The invention relates to a measurement method for
semiconductor material characteristics based on
free carrier absorption imaging and solves the problems of defect of an existing
semiconductor material characteristic measurement technology. The method adopted by the invention comprises the steps of (1) vertically irradiating continuous detection
laser light to a surface of a measured semiconductorsample, measuring by a near-
infrared camera and recording the transmitted detection
light intensity spatial distribution S0 at this time by a computer; (2) vertically irradiating the focused continuous pumping
laser light to a center position of a sample detection light
radiation region, measuring by the near-
infrared camera and recording the transmitted detection
light intensity spatial distribution S1 at this time by the computer, wherein the size of a detection
laser light beam incident to the surface of the sample is greater than the size of a pumping
laser light beam focusing on the surface of the sample; (3)
processing the transmitted detection
light intensity spatial distribution imaging results S0 and S1 obtained in steps (1) and (2), that is S=(S1-S0) / S0; and (4) intercepting measurement data having different distances to a
peak value along the peak position of the
free carrier absorption imaging result to obtain multiple characteristic parameters of the to-be-measured sample.