The invention discloses an LTCC-based CGA integrated packaging structure and a realization method thereof. An LTCC technology and a CGA technology are combined, and a CGA array is manufactured on the bottom surface of an LTCC substrate by adopting a tool through a
welding mode; the LTCC is used as an interconnecting substrate, a packaging body and a passive element integrated carrier of the module at the same time; and the whole region or a partial region on the substrate is welded with a
metal surrounding frame, and airtight packaging in the
metal surrounding frame region can be realized through parallel
seam welding or
laser melting seaming ways. The packaging structure is mainly used for the field of
system integration as a packaging platform; by adoption of the CGA, high-reliability
interconnection between the module and the exterior is realized, so that large module packaging dimensions can be realized; by adoption of the LTCC, integration of
active devices and passive elements can be realized at the same time, so that
system integrated density is greatly improved; by virtue of the high-precision
welding of the
metal surrounding frame, high packaging efficiency is realized; due to the position and shape changes of the metal surrounding frame, different applications of
electromagnetic shielding, airtightness and the like can be realized; and in addition, the packaging structure has high fundamentality and expandability.