The invention relates to the technical field of curing agents, in particular to a polyamide epoxy resin curing agent. The polyamide epoxy resin curing agent is prepared from, by weight, 40-45 parts of dimer acid, 20-30 parts of binary acid, 1-10 parts of momomer acid, 6.5-10 parts of quadrol, 5-10 parts of long-chain polyether amine, 10-15 parts of diethylenetriamine, 10-15 parts of triethylene tetramine, 5-10 parts of tetraethylenepentamine, 1-10 parts of 1,4-cyclohexanediamine and 5-10 parts of aromatic diamine. Compared with the prior art, the polyamide epoxy resin curing agent is prepared through the steps that acid and amine are subjected to a polymerization reaction to prepare amide and regarded as a reaction system, and 1,4-cyclohexanediamine is added into the reaction system, and the polyamide epoxy resin curing agent modified by 1,4-cyclohexanediamine has the excellent low-temperature resistance, and is quite good in obtained flexibility and toughness, moderate in hardness and high in curing speed.