50results about How to "Temperature detection" patented technology

Improved methods and devices are provided for detecting and / or predicting the onset of an undesirable physiological event or neural state, such as an epileptic seizure, to facilitate rapid intervention with a treatment therapy such as neurostimulation or drug therapy. The methods and devices involve monitoring the patient's body temperature, preferably by an implanted temperature sensor, to detect a change in a body temperature parameter over a first time period. The temperature parameter change may comprise an increase or decrease in the patient's body temperature over a first time period, time rate of change of body temperature over a first time period, a moving average temperature over a first time period, an increase or decrease in body temperature exceeding a target temperature over a first time period, an elevated or reduced body temperature over first time period, or a temperature stability parameter over a first time period. The sampling period at which body temperature measurements are made may be changed manually or depending upon a sensed body parameter, including temperature. When a parameter change is detected that exceeds a threshold, neurostimulation therapy is delivered to a neural structure of the patient.

In order to shorten a period of time necessary for charging a battery, and further, to prevent a temperature of a mobile terminal from raising, the mobile terminal 100 is comprised of a case 102 in which electronic parts are arranged, a battery 104 mounted in the case 102, a battery-charging circuit 106 supplying a current to the battery 104, a charge controller 108 allowing the battery-charging circuit 106 to charge the battery 104 or stopping the battery-charging circuit 106 from charging the battery 104, and a temperature sensor 112 detecting a temperature in the case 102, wherein the charge controller 108 controls the current to be supplied to the battery 104, in accordance with a temperature detected by the temperature sensor 112.

A cooling system of an internal combustion engine is provided that can improve flexibility of arrangement of peripheral machinery included in the engine. A cooling system of an internal combustion engine includes a crankcase; a cylinder block disposed on an upper portion of the crankcase and having a plurality of cylinder bores; a cylinder head disposed on an upper portion of the cylinder block; and an oil passage formed in a rear surface portion of the cylinder block so as to extend along a cylinder-arrangement direction. The oil temperature sensor is attached to the oil passage from the axial direction of the oil passage.

A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

A fan and a frame with a sensor-supporting structure are disclosed. The fan includes a frame with an inlet, a connecting portion disposed on the frame, a stator, and a rotor having blades and disposed in the frame. The frame includes a main body and a sensor-supporting structure. The sensor-supporting structure extending from the main body toward the inlet is utilized to support a sensor.

A temperature sensing element includes a thermistor composed of Si-base ceramics and a pair of metal electrodes bonded onto the surfaces of the thermistor. The metal electrodes contain Cr and a metal element α having a Si diffusion coefficient higher than that of Cr. A diffusion layer is formed in a bonding interface between the thermistor and each metal electrode, the diffusion layer including a silicide of the metal element α in a crystal grain boundary of the Si-base ceramics. A temperature sensor including the diffusion layers is provided. Owing to the diffusion layers, the temperature sensor ensures heat resistance and bonding reliability and enables temperature detection with high accuracy in a temperature range, in particular, of from −50° C. to 1050° C.

A reflecting shell includes a hollow joint unit, a hollow guide unit and a hollow receiving unit. The hollow joint unit has a stationary part at one end, and the stationary part is detachably connected to a detecting part of a measuring device. One end of the hollow guide unit is connected to the other end of the hollow joint unit, and an internal wall of the hollow guide unit has a first reflective surface and a second reflective surface, in which the first reflective surface and the second reflective surface correspond to each other. One end of the hollow receiving unit is connected to the other end of the hollow guide unit. Heat radiation from a heat source enters the hollow guide unit, and the heat radiation is transmitted to the detecting part by the reflection of the first reflective surface and the second reflective surface.

An apparatus for detecting temperatures of power-conversion semiconductor elements, which is applicable to a system including a plurality of power-conversion semiconductor elements and a plurality of temperature signal outputs for outputting temperature signals correlated to temperatures of the respective semiconductor elements. In the apparatus, the temperature signal outputted from at least one of the temperature signal outputs is input directly to a microcomputer without passing through at least one input-output interface. The temperature signals outputted from the other two or more temperature signal outputs are input to a plurality of input ports of the at least one input-output interface sequentially connected to an output of the interface. The microcomputer detects the temperatures of the respective semiconductor elements based on the temperature signals received from the output port of the at least one input-output interface and the temperature signal received directly from the at least one of the temperature signal outputs.