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Manufacturing method of LED heat radiating substrate and LED module with substrate

A technology of a heat dissipation substrate and a manufacturing method, which is applied to the removal of conductive materials by chemical/electrolytic methods, circuit thermal devices, and printed circuit manufacturing, etc. Small and other problems, to achieve the effect of small thickness, conducive to heat conduction and prolonging service life

Inactive Publication Date: 2015-02-04
THERMAL GROUP TECH HUIZHOU +2
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Problems solved by technology

However, the heat dissipation problem of LEDs has always restricted the development of the LED industry. The heat generated during the LED lighting process will lead to a decrease in the output light intensity of the LED and a shift in its dominant wavelength.
In addition, the heat dissipation of the LED package is not good, the junction temperature is high, and the life is short

Method used

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  • Manufacturing method of LED heat radiating substrate and LED module with substrate

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Embodiment Construction

[0020] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0021] Such as figure 1 As shown, the LED cooling module described in this embodiment includes an LED lamp bead 1 , a lens 2 , a circuit board 3 and a heat sink 4 . A plurality of LED lamp beads 1 are welded on one side of the circuit board 3, and the LED lamp beads are covered with a lens 2; the heat sink 4 is arranged on the other side of the circuit board, and is closely combined with this side of the circuit board to realize heat dissipation.

[0022] In this embodiment, the circuit board is mainly used to quickly conduct the heat generated when the LED emits light to the heat sink, and then dissipate it through the heat sink, so as to reduce the junction temperature of the LED as quickly as possible and prolong its service life. The production of the circuit board adopts a...

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Abstract

The invention relates to a manufacturing method of an LED heat radiating substrate and an LED module with the substrate. The manufacturing method of the LED heat radiating substrate comprises the following steps: (1) forming an insulating layer at the surface of an aluminum substrate through an anodic oxidation way, (2) forming a layer of ink opposite to a needed circuit diagram on the insulating layer by using screen printing technology, (3) drying the ink and then carrying out sputtering on the ink to form a metal layer, and (4) cleaning and removing the ink by using an organic solvent such that a metal layer film deposited at the surface of the ink falls and the remaining metal circuit is the needed circuit. The LED heat radiating module comprises an LED bulb, a circuit board which carries the LED bulb and a lens which covers the LED bulb. The insulating layer is in the shape of a honeycomb. According to the heat radiating module, a special heat radiating substrate is used, combined with the special structural design, the heat radiating efficiency is high, and the service life is long.

Description

technical field [0001] The invention relates to the technical field of LED heat dissipation. Background technique [0002] LED is a semiconductor that can convert electrical energy into visible light. It has low energy consumption and has many advantages such as long life, high luminous efficiency, and no radiation. Therefore, as a new generation of lighting products, LED has great potential for development. However, the heat dissipation problem of LEDs has always restricted the development of the LED industry. The heat generated during the LED lighting process will reduce the output light intensity of the LEDs and cause the dominant wavelength to shift. In addition, the heat dissipation of the LED package is not good, the junction temperature is high, and the life is short. Contents of the invention [0003] The problem to be solved by the present invention is to provide a method for manufacturing an LED heat dissipation substrate with good heat dissipation performance ...

Claims

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Application Information

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IPC IPC(8): H05K3/06F21V29/503F21Y101/02
CPCH05K3/067F21Y2101/00H05K1/0209H05K2203/0502
Inventor 魏晓慧谭弘平邓中应姜文新
Owner THERMAL GROUP TECH HUIZHOU
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