The invention discloses a cleaning technology after
polycrystalline silicon solar cell silicon wafer acid texturing. A
polycrystalline silicon wafer is cleaned through an acid solution containing an
oxidizing agent or a base solution containing the
oxidizing agent after acid texturing. According to the cleaning technology, the
surface structure of the
silicon wafer is optimized, residual composition on the surface of the
silicon wafer is removed, texturing liquid remaining on the surface of the silicon wafer after the silicon wafer is textured can be cleaned,
porous silicon can be removed as well, so that the recombination centers on the surface of the silicon wafer are greatly reduced, the short-circuit current and start
voltage are improved, and the effect that the
photoelectric conversion efficiency of a
solar cell is improved is achieved. After the cleaning technology after
polycrystalline silicon solar cell silicon wafer acid texturing is adopted, the
porous silicon generated after acid texturing can be removed, pointed structures on the textured face are reduced, the color and the luster of the appearance of the silicon wafer are even, the difference between different crystalline grains is small, and the polycrystallization degree is not enhanced. In addition, the cleaning technology after polycrystalline
silicon solar cell silicon wafer acid texturing is simple, easy to operate, compatible with an existing technology and good in
repeatability.