124results about How to "Achieve electromagnetic shielding" patented technology

The invention discloses a modularized power cabinet which comprises a control box, an auxiliary circuit, a reactor, a phase module, a cabinet body, a low-inductance busbar A, a busbar, a low-inductance busbar B, a support capacitor, a water outlet pipeline and a water inlet pipeline, wherein the cabinet body is divided into a high-voltage region and a low-voltage region, the low-voltage region and the high-voltage region are isolated by a metal plate, the high-voltage region comprises the phase module, the reactor and the support capacitor, the phase module and the reactor are distributed in the cabinet body from top to bottom, the low-voltage region comprises the control box and the auxiliary circuit, the control box of the low-voltage region is connected with a power device of the phasemodule of the high-voltage region through an optical fiber, the auxiliary circuit can realize connection of all the parts by wiring in the cabinet body, and a water cooling pipeline comprising a water outlet pipe and a water inlet pipe is distributed at the upper end and the lower end of the cabinet body. The power cabinet described by the implementation way is strong in universality and high in degree of integration, and can realize rectification and the inversion function, simultaneously effectively integrates a power unit and a control unit, solves the problems that the power cabinet is bulky so as to be unfavorable for transportation and installation, and is more convenient and reliable for wiring and debugging.

The invention relates to test system and method, which can be used for testing a unit to be tested with signal pins at two surfaces. The test system comprises a testing platform and a picking and placing device, wherein the testing platform comprises an electromagnetic shielding cavity and a testing environment module, the electromagnetic shielding cavity is provided with an opening, the testing environment module is arranged in the electromagnetic shielding cavity; the picking and placing device is movably arranged above the testing platform and comprises an electromagnetic shielding upper cover and a signal conducting structure, when the picking and placing structure places the unit to be tested on the testing environment module, the electromagnetic shielding upper cover is matched with the electromagnetic shielding cavity of the testing platform to form an electromagnetic shielding space for isolating the unit to be tested; meanwhile, the signal pins positioned on the upper surface of the unit to be tested can be electrically connected with the testing environment module through the signal conducting structure.

The invention provides a nanometer enhanced paper plastic material and a preparation method thereof. Well mixing, granulation, extrusion moulding and other steps are carried out for waste paper powder, high density polyethylene, a filling material, an anti-oxidant, a coupling agent, a lubricant and nanometer cellulose and other materials; and the nanometer enhanced paper plastic material which can be applied to the fields of outdoor floors, plank roads, corridors, packages and the like is obtained. Granular materials which have good dispersibility and are suitable for continuous industrial production are prepared by using reclaimed waste paper materials, nanometer cellulose is added, so that the material has higher mechanical properties, and application fields of paper plastic composite materials are enlarged; nanometer cellulose with modified functions is added for realization of electromagnetic shielding, antibiosis or luminescence and other additional effects; added values of paper plastic composite materials are increased, and at the same time, the material has important meanings for reducing environmental pollution.

A manufacturing method of a package substrate comprises: fabricating a hollowed-out elongated slot on the periphery of each package substrate unit on a substrate; metallizing the sidewalls of the hollowed-out elongated slot; etching off a copper foil layer at the central area of each package substrate unit; and fabricating, at the central area where the copper foil layer is etched off, a hollowed-out square groove for securing an electronic element. Further provided are a corresponding package substrate unit and a substrate assembly. In the technical solution of the present invention, sidewalls on the periphery of the package substrate unit are metallized to form a metal shielding layer, which easily and reliably implements electromagnetic shielding on the electronic element without the need of adding a shielding hood; in this way, the thickness of the package substrate is not increased, the universality of the product is not reduced, and the structure is reliable, thereby reducing the ineffectiveness risk; moreover, the cost is low.

