79results about How to "Improved dissipation capacity" patented technology

A temperature-compensated crystal oscillator for surface mounting wherein an IC chip into which is integrated a temperature-compensated device having an oscillating circuit and a temperature sensor, which supplies a compensation voltage to a variable-voltage capacitor element of the oscillating circuit, and which also has IC terminals disposed along two edges comprising at least diagonally opposite corner portions of one main surface that acts as a circuit function surface is affixed with the use of bumps to an inner base surface of a main container that is concave in section, and one edge portion of a crystal piece is affixed to an inner wall step portion of the main container; wherein an active element of the oscillating circuit that acts as a heat source and a temperature sensor of the temperature-compensated device are disposed at diagonally opposite corner regions of the IC chip at the greatest distance apart. In addition, IC terminals for thermal dissipation are provided in a central region of the IC chip. The present invention provides a temperature-compensated oscillator for surface mounting in which the temperature-compensation operation at startup is satisfactory and frequency stability is maintained.

The invention relates to a gravel permeable pavement mixture taking epoxy resin as adhesive, in particular to a permeable pavement adhered by gravels, which solves the problem that the price of the cellulose and wood-cellulose derivatives in high-intensity permeable pavement mixture is high. The mixture comprises gravels, epoxy resin, additive, and materials of strengthening agent; according to weight, 100 parts of epoxy resin is correspondingly added into 1 to 20 parts of silica or sepiolite or silica and silica sepiolite to be the additive used for increasing viscosity of epoxy resin, and 1 to 10 parts of ceramic fiber to be the strengthening agent used for improving the hardness of epoxy resin and the intensity of permeable pavement, and 1 to 10 parts of glass fiber to be the strengthening agent used for improving the anti natural ageing of the permeable pavement; according to weight, 100 parts of gravels are added with 4 to 8 parts of epoxy resin with fiber added with additive and strengthening agent. The permeable pavement paved by the compound of the invention has the advantages of good environmental protection, easy construction, low cost and long service life.

A method of fabricating a semiconductor package is provided, including: providing a substrate having opposite first and second surfaces and a plurality of conductive through holes penetrating the first and second surfaces, disposing the substrate on a first carrier through the second surface thereof, and keeping the first carrier flat and free of warpage; attaching at least a first semiconductor chip to the first surface of the substrate and electrically connecting the first semiconductor chip and the substrate; removing the first carrier; and attaching the substrate to a packaging substrate through the second surface thereof and electrically connecting the substrate and the packaging substrate, thereby preventing the semiconductor package from warpage, increasing product yield, reducing fabrication cost, and improving thermal dissipation.

The invention discloses an assembly structure of a prefabricated concrete beam and a concrete-filled steel tube column. The assembly structure comprises the concrete-filled steel tube column, a concrete-filled steel tube bracket, the prefabricated concrete beam, beam end pre-buried steel and a connection plate, wherein the concrete-filled steel tube bracket is welded with a side part of the concrete-filled steel tube column; the concrete-filled steel tube bracket is step-shaped; the concrete-filled steel tube bracket comprises bracket-shaped steel and bracket concrete filled in the bracket-shaped steel; a plurality of opposite-pull bolt holes are formed in the side surface of the bracket-shaped steel; the prefabricated concrete beam comprises the beam end pre-buried steel and prefabricated reinforced concrete; the beam end pre-buried steel is step-shaped and is matched with the shape of the concrete-filled steel tube bracket; a plurality of opposite-pull bolt holes are also formed in the side surface of the beam end pre-buried steel; the connection plate is arranged on the side surface of the bracket-shaped steel and the beam end pre-buried steel and is locked and fastened by a plurality of opposite-pull bolts. The assembly structure of the prefabricated concrete beam and the concrete-filled steel tube column is high in bearing capacity, high in earthquake-resistant ductility, high in node energy dissipation capacity, convenient to construct and high in construction quality, and can provide effective restraint on the concrete.

