Embedding and packaging structure for organic substrate integrated with antenna and radio frequency front end

Abstract

An embedding and packaging structure for organic substrate integrated with antenna and radio frequency front end comprises a radio frequency front end module, two dielectric layers and an antenna module. The radio frequency front end module comprises a core plate, wherein the interior of the core plate comprises at least one through groove; at least one active chip which is buried in the through groove of the core plate; two dielectric layers which are respectively a first dielectric layer and a second dielectric layer, wherein the first dielectric layer is arranged on the upper surface of thecore plate and is provided with a plurality of first metallized blind holes in a penetrating manner, and the second dielectric layer is arranged on the lower surface of the core plate and is providedwith a plurality of second metallized blind holes in a penetrating manner. A plurality of metallized through holes are formed in the first dielectric layer, the core plate and the second dielectric layer in a penetrating manner. The antenna module comprises at least one antenna unit arranged on the upper surface of the first dielectric layer; a periodic metal structure which is arranged on the upper surface of the core plate; a metal ground plane which is arranged on the lower surface of the second dielectric layer, wherein the metal ground plane and the periodic metal structure jointly serveas an antenna reflection plane.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an organic substrate embedded packaging structure integrating a millimeter wave antenna and a radio frequency front end. Background technique [0002] In order to improve the integration level, the International Semiconductor Technology Development Route Organization proposed Beyond Moore's Law, aiming to integrate processors, memories, radio frequency modules, digital modules, analog modules, optoelectronic modules, sensor modules, etc. into a single package to achieve system-in-package (System in Package, SiP), if the antenna is also integrated in the system-in-package, it is called antenna-level packaging (Antenna in Pakcage, AiP). [0003] Among them, SiP covers integrated solutions from traditional 2D modules including multiple active chips and passive components to more complex modules such as PiP, PoP, 2.5D and 3D. The substrate materials used include LTCC,...

AI Technical Summary

Problems solved by technology

[0004] The integration of the antenna and the RF front-end mainly faces the following technical problems: Most of the millimeter-wave chips used in the RF front-end are based on the compound semiconductor process, and the metal grounding requirements on the back limit the packaging form of the chip to wire bonding. However, as the operating frequency increases, the bond The parasitic effect of the bonding wire is becoming more and more obvious; at the same time, the demand for thinner and smaller packages of electronic products is constantly increasing, but the thinner and lighter package structure limits the thickness of the antenna base, thereby limiting the improvement of the antenna performance; in addition, the antenna and radio frequency When the front-end is integrated, the problem of electromagnetic interference between the active chip and the active chip, and between the antenna and the active chip is particularly serious; moreover, after the antenna is integrated with the RF front-end, the heat dissipation method of mounting a metal heat sink on the package is no longer Be applicable

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