287results about "Screening metallic containers" patented technology

The invention provides an electromagnetically shielded enclosure for personal electronic device security, comprising a lower enclosure having a receiving space for at least one electronic devices disposed on a base portion of the lower enclosure. An upper lid is structurally engaging with the whole lower enclosure to form an electromagnetically shielding structure. A wireless charging element is configured on the lower enclosure for wirelessly charging to provide power to at least one electronic device.

A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising an undiced semiconductor wafer having a multitude of microchips. The multitude of microchips on the wafer forming a plurality of independently functioning computers, each computer having independent communication capabilities.

A field hardened industrial device is described with a housing of the device having electrically conductive walls surrounding a cavity with an open end. An electronics assembly is adapted to fit within the cavity. The device includes a circuit card assembly, which is a multi-layered printed wiring board with pass-through electrical connections and an embedded ground plane electrically coupled to the housing to shield the electronics assembly from electromagnetic interference and to provide environmental protection to the electronics assembly.

The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment of the present invention is an electro-magnetic interference shielding apparatus for an electronic assembly comprising a shielding partition that separates a first compartment from a second compartment. The apparatus further comprises a top enclosure capable of engaging with the shielding partition to form a plurality of contact seams. The contact seams are capable of restricting electro-magnetic interference from passing through the shielding apparatus. The top enclosure can be capable of tool-free installation and removal to provide access to the interior of the electronic assembly.

Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss tangent parameter of the thermal energy storage material, the REI of the electronic device is reduced.

A magnetically shielded fluorescent lamp ballast case for shielding human beings from the negative effects of magnetic fields emanating from a fluorescent lamp ballast is made of a ferromagnetic alloy, or lined on the inside or the outside of the fluorescent lamp ballast case with such foil alloys. The ferromagnetic alloy for the magnetically shielded fluorescent lamp ballast case is a soft magnetic material. The soft magnetic material is a metal alloy containing one or more than one of the following elements: iron, nickel, or cobalt. The fluorescent lamp ballast case can be made of steel or aluminum, and lined on the inside or the outside of the ballast case with a ferromagnetic foil alloy which is attached to the steel or aluminum by adhesive. The magnetically shielded fluorescent lamp ballast case for a fluorescent lamp ballast can be employed for core coil fluorescent lamp ballasts or for electronic solid state fluorescent lamp ballasts. There is a substantial attenuation of the magnetic component of the electromagnetic field, particularly of frequencies up to about 100 Kilohertz.

An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.

A dielectric waveguide for propagating electromagnetic signals includes a cladding and an electrically conductive shield. The cladding has a body composed of a first dielectric material. The body defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The cladding further includes at least two ribs extending from an outer surface of the body to distal ends. The shield engages the distal ends of the ribs and peripherally surrounds the cladding such that air gaps are defined radially between the outer surface of the body and an interior surface of the shield.

An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.

This disclosure relates to a multi-piece shield comprising a fence, a lid, and an insert. The lid attaches to the fence, which is attached to the circuit board. The lid is a relatively thick, flexible material for supporting the insert. The lid has a recess so that the insert can be recessed into the lid to position the insert closer to the circuit for enhanced heat absorption. The insert is made of a thicker heat absorbing material than the lid, again to facilitate heat absorption. The insert can be press-fit into the recess of the lid. The lid can have a dovetail configuration to retain the insert in the lid.

An electromagnetic-shielding device disposed in an electronic device prevents that an electric component in the electronic device is interfered by electromagnetic wave. The electromagnetic-shielding device has at least one positioning and leaning wall, which is mounted on a laminate member as a part of a housing of the electronic device or a central plate within the electronic device. By means of the positioning and leaning wall, an electromagnetic-shielding mask is conveniently mounted within the electronic device so as to cover the electronic component.

An electronic circuit module includes a circuit board on which electronic components are mounted, and a metal cover covering the circuit board. The metal cover includes a top plate disposed so as to face the circuit board, side plates, and mounting legs. The circuit board has lands to which the mounting legs are joined. The mounting legs each have a bent portion located on the outer periphery of the top plate of the metal cover, and a mounting leg fixing portion in contact with the lands of the circuit board. When seen from the upper surface of the circuit board, the position of the bent portion is on the inner side of the position of the mounting leg fixing portion, and the width of the bent portion is greater than the width of the mounting leg fixing portion.