To provide a three-dimensional integrated circuit laminate filled in with an interlayer filler composition having both high thermal conductivity and low linear expansion property.A three-dimensional integrated circuit laminate, which comprises a semiconductor substrate laminate having at least two semiconductor substrates each having a semiconductor device layer formed thereon laminated, and has a first interlayer filler layer containing a resin (A) and an organic filler (B) and having a thermal conductivity of at least 0.8 W / (m·K) between the semiconductor substrate.

The invention discloses an LTCC-based CGA integrated packaging structure and a realization method thereof. An LTCC technology and a CGA technology are combined, and a CGA array is manufactured on the bottom surface of an LTCC substrate by adopting a tool through a welding mode; the LTCC is used as an interconnecting substrate, a packaging body and a passive element integrated carrier of the module at the same time; and the whole region or a partial region on the substrate is welded with a metal surrounding frame, and airtight packaging in the metal surrounding frame region can be realized through parallel seam welding or laser melting seaming ways. The packaging structure is mainly used for the field of system integration as a packaging platform; by adoption of the CGA, high-reliability interconnection between the module and the exterior is realized, so that large module packaging dimensions can be realized; by adoption of the LTCC, integration of active devices and passive elements can be realized at the same time, so that system integrated density is greatly improved; by virtue of the high-precision welding of the metal surrounding frame, high packaging efficiency is realized; due to the position and shape changes of the metal surrounding frame, different applications of electromagnetic shielding, airtightness and the like can be realized; and in addition, the packaging structure has high fundamentality and expandability.

The invention discloses a high-effect dry friction damping spring vibration isolator and aims at providing a friction damping vibration isolator which is compact in structure, large in friction damp, high in load and good in environmental adaptation. According to the technical scheme, in a vibration environment, left friction pieces and right friction pieces of a disc-pressing upper cone spring (3) and a disc-pressing lower cone spring (6) perform reciprocating motion to axially extrude a right friction ring piece (4) and a left friction ring piece (9) on two sides, the left friction ring piece, the right friction ring piece, an upper guide umbrella disc (1) and a lower guide umbrella disc (5) are driven to perform constant friction motion on the inner wall of a housing (2), vibration mechanical energy is converted into heat energy so as to achieve vibration energy consumption and reduction. The high-effect dry friction damping spring vibration isolator utilizes low frequency of a conical spring and a damping characteristic of a symmetric semi-ring damping pad, can effectively inhibit spring fluctuation during high-frequency impact, also has composite multiple vibration isolation effect and has large damp under the low-frequency condition compared with a traditional rubber vibration isolator.

The invention relates to a buffer device applied to the fields of vehicles, machinery and the like, in particular to a buffer device which utilizes a shape memory alloy material and has the characteristics of large stroke, high energy dissipation, resettability and the like. The buffer device comprises single-conical-surface inner circular rings, a double-conical-surface inner circular ring and double inner conical surface-containing shape memory alloy outer circular rings, wherein the single-conical-surface inner circular rings are arranged at the two ends of the buffer device respectively, and a plurality of double inner conical surface-containing shape memory alloy outer circular rings and the double-conical-surface inner circular ring are arranged in the middle of the buffer device alternately. The buffer device is simple in structure and convenient to process and assemble. The shape memory alloy material is in an annular stretch state, the stress state is simple and uniform, and the material utilization rate is high. Compared with the traditional annular spring buffer, the buffer device has the advantage that the relative compression deformation is obviously improved. The energy dissipation through shape memory alloy phase change is combined with the energy dissipation through friction, so that the energy dissipation capability is higher. When the compression displacement is relatively large, the load is almost kept constant, and buffer protection is favorably realized.

The invention provides a glass fiber reinforced PA6 composition and a preparation method thereof. The glass fiber reinforced PA6 composition is prepared from 30-60 parts of PA6, 1-10 parts of PA66, 25-45 parts of glass fibers, 0-5 parts of a flexibilizer, 5-10 parts of a nucleating agent and 5-10 parts of a surface improver through mixing and extrusion granulation. By utilizing short-cut glass fibers with a rectangular cross section, a fiber floating phenomenon can be reduced; and besides, the short-cut glass fibers are mutually matched with nylon 66 and the surface improver to ameliorate the surface fiber floating caused after the injection molding of a glass fiber reinforced PA6 material and improve the mechanical property and compressive property of the glass fiber reinforced PA6 composition.