The invention discloses an electromagnetic shielding telescopic structure and an installation method thereof. The structure includes two vertical columns installed on two sides of an expansion joint on a fixed base. A lower shielding plate, a middle shielding plate and an upper shielding plate which are made of elastic materials and have the function of electromagnetic shielding are orderly installed between the two vertical columns, the lower shielding plate is installed on the expansion joint of the fixed base and is fixedly connected to the middle shielding plate through a front shielding pressing strip and is fixedly connected to the solid base through a back shielding pressing strip, and the middle shielding plate and the upper shielding plate are connected by rivets to form a telescopic shielding unit. According to the electromagnetic shielding telescopic structure, the horizontal cross-section shapes of the lower shielding plate, the middle shielding plate and the upper shielding plate are stretched Pi shapes, the shielding plates can be installed adaptively according to the sizes of different expansion joints during installation, and the versatility is high. According to different requirements, holes can be made in the middle shielding plate and the upper shielding plate to reduce a structural weight and air resistance.

The invention provides a case with a safety lock. The case comprises a case and a top cover which is closed on the upper part of the case. At least two open pins are arrange at that side of the case;the opening pin extends in the direction of the axial top cover closure; the top cover is provided with the same number of safety locking fasteners as the opening pin shaft; the setting position of the safety lock is matched with the setting position of the opening pin shaft of the case; the safety locks cooperate with the opening pin shaft to detachably connect the case to the top cover. The safety lock is installed on the top of the case and can be used with the opening pin inside the case to realize the function of assisting opening. The opening structure has no screws, so that the problemsare solved that the screw is liable to cause mesh failing after being dismantled for many time, or the screws cannot be closely matched with the screw holes, thus leading to loose closure of the boxbody and the cover of the box, and affecting shielding electromagnetic radiation. The safety lock is helpful to open and close the function, can realize the electromagnetic shielding, the operation issimple, is suitable for has the electromagnetic compatibility request in the case.

The present invention provides a packaging structure. The packaging structure comprises a first shielding layer and a second shielding layer which are positioned between a semiconductor chip and a plastic package layer and between a first plastic package layer and a second plastic package layer; the first shielding layer wraps the non-functional surface and the side wall surface of the semiconductor chip and the side surface of the first plastic package layer, the second shielding layer is positioned between the first shielding layer and the plastic package layer and completely covers the non-functional surface and the side wall of the semiconductor chip and the surface of the first shielding layer on the side surface of the first plastic package layer; the second shielding layer can coverplaces with uneven thickness and poor edge coverage in the first shielding layer, so that the whole shielding layer formed by the first shielding layer and the second shielding layer is complete, andthe shielding effect is improved.

The invention relates to a chip stacking packaging body with an electromagnetic shielding function and a preparation method thereof, belongs to the technical field of integrated circuits, and solves the problem of mutual interference of electromagnetic signals caused by reduction of the distance between microwave / millimeter wave chips. The chip stacking packaging body comprises a microwave / millimeter wave bare chip and a packaging structure used for packaging the microwave / millimeter wave bare chip, and the packaging structure comprises a packaging dielectric layer and a packaging metal wiringlayer which are sequentially arranged on the microwave / millimeter wave bare chip. According to the invention, the size is smaller, the integration degree is higher, and the sensitive microwave / millimeter wave bare chip can be protected from interference of other electromagnetic fields.

The present invention provides a forming method of a packaging structure. The forming method of a packaging structure comprises the steps of: after first plastic packaging layers on the functional faces of a plurality of semiconductor chips are bonded to a carrier plate, forming first shielding layers wrapping the non-functional faces and the side wall surfaces of the semiconductor chips; formingsecond shielding layers on the first shielding layers; forming second plastic packaging layers on the second shielding layer and the carrier plate between the semiconductor chips; stripping the carrier plate to form a pre-sealing panel, and exposing the first plastic packaging layers on the back surface of the pre-sealing panel; removing part of the first plastic packaging layers to expose metal bumps; and forming an external contact structure connected with the metal bumps on the back surface of the pre-sealing panel. According to the invention, the second shielding layers are formed on the first shielding layers, and the second shielding layers can cover places with non-uniform thickness and poor edge coverage in the first shielding layers, so that the whole shielding layer formed by thefirst shielding layers and the second shielding layers is complete, and the shielding effect is improved.

The invention provides a current transformer and a manufacturing method thereof. The current transformer is formed by assembling an upper magnetic core, a multi-layer PCB and a lower magnetic core, wherein the upper magnetic core comprises a magnetic core upper panel, a middle column located in the center of the upper panel and two side columns which are in the same direction as the middle column,are parallel to the middle column, are arranged in a mirroring mode and are flush with an edge of the magnetic core upper panel, the lower magnetic core comprises a magnetic core bottom column, a middle column located in the middle of the magnetic core bottom column and two side columns which are parallel to the middle column in the same direction and are symmetrically arranged, the middle columnof the upper magnetic core and the middle column of the lower magnetic core are equal in sectional area and equal in width and section, and the magnetic core panel of the upper magnetic core and themagnetic core bottom column of the lower magnetic core are equal in thickness. The current transformer is advantaged in that only combination of the magnetic core and the multi-layer PCB is provided,and process difficulty is low.

The invention discloses a shielding type high-power microwave waveguide phase shift control device which comprises a control system and an optical fiber feed-through, and the control system is in communication connection with an external upper computer through the optical fiber feed-through. The problems that in the prior art, the electromagnetic compatibility problem in the high-power microwave environment cannot be effectively solved, and the electromagnetic shielding effect is poor are solved.

The invention belongs to the technical field of microwave and millimeter wave rotation and flexible mechanisms, and discloses an anti-wear rotatable broadband electromagnetic shielding structure, a design method and application, a plurality of arc surface metal convex bodies with the same radius are periodically and regularly arranged along the outer cylindrical surface of a cylindrical substrateto form an array structure, and an embedded ball is arranged at the upper part of each metal convex body. A cylindrical cavity is formed in the shielding body, the cylindrical cavity and the cylindrical surface arc of the cylindrical base body are in a concentric circle relation, proper size parameters are determined through specific steps, the arc surface metal convex body array and the embeddedballs are combined and then inserted into the cylindrical cavity of the shielding body, and a contact structure is formed in a clearance fit mode. And the metal convex body array, the embedded balls and the cylindrical cavity jointly form an electromagnetic band gap structure with a wide electromagnetic forbidden band, so that broadband electromagnetic shielding is realized. The electromagnetic shielding structure disclosed by the invention has a rotatable characteristic, has wear resistance under a proper size condition, and realizes broadband electromagnetic shielding of a microwave and millimeter wave circuit and structure during rotation and movement.

The invention provides a thin-film circuit electromagnetic shielding packaging method. The method concretely comprises the steps that step one, the front surface of a substrate completing array arrangement circuit manufacturing is adhered on a high temperature adhesive tape; step two, the solder is covered on the back surface and the side surface of a circuit wafer; step three, the high temperature adhesive tape is removed; step four, a metal seal cover having the corresponding size with that of each circuit sub-wafer is selected, and the metal seal cover is downwardly folded and sealed to be embedded in the through cavity of the substrate so that the sealed external edge is enabled to be aligned with the bottom part of the circuit wafer and the internal wall is enabled to be closely fit with the circuit; and step five, the clamped array structure is overturned so that the bottom solder is enabled to be upward and fixed, and batch soldering and packaging of the metal seal cover and the thin-film circuit wafer can be realized through reflow soldering. Compared with the methods in the prior art, device level radio frequency signal electromagnetic shielding can be realized, the volume weight is reduced for more than 90% and the cost is reduced for more than 20% in comparison with the mechanical processing metal shell packaging mode. Meanwhile, the batch device assembling mode is adopted and automatic assembling can be supported so that the production efficiency can be enhanced for about 20%.

The invention discloses a support type electromagnetic shielding tent which comprises a tent body. The tent body is made of electromagnetic shielding composite material, so that electromagnetic shielding is achieved. The electromagnetic shielding composite material is material in the prior art, filling type electromagnetic shielding composite material, surface layer conductive type electromagnetic shielding composite material and the like.