The invention discloses a method for manufacturing a transparent flexible multilayer PCB. The method comprises steps of: subjecting a transparent flexible substrate to hydrophilic treatment, dispersing silver nanowires in a silver nanowire solvent to form silver nanowire ink, drawing a wiring pattern on the surface of the transparent flexible substrate by using the silver nanowire ink, drying thewiring pattern, stacking a plurality of transparent flexible substrates on which wiring patterns are drawn, applying pressure to the stacked transparent flexible substrates by using ultrasonic, and pasting the stacked transparent flexible substrates together to obtain the transparent and flexible multilayer PCB. Since the transparent flexible substrate is transparent and flexible, the transparentflexible multilayer PCB is transparent, less likely to deform or fracture. Since the silver nanowires have low surface resistance, the PCB has low square resistance. The manufacturing method is simple, can easily use a roll-to-roll industrialized continuous production method, improves the production efficiency and facilitates transportation.