Provided is a stacked semiconductor device (50) in which a semiconductor package (5) is stacked via connection terminals (8) on a semiconductor package (1), including a heat dissipating member (10) which is disposed between the semiconductor packages (1, 5), is brought into thermal contact with both of the packages (1, 5), and hangs over whole outer peripheral portions of the package (5). Such a structure causes heat generated from the package (5) to be released by heat dissipation into air above the package (5), heat dissipation into the air below the semiconductor package (5), heat transfer via the heat dissipating member (10) and a semiconductor element (3) to a first wiring substrate (2), heat transfer via the connection terminals (8) to the first wiring substrate (2), and heat dissipation via the heat dissipating member (10) into the air, thereby enhancing a temperature reduction effect of the semiconductor element.

The invention discloses a variable-damping variable-rigidity viscoelasticity-friction composite damping device. The variable-damping variable-rigidity viscoelasticity-friction composite damping devicecomprises two symmetric cylinder type viscoelasticity damping device units and two cylinder type friction damping device units, the friction damping device units sleeve the outer sides of the cylinder type viscoelasticity damping device units, the cylinder type viscoelasticity damping device units sequentially comprise annular inner steel cylinders, annular viscoelasticity material layers and annular middle steel cylinders from inside to outside, elastic elements are sleeved with the middles of the annular inner steel cylinders, closed steel plates are mounted on two ends of the annular innersteel cylinders, cylinder viscoelasticity materials are mounted on inner sides of two ends of the annular middle steel cylinders, connecting anchorage steel plates are mounted on two ends of the annular middle steel cylinders, the friction damping device units sequentially comprise annular middle steel cylinders, annular friction pieces, annular friction plates and annular outer steel cylinders from inside to outside, the annular friction plates comprise first annular friction plates and second annular friction plates, and each annular outer steel cylinder is formed through connecting of an upper half annular outer steel cylinder and a lower half annular outer steel cylinder through bolt assembling.

The invention provides a modified glass-fiber-reinforced PA6 (polyamide 6) composition and a preparation method thereof. The composition is prepared by mixing and carrying out extrusion granulation on the following components: 30-60 parts of PA6, 1-10 PA66, 25-45 parts of glass fiber, 5-15 parts of hollow glass microsphere, 0-5 parts of toughener, 5-10 parts of nucleator and 5-10 parts of surface modifier. The hollow glass microspheres and surface modifier are matched to improve the bonding state between the glass fibers and nylon resin and reduce the separation between the glass fibers and nylon resin, so that the glass fibers are well coated in the nylon resin; and the glass fibers and resin synchronously flow in the working process, and can not be easily torn away, thereby greatly reducing the exposure of the glass fibers. The mechanical properties and compression resistance of the modified glass-fiber-reinforced PA6 composition are enhanced.

The invention discloses a viscous, elastic and anti-buckling brace combined damper. The damper sequentially comprises a steel plate in the center, an annular inner steel cylinder and an annular outer steel cylinder from inside to outside, the steel plate is sleeved with the annular inner steel cylinder, the annular inner steel cylinder is sleeved with the annular outer steel cylinder, the portion between the annular inner steel cylinder and the annular outer steel cylinder is filled with a viscous and elastic material layer, and the annular inner steel cylinder, the viscous and elastic material layer and the annular outer steel cylinder are connected in a high-temperature high-pressure vulcanization mode. The damper further comprises an upper anchoring plate and a lower anchoring plate which are opposite to each other. The steel plate is composed of an upper end, a buckling section and a lower end, two grooves I are symmetrically formed in the upper end in the horizontal direction, the upper anchoring plate is fixedly embedded in the grooves I, two grooves II are symmetrically formed in the lower end in the horizontal direction, the lower anchoring plate is embedded in the grooves II, the lower anchoring plate can slide up and down in the grooves II relative to the grooves II, the annular outer steel cylinder is fixedly connected with the lower anchoring plate, and the annular inner steel cylinder is fixedly connected with the upper anchoring plate. The diameter of the annular inner steel cylinder is 1-3 mm larger than the horizontal length of the steel plate.

