High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component

A low-cost technology for transceiver components, applied in radio wave measurement systems, instruments, etc., can solve problems such as unsuccessful designs, achieve the effects of reducing assembly costs, enhancing isolation, and reducing assembly processes and time

Inactive Publication Date: 2011-09-28
费元春 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Domestic research on transceiver components based on LTCC technology has just started, and transceiver components in the Ku-band and above microwave and millimeter-wave bands have not yet been successfully designed.

Method used

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  • High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component
  • High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component
  • High-performance low-cost miniature low temperature co-fired ceramic (LTCC) transceiving component

Examples

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example

[0019] Example: Ku-band LTCC transceiver components

[0020] figure 1It is the overall block diagram of high-performance and low-cost miniaturized LTCC transceiver components. The transceiver component consists of two parts. The left side of the dotted line is the radio frequency part of the transceiver component, and the right side of the dotted line is the intermediate frequency part of the receiving branch. It contains 13 functional circuit modules in total. The transmission direction of the sending and receiving signals is: the transmitting signal enters the transmitting branch from switch 2 (SW2), passes through the phase shifter (PS), attenuator (ATT) and switch 3 (SW3) and reaches the power amplifier (PA), and the signal is amplified to After a certain power, it enters the circulator (CL) and outputs to the antenna interface; the echo signal comes in from the antenna, passes through the circulator (CL) and enters the receiving branch, and the signal goes along the low ...

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Abstract

The invention relates to a microwave millimetre-wave transceiving component device, which consists of a transmitting branch, a receiving branch, a micro-strip line, a chip feeding network, a control network, an input / output interface and a metal box body, wherein functional circuit modules are integrated in low temperature co-fired ceramic (LTCC) multi-layer medium substrates to form a miniature microwave three-dimensional stereo structure; a band-pass filter, a low-pass filter, the micro-strip line, the chip feeding network, the control network and the input / output interface are formed by printing metal conduction bands with different shapes on different layers of LTCC substrates; and the functional modules, except a circulator, the band-pass filter and the low-pass filter, are realized by a monolithic microwave integrated circuit (MMIC) chip circuit. A near end of an MMIC chip