The invention relates to a half-
cut liquid crystal film and a
processing method, the half-
cut liquid crystal film comprises a first substrate, a first conductive layer, a
liquid crystal layer, a second conductive layer and a second substrate, and the half-
cut liquid
crystal film is characterized in that a half-cut line formed by half
cutting is arranged at a preset distance in the edge of the liquid
crystal film, and the half-cut line at least penetrates into one of the first conductive layer and the second conductive layer. According to the invention, through half-
cutting, the two internal conductive
layers are not conducted; accordingly, during full
cutting, even if the conductive layer in the outermost edge is adhered, the electrical property of the whole liquid
crystal film cannot be invalid; thus, in the
machining process, during full cutting, a smooth outer tangent plane without
slag falling can be obtained by utilizing the cutting
advantage of the CO2
laser; during half-cutting,the
electrical performance failure of the liquid crystal film can be avoided by utilizing the advantages of
ultraviolet cutting, so that all the advantages of
ultraviolet cutting and CO2
laser cutting in the prior art can be combined, the defects of
ultraviolet cutting and CO2
laser cutting can be eliminated, and a required product can be obtained.