The invention provides a floating fiber free glass fiber reinforced PET (Polyethylene Terephthalate) composition and a preparation method thereof. The floating fiber free glass fiber reinforced PET composition is prepared from 30-60 parts of PET, 0-10 parts of PBT (Polybutylece Terephthalate), 25-45 parts of glass fiber, 5-15 parts of mica, 0-5 parts of a toughening agent, 5-10 parts of a nucleating agent and 5-10 parts of silicon ketone powder through mixing, extruding and granulating. Due to addition of the mica and the silicon ketone powder, the compatibility of the PET and the glass fiber can be enhanced; and analogous anchoring nodes are formed between the glass fiber and the PET resin, so that the adhesion state of the glass fiber and the resin can be changed, and separation of the glass fiber from the resin can be reduced. Meanwhile, due to mutual cooperation of the mica and the silicon ketone powder, the dispersity of the glass fiber can be improved, the adhesion strength of the PET and a glass fiber interface can be increased, and the separation of the glass fiber from the resin can be reduced, so that exposure of the glass fiber can be greatly reduced, and the pressure resistance of the floating fiber free glass fiber reinforced PET composition can be improved.

The invention provides a modified glass fiber reinforced PA6 composition and a preparation method thereof, wherein 30-60 parts of PA6, 1-10parts of PA12, 25-45 parts of glass fiber, 5-15 parts of magnesium sulfate crystal whisker, 0-5 parts of a toughening agent, 5-10 parts of a nucleating agent and 5-10 parts of a surface modifier are mixed, extruded and granulated to prepare the modified glass fiber reinforced PA6 composition. According to the present invention, through the mutual matching of the magnesium sulfate crystal whisker and the surface modifier, the bonding state between the glass fiber and the nylon resin is improved, and the separation of the glass fiber and the nylon resin is reduced, such that the glass fiber is well coated in the nylon resin, and the glass fiber and the resin synchronously flow during the processing and are not easily torn separately so as to substantially reduce the exposure of the glass fiber and improve the mechanical property and the compressive resistance of the modified glass fiber reinforced PA6 composition.

The invention discloses a shape memory alloy spacecraft landing buffer capable of being used repeatedly. A pore blocky shape memory alloy structure formed by bonding multiple layers of wave buffer structures is adopted, energy is consumed through the phase change process of a shape memory alloy material in the deformation process, and the effect of buffer energy absorption is achieved; and meanwhile through the memory effect of the shape memory alloy material to the initial shape, the shape memory alloy material can restore to the initial shape in a heating manner, and therefore buffer is achieved, and the buffer can be used repeatedly.

A fan-shaped dissipating device, which is assembled on a chip of an erect PCB, has a conductive board, and a plurality of fins. The fins are respectively connected on an outside surface of the conductive board. Each of the fins has a top end and a bottom end. An interval between each two adjacent top ends of the fins is larger that between each two adjacent bottom ends of the fins. The fins are arranged in a radiating manner toward two sides from the bottom ends to the upper ends, therefore reducing the density of the accumulated air between the top ends of the fins because of rising hot air, and providing a better dissipating effect.

The invention provides a damping system for a vegetable transplanting machine and a damping method of the damping system. The damping system comprises a support device, a hydraulic device, a signal acquisition device and a signal processing device, wherein the support device comprises a first support plate, a second support plate and support rods; the hydraulic device and the signal acquisition device are arranged between the first support plate and the second support plate; the hydraulic device comprises a hydraulic cylinder, a piston and an oil supply mechanism; the piston comprises an aperture adjuster, a pressing plate and a moveable rod; the pressing plate is arranged in the inner cavity of the hydraulic cylinder; a damping hole is formed in the pressing plate; the aperture adjuster comprises an electromotor and a disc driven by the electromotor; the electromotor is arranged inside a mounting groove in the pressing plate; the signal acquisition device comprises a first spring, anacceleration sensor, a second spring and a speed sensor; the acceleration sensor and the speed sensor are also connected with the signal processing system. By adopting the damping system, the vegetable transplanting machine is relatively stable at a working state, the transplanting accuracy and precision are improved, and the vegetable seedling damage rate is reduced.

