Method and system for automatically regulating etching line speed

Abstract

The invention discloses a method and a system for automatically regulating an etching line speed. The method comprises the following steps: measuring a copper thickness value of a circuit board at a board inlet of etching equipment by copper thickness detection equipment; according to the copper thickness value, inquiring a preset line speed table to obtain a corresponding linear function, wherein a plurality of copper thickness ranges and linear functions corresponding to the copper thickness ranges are preset in the preset line speed table; according to a preset line width D and the linear function, calculating to obtain an etching line speed value; according to the etching line speed value, regulating a transmission speed of the etching equipment and carrying out etching processing on the circuit board. According to the method for automatically regulating the etching line speed, the preset line speed table can be inquired according to the copper thickness value to obtain the corresponding linear function and then calculation is carried out by the preset line width D and the linear function obtained by inquiry to obtain the etching line speed so as to correspondingly regulate the transmission speed of the etching equipment to enable the line width to accord with the requirement of the preset line width D after etching, and thus, line width accuracy of the etched circuit board can be improved. Moreover, the regulating efficiency is also high.

Description

technical field [0001] The invention relates to the field of circuit board electroplating, in particular to an automatic adjustment method and system for etching line speed. Background technique [0002] In the circuit board industry, the preparation process of circuit boards mainly includes the following processes: copper clad laminate cutting, drilling and cleaning in holes, pasting photosensitive film, exposure, development, etching, film removal, stacking, lamination, drilling, cleaning and drilling Dirt and copper plating. [0003] The etching process is located between the development process and the film removal process. It is a key step in forming a copper map on the circuit board, that is, forming a circuit. The principle of the etching process is to use an etching solution to etch away the copper layer on the circuit board that is not covered with a protective film. , and the copper layer covered by the protective film will form the wiring of the circuit board. ...

AI Technical Summary

Problems solved by technology

[0008] However, the above traditional methods are not only time-consuming and labor-intensive, but also not accurate enough

In addition, when the desired line width of the circuit board needs to be adjusted, the above test operation must be repeated

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