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Ceramic package substrate manufacturing method and ceramic package substrate

A technology for ceramic substrates and ceramic packaging, applied in the field of ceramic packaging substrates and ceramic packaging substrates, can solve the problems of many equipment requirements, complex processes, expensive costs, etc., and achieve the effect of streamlining the process flow, reducing costs, and improving production efficiency.

Inactive Publication Date: 2017-05-31
江苏华功第三代半导体产业技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of this, the present invention proposes a method for manufacturing a ceramic packaging substrate and a ceramic packaging substrate to solve the problems in the prior art of complex processes, high equipment requirements and high costs.

Method used

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  • Ceramic package substrate manufacturing method and ceramic package substrate
  • Ceramic package substrate manufacturing method and ceramic package substrate
  • Ceramic package substrate manufacturing method and ceramic package substrate

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Embodiment 1

[0035] figure 1 It is a schematic flow chart of a manufacturing method of a ceramic package substrate provided in Embodiment 1 of the present invention. The manufacturing method of the ceramic packaging substrate in this embodiment can be used for the ceramic packaging substrate, meeting the increasingly stringent packaging requirements of the ceramic packaging substrate in the field of high-power, multi-chip device packaging.

[0036] The manufacturing method of the ceramic packaging substrate provided in this embodiment includes:

[0037] S110, fabricating a conductive film layer on the pretreated ceramic substrate.

[0038] Exemplarily, the pretreatment of the ceramic substrate includes at least one of surface microetching roughening, acid-base treatment, or ultrasonic cleaning. The ceramic substrate is pretreated by the above method, and then put into an oven for drying to remove the ceramic substrate. Impurities and dirt on the substrate surface. Nitrogen protection or...

Embodiment 2

[0049] On the basis of the above embodiments, in the manufacturing method of the ceramic packaging substrate provided in this embodiment, the conductive film layer is a metal conductive film layer, and the mask layer is ink. The manufacturing method of the ceramic packaging substrate will be described below according to the steps of the process flow. figure 2 It is a side structural view of a ceramic substrate covered with a metal conductive film layer and a mask layer in sequence provided by Embodiment 2 of the present invention. Such as figure 2 As shown, the typical size of the ceramic substrate 210 is 114.3 mm in length, 114.3 mm in width, and 0.38 mm in thickness, and other sizes can also be selected.

[0050] The surface of the ceramic substrate 210 is treated, including micro-etching and roughening of the surface, acid-base treatment and ultrasonic cleaning, and then placed in an oven for drying. The oven is preferably nitrogen protection or a vacuum oven, and the dr...

Embodiment 3

[0059] On the basis of the above embodiments, in the manufacturing method of the ceramic packaging substrate provided in this embodiment, the conductive film layer is an organic conductive film layer, and the mask layer is ink. The manufacturing method of the ceramic packaging substrate will be described below according to the steps of the process flow. Figure 5 A side structure diagram of a ceramic substrate covered with an organic conductive film layer and a mask layer in sequence provided by Embodiment 3 of the present invention. Such as Figure 5 As shown, the typical size of the ceramic substrate 310 is 114.3 mm in length, 114.3 mm in width, and 0.38 mm in thickness, and other sizes can also be selected.

[0060] The surface of the ceramic substrate 310 is treated, including surface micro-etching roughening, acid-base treatment and ultrasonic cleaning, and then put into an oven for drying. The oven is preferably nitrogen protection or a vacuum oven, and the drying tempe...

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Abstract

The embodiments of the invention disclose a ceramic package substrate manufacturing method and a ceramic package substrate. The method comprises the following steps: making a conductive film layer on a pretreated ceramic substrate; making a mask layer on the conductive film layer; patterning the mask layer and the conductive film layer according to a preset circuit pattern to get a patterned circuit base layer; panel-plating the patterned circuit base layer, and thickening the metal film layer of the circuit base layer; and removing the non-patterned parts of the conductive film layer and the mask layer. The ceramic package substrate manufacturing process is more optimized, the procedures are simpler, and the cost input is lower.

Description

technical field [0001] The invention relates to the field of ceramic substrates, in particular to a method for manufacturing a ceramic packaging substrate and the ceramic packaging substrate. Background technique [0002] With the development of a new generation of high-power electronic power devices such as multi-chip highly integrated devices, high-power semiconductor devices, and laser diode components, the heat generated by high-power devices is also increasing, and the heat dissipation problem is becoming more and more important. Therefore, choosing a packaging material with high thermal conductivity, high resistivity and low expansion coefficient is the key element to solve the packaging of high-power devices. Aluminum nitride (AlN) ceramics have ideal comprehensive advantages such as high thermal conductivity, linear expansion coefficient matching with conventional chips (such as LED chips), and good insulation, which can well meet the requirements of high-power chips...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/18
CPCH05K3/061H05K3/188H05K2203/0502
Inventor 李顺峰
Owner 江苏华功第三代半导体产业技术研究院有限公司
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