A circuit assembly includes a mount having a circuit element mounted thereon; a heat sink for absorbing and discharging heat generated from the circuit element around, the heat sink mounted on the circuit element on a surface opposite the mount and a noiseisolator for isolating noise generated from the circuit board, the noiseisolator mounted on the heat sink. The heat sink may include a base portion in surface contact with the circuit element and a top portion in surface contact with the noise isolator. A plurality of fins may be positioned between and parallel to the base and top portions. A plurality of fins may be positioned between and perpendicular to the base and top portions. The top portion may be co-extensive with the base portion, or may only extend past the base portion.