A plasma display apparatus that includes a plasma display panel, a chassis base, a driving circuit, a flexible printed circuit, a driver integrated circuit and a first and second thermal conductive silicone. The chassis base is provided at a side of the plasma display panel. The driving circuit unit is provided at a side of the chassis base. The flexible printed circuit electrically connects an electrode of the plasma display panel to the driving circuit unit. The driver integrated circuit is connected to the flexible printed circuit. The first thermal conductive silicone is provided between the driver integrated circuit and the chassis base. The second thermal conductive silicone is provided, in another embodiment, between the driver integrated circuit and the chassis base and encloses an extending portion of the driver integrated circuit. The first and second thermal conductive silicone dissipate heat, absorb vibrations and reduce noise.

A lamp housing device for an outdoor light-emitting diode light fixture having high heat dissipation capability, which includes an upper casing, a cover body and a sunshade, wherein the cover body has light transmittance, and forms a holding chamber able to retain a light-emitting diode lamp set by pairing with the upper casing. The sunshade is located atop the outer surface of upper casing, and includes a plate and a plurality of fixing members. The fixing members are connected between the plate and the upper casing, thereby providing a spacing distance between the plate and the upper casing. Accordingly, the sunshade is able to reduce the ambient temperature of the light-emitting diodes during the daytime, and increase the rate of heat dissipation of light-emitting diodes when used at night.

The invention discloses an intelligent regulating double-control composite damping component, and belongs to the technical field of engineering structure earthquake resistance and energy-dissipating earthquake reduction. The intelligent regulating double-control composite damping component comprises a steel frame and further comprises an intelligent identification device and an intelligent regulating device which are distributed on the steel frame, wherein the periphery of the steel frame is constituted by I-shaped steel, and a small-displacement energy-dissipating device and a large-displacement energy-dissipating device are arranged in the middle of the steel frame to constitute two sets of earthquake reduction devices; and the intelligent identification device and the intelligent regulating device are mounted on the steel frame, and the middle of the steel frame is constituted by the small-displacement energy-dissipating device and the large-displacement energy-dissipating device which are mutually superposed through a bearing to form a whole. The problem that traditional dampers cannot balance different energy-dissipating demands of the small displacement and the large displacement is solved, the high efficiency of the disc viscoelastic dampers and the economical efficiency of the metal dampers are sufficiently utilized, wind vibration and earthquake responses of a buildingstructure are reduced jointly, the wind vibration and earthquake resistance of a building is improved, and the advantages that safety, reliability and the high efficiency are achieved, and the vibration responses of the structure are reduced better are achieved.

The invention discloses a corn grafting starch and a preparation method thereof. The starch is prepared from the following raw materials in parts by mass: 100 parts of native corn starch, 20-25 parts of acroleic acid, 41-50 parts of butyl methacrylate, 2-8 parts of potassium persulfate, 0.01-0.02 part of dimethyl sulfoxide and 1000 parts of tap water. The preparation method comprises the following steps: (1) native starch pregelatinization; (2) grafting reaction: adding the acroleic acid and the butyl methacrylate into the starch after pregelatinization, uniformly stirring in a reaction kettle, adding the dimethyl sulfoxide and the potassium persulfate, uniformly stirring, filling into a ceramic reaction kettle, and putting the ceramic reaction kettle in a microwave oven field to carry out the graft copolymerization under the microwave power of 160-180 W, wherein the microwave radiation is carried out in an intermittent way; and after the radiation is carried out for 3.5-4.0 minutes each time, taking the ceramic reaction kettle out and stirring for 2-3 minutes, and carrying out the radiation for 4-5 times and the stirring for 3-4 times, thereby completing the grafting reaction; and (3) separating the polymers to obtain the corn grafting starch.

The invention discloses a glass fiber reinforced PA6 composition with improved surface fiber exposing phenomenon, and a preparation method thereof, wherein the glass fiber reinforced PA6 composition is prepared from the following components by weight: PA6, PA66, glass fiber, magnesium sulfate crystal whisker, a toughening agent, a nucleating agent, and silicone oil. According to the present invention, the compatibility between the glass fiber and nylon resin is enhanced by mixing the magnesium sulfate crystal whisker and the silicone oil; the similar anchor consolidation point cross-linking point is formed between the glass fiber and the nylon resin, such that the bonding state between the glass fiber and the nylon resin is improved, the separation of the glass fiber and the nylon resin is reduced, and the glass fiber and the resin synchronously flow during the processing and are not easily torn separately so as to substantially reduce the exposure of the glass fiber; and the mechanical strength of the PA6 composition is increased by adding PA66.

The invention discloses an assembly-type variable-damping variable-stiffness viscoelastic damper and an anti-seismic method thereof. The damper comprises two end viscoelastic damper bodies, the two end viscoelastic damper bodies are arranged coaxially, and a plurality of viscoelastic damper units are connected in series between the two end viscoelastic damper bodies in the axial direction of the two end viscoelastic damper bodies. Each end viscoelastic damper body comprises an end outer barrel and an end inner barrel. A viscoelastic material layer is arranged between the inner wall of each endouter barrel and the outer wall of the corresponding end inner barrel. Each viscoelastic damper unit comprises a unit outer barrel and a unit inner barrel. A viscoelastic material layer is arranged between the inner wall of each unit outer barrel and the outer wall of the corresponding unit inner barrel. Each end outer barrel and the corresponding unit outer barrel as well as the every two unit outer barrels are detachably connected to form a rigid outer barrel of the assembly-type variable-damping variable-stiffness viscoelastic damper. Each end inner barrel and the corresponding unit innerbarrel as well as the every two unit inner barrels are elastically connected through elastic connecting pieces.

The invention discloses heat-insulation coating for solar panels, and can be applied to the field of production of heat-insulation coating for solar panels. The heat-insulation coating comprises, by weight, 85-90 parts of base material, 6-10 parts of functional fillers and 1-3 parts of auxiliaries. The base material is silicone acrylic emulsion. According to the scheme, the heat-insulation coatinghas the advantages that excellent effects of reflecting and dissipating light and heat can be realized by material compositions of the heat-insulation coating, and accordingly the surface temperatures of coated objects can be lowered to a great extent; temperature difference contraction deformation due to heat stress of structures can be reduced, and the crack resistance, the impermeability and the durability of the structures can be improved; heat which is transmitted into indoor environments from roofs and exterior walls can be obviously reduced, accordingly, the heat comfort of environments can be improved, and energy can be saved.

The invention discloses an exhaust pipe with an effective noise reducing function and a compressor. The exhaust pipe comprises a main body and an outer sleeve. An exhaust channel is arranged in the main body. The outer sleeve sleeves the main body, the outer sleeve and the main body are in sealed connection, and sealed space is formed between the outer sleeve and the main body. According to the exhaust pipe with the effective noise reducing function and the compressor, the problem that in the prior art, an exhaust pipe of a compressor is small in obstructing force on air flow noise in the pipe, and consequently the transferring noise is large is effectively solved.

A transporting arm has two protruding support sections. Front ends of the support sections are formed such that a thickness of the support sections decreases toward the front ends of those. A surface of the transporting arm on which a wafer is placed is provided with a plurality of suction holes formed at equal intervals in a fan-shaped region. The wafer is fixed to the transporting arm through the suction holes. The wafer is charged with a large amount of static electricity. The transporting arm is charged with the static electricity. A surface of the transporting arm is coated with a conductive fluorinated graphite material. Therefore, an electrical discharge rate of the transporting arm into an atmosphere increases. Accordingly, elevation of a surface potential of the transporting arm in a floating state can be appropriately suppressed. Reduction of repulsive force due to the static electricity acting between the transporting arm and the wafer leads to reduction of vibration of the wafer.

A lower shield layer is formed by being embedded in a first recess formed in an under layer. Accordingly, the distance between the lower shield layer and a slider can be reduced. Also, a second metal layer is formed from above a gap layer covering an electrode extracting layer over above the under layer hindwards therefrom. Accordingly, the second metal layer can be brought closer to the slider side than an upper shield layer. Consequently, the thermal dissipation effects of the thin-film magnetic head can be improved.