190results about How to "Remove pollutants" patented technology

A single crystal semiconductor layer is formed over a substrate having an insulating surface by the following steps: forming an ion doped layer at a given depth from a surface of a single crystal semiconductor substrate; performing plasma treatment to the surface of the single crystal semiconductor substrate; forming an insulating layer on the single crystal semiconductor substrate to which the plasma treatment is performed; bonding the single crystal semiconductor substrate to the substrate having the insulating surface with an insulating layer interposed therebetween; and separating the single crystal semiconductor substrate using the ion doped layer as a separation surface. As a result, a semiconductor substrate in which a defect in an interface between the single crystal semiconductor layer and the insulating layer is reduced can be provided.

The present invention relates to a method for preventing the deposition of contaminants in steam systems. In a method of this type, deposits are prevented in a simple and economic manner by metering an additive into the steam, which additive adheres to the steam-side surface of the steam system and has the effect of repelling moisture and contaminants.

A process for continuous countercurrent ion exchange comprises piping a contaminated feed stream into a closed loop ion exchange contactor. The contactor is an ion exchange bed that has three or more reaction segments. The segments are comprised of at least an adsorption segment for treating the contaminated feed stream, a regeneration segment for stripping the contaminant ions from the resin bed, and a pulse segment for advancing the resin bed. Simultaneously, the feed stream is moved through the contactor in the same direction as the regeneration stream. Measuring the quality of this treated feed stream after it exits the contactor monitors the treatment capacity of the resin bed. In response to this quality measurement, the regenerated resin bed is advanced in the pulse segment of the contactor. The spent brine is recycled back to the contactor until the final effluent brine is highly concentrated. After the resin stops advancing, the feed stream and regeneration stream resume flow. Process water is recycled in four different steps of the ion exchange process, for the dilution of acid, as resin rinsing water, for back wash and during the resin pulsing stage.