted by each pulse to dissipate completely. Thus, each pulse completes a micro-anneal cycle. The pulses may be delivered to the entire substrate at once, or to portions of the substrate at a time. Further embodiments provide an apparatus for powering a radiation assembly, and apparatuses for detecting the effect of pulses on a substrate.
Owner:APPLIED MATERIALS INC

Touch screen mobile terminal and quick illumination-starting method and quick illumination-starting system thereof

The invention provides a quick illumination-starting method and a quick illumination-starting system for touch screen mobile terminals and a touch screen mobile terminal, wherein the method includes the following steps: the touch screen mobile terminal receives the first key operation of an entity key by a user under a screen-locked state; the touch screen mobile terminal judges whether the duration of the first key operation exceeds a predetermined threshold value; if so, whether the touch screen mobile terminal supports a flash lamp is further judged; if so, then the touch screen mobile terminal switches on the flash lamp for illumination; and if not, then the touch screen mobile terminal lights up the screen for illumination. According to the method of the embodiment of the invention, the flash lamp can be switched on or the screen can be lit up without requiring the unlocking of the screen and the starting of an illumination control program as long as the entity key is pressed for a while, so that the operation process is simplified, consequently, the time of illumination starting by the user is saved, moreover, operation is convenient and quick, and the experience of users is good.
Owner:BEIJING BAIDU NETCOM SCI & TECH CO LTD
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