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Thiourea modified polyamide epoxy curing agent and preparation method

A technology of polyamide epoxy and polyamide, applied in epoxy resin coatings, coatings, anti-corrosion coatings, etc., can solve the problems of poor chemical resistance, easy whitening of the surface, hindering applications, etc., and achieve superior performance, durability Good corrosion and chemical resistance, excellent toughness

Inactive Publication Date: 2017-08-01
江苏三木化工股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while pursuing low-temperature curing, this type of product sacrifices some other properties, such as easy moisture absorption, easy whitening of the surface, brittle paint film, and poor chemical resistance.
These shortcomings hinder the application of such products in the field of anti-corrosion coatings

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1, a kind of preparation method of the polyamide epoxy curing agent of thiourea modification, it may further comprise the steps:

[0026] (1) Add 100 parts by weight of dimer acid and 5 parts by weight of oleic acid in the reaction bottle, vacuumize to remove oxygen, and then fill with nitrogen to a slight positive pressure. Stirring under the protection of nitrogen, the temperature was raised to 90°C, and then 70 parts by weight of tetraethylenepentamine was slowly added dropwise, and the temperature was continued to be raised to 160°C for 3 hours. Then continue to slowly and uniformly raise the temperature, raise the temperature to 250°C in 3 hours, and react at 250°C for 2 hours to obtain 165 parts by weight of polyamide;

[0027] (2) After the reaction, stop heating, cool to 120°C, add 25 parts by weight of thiourea to the reaction flask and keep stirring at 120°C for 3 hours to obtain thiourea-modified polyamide epoxy curing agent 1.

[0028] 2. Performance testin...

Embodiment 2

[0033] 1, a kind of preparation method of the polyamide epoxy curing agent of thiourea modification, it may further comprise the steps:

[0034] (1) Add 100 parts by weight of dimer acid and 5 parts by weight of oleic acid in the reaction bottle, vacuumize to remove oxygen, and then fill with nitrogen to a slight positive pressure. Stirring under nitrogen protection, the temperature was raised to 90°C, and then 70 parts by weight of triethylenetetramine was slowly added dropwise, and the temperature was continued to be raised to 150°C for 2 hours. Then continue to slowly and uniformly raise the temperature, raise the temperature to 220°C in 3 hours, and react at 220°C for 3 hours to obtain 160 parts by weight of polyamide;

[0035] (2) After the reaction, stop heating, cool to 120° C., add 25 parts by weight of thiourea to the reaction bottle, and keep stirring at 125° C. for 2 hours to obtain thiourea-modified polyamide epoxy curing agent 2.

[0036] 2. Performance testing o...

Embodiment 3

[0041]Mix and stir the epoxy resin and DMP-30 curing agent according to the ratio of 100:10, and then evenly spread it on the tin plate to form a film with a film thickness of 40 μm. The measured basic properties are as follows: 25 ℃ surface dry time 1 hour, hard dry time 6 hours, -10 ℃ surface dry time 6 hours, hard dry time 50 hours. After fully cured, the hardness is H, the adhesion is grade 2, the flexibility is 3mm, the impact resistance is 40cm, the resistance to B117 salt spray is 3600 hours, and there is blistering and cracking, and a small amount of rust.

[0042] The above performance test results show that the present invention creatively modifies polyamide with thiourea through a large number of experiments to prepare a thiourea-modified polyamide epoxy curing agent, which can cure epoxy resin at extremely low temperature After curing, it has excellent surface appearance, hardness, adhesion, flexibility, impact resistance and corrosion resistance, and the curing sp...

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Abstract

The invention discloses a thiourea modified polyamide epoxy curing agent and a preparation method thereof. The thiourea modified polyamide epoxy curing agent is prepared from polyamide and thiourea. The thiourea modified polyamide epoxy curing agent disclosed by the invention is prepared through an optimal raw material ratio screened by a lot of experiments. According to the preparation method, polyamide is prepared firstly through an optimum scheme and the thiourea modified polyamide epoxy curing agent with an excellent performance is prepared by taking the polyamide and thiourea at a preferable ratio to react. An experiment result shows that the thiourea modified polyamide epoxy curing agent prepared by the preparation method enables epoxy resin to be rapidly cured at low temperature of -10 DEG C and an epoxy resin cured thin film has excellent toughness and adhesive force; the surface of the film does not easily absorb moisture and the corrosion-resisting and drug-resisting performances are excellent; requirements on application of low-temperature environment epoxy heavy-duty anticorrosive paint can be met. Compared with other curing agents, the thiourea modified polyamide epoxy curing agent has more excellent performances and very good technical effects are obtained.

Description

technical field [0001] The invention relates to an epoxy resin curing agent, in particular to an environment-friendly thiourea-modified polyamide epoxy curing agent and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Using polyamide as epoxy curing agent has small curing shrinkage rate, good dimensional stability of cured product, high mechanical strength, excellent electrical properties, mechanical shock resistance and thermal shock resistance, so it is widely used in industrial adhesives. In addition, the epoxy-polyamide system has excellent adhesion, flexibility and chemical resistance, and has a wide range of applications in anti-corrosion coatings. However, polyamide has the characteristics of slow curing speed, especially at low temperature, the speed is slower or even impossible to cure, which makes it impossible to construct in winter. [0003] Adding a curing accelerator, such as DMP-30, to polyamid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/44C08G69/48C09D5/08C09D163/00
CPCC08G59/442C08G69/48C09D5/08C09D163/00
Inventor 王涛惠正权周煊
Owner 江苏三木化工股份有限公司
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