157results about How to "Improve processing throughput" patented technology

Methods, systems, and data structures are provided selectively encrypting portions of media data that are streamed over a network. Media data is identified and a portion of the data is selectively encrypted. The media data is then streamed over a network to one or more recipients for consumption. The intended recipients cannot consume the media data until the encrypted portion is properly decrypted.

A method and system for processing of media items includes a separator system feeding a series of media items onto a transport system. The separator system is controlled to feed onto the transport system groups of sequential media items having similar information and to separate and feed onto the transport system sequential media items having dissimilar information spaced apart on said transport system from the group of media items having similar destination information. The separator system may be controlled to limit the thickness of each group of media items not to exceed a predetermined thickness. The separator system may also be controlled to separate and feed onto the transport system any subsequent media items which would cause said group of media items to exceed the predetermined thickness. In one arrangement, a series of media items are fed onto the transport system transport path for sortation into two or more sortation bins. The separator is controlled such that adjacent media items destined for the same sortation bin are transported along said transport path as a group of media items to the same sortation bin and such that adjacent media items destined for different sortation bins are separated for separate transport along the transport path to the different sortation bins. The order of the media items within groups created by said separator system may be controlled by an order diverter such that subsequent sortation of groups of media items will further differentiate the media items by media item order sequence of media items in each of the groups of media items. Additional controllable separators may be connected to the media item transport. The system may group media items for unescorted transport on a sorter or may group media items for escorted transport such as by being place in a carrier.

An improved thermal interface between an integrated circuit chip and a heat sink comprises a copper grid embedded in a layer of a solder material that has a fusion temperature higher than the maximum operating temperature of the semiconductor chip, and bonds to the semiconductor chip and the heat sink when heated to the fusion temperature of the solder material in the presence of a soldering flux. The copper grid has high thermal conductivity so that the amount of solder material needed for an efficient thermal interface is reduced and solder materials with less expensive components may be used. The copper grid also tends to mitigate local hot spots by enhancing lateral heat transfer, and inhibits solder spreading during formation of the thermal interface.

A method of observing a specimen using a scanning electron microscope, makes it possible to shorten the time required to perform automatic focusing at the time of semiconductor defect automatic review and improves the throughput in the processing in which the specimen is observed. In the above method, the specimen is imaged at a low resolution by the scanning electron microscope to obtain an image, an area for imaging the specimen at a high resolution is specified from the image acquired at the low resolution, the specimen is imaged at a high resolution by the scanning electron microscope to determine a focus position, a focal point of the scanning electron microscope is set to the determined focus position, and a high resolution image in the specified area is acquired in a state in which the focus position has been set to the determined focus position.

In a method of forming an integrated circuit device, an opening is formed extending through a first and a second insulating layers and through a semiconductor layer therebetween to a surface of a substrate. The opening includes a recess in a sidewall thereof between the first and second insulating layers adjacent the semiconductor layer. A conductive plug is formed on the sidewall of the opening and on the surface of the substrate and laterally extending into the recess between the first and second insulating layers to contact the semiconductor layer. The semiconductor layer may be selectively etched at the sidewall without substantially etching the first and second insulating layers at the sidewall of the opening to form the recess between the first and second insulating layers. Related devices are also discussed.

A CRC value calculator enables throughput to be improved while keeping down the increase in the size of the circuitry. This is achieved by using (n+1) basic CRC circuits to configure a CRC value calculator in which the width of the data processed during one clock cycle is m2n bits. For example, when m2n bits is the data width processed per calculator cycle, the CRC value calculator of this invention is configured by using selectors to serially connect a CRC circuit that processes every m2n bits, a CRC circuit that processes every m2(n−1) bits, . . . , and a CRC circuit that processes every m20 bits. This configuration makes it possible to calculate a correct CRC value even when the remainder of an input network frame is not a multiple of m2n bits. Selectors are used to select CRC circuit output according to process data width. Reduction of the operating frequency is avoided by using registers to form a pipeline between CRC circuits.

A device compiler and linker within a parallel processing unit (PPU) is configured to optimize program code of a co-processor enabled application by rematerializing a subset of live-in variables for a particular block in a control flow graph generated for that program code. The device compiler and linker identifies the block of the control flow graph that has the greatest number of live-in variables, then selects a subset of the live-in variables associated with the identified block for which rematerializing confers the greatest estimated profitability. The profitability of rematerializing a given subset of live-in variables is determined based on the number of live-in variables reduced, the cost of rematerialization, and the potential risk of rematerialization.

Programmable load forming systems, components thereof, and methods of use are disclosed. In one aspect, a programmable load forming system is programmed to perform the method of downloading a calculated path from the computer to the robot controller, moving one or more bundles along the calculated path to position the one or more bundles in a predetermined stacking position of a stacking pattern using the robot, and determining if the robot has completed moving along the calculated path. The calculated path is defined, in part, by the stacking pattern and other parameters such as, for example, bundle geometry, bundle levelness, bundle compressibility, among other parameters. In another aspect, the system is programmed to perform a method of sensing the top of a bundle and controllably placing a bundle. Additional aspects are directed to systems and methods of safely operating the robot and an inventive hopper design for holding bottom / tie sheets.

Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.

In one aspect, a programmable load forming system is programmed to perform the method of downloading a calculated path from the computer to the robot controller, moving one or more bundles along the calculated path to position the one or more bundles in a predetermined stacking position of a stacking pattern using the robot, and determining if the robot has completed moving along the calculated path. The calculated path is defined, in part, by the stacking pattern and other parameters such as, for example, bundle geometry, bundle levelness, bundle compressibility, among other parameters. In another aspect, the system is programmed to perform a method of sensing the top of a bundle and controllably placing a bundle. Additional aspects are directed to systems and methods of safely operating the robot and an inventive hopper design for holding bottom / tie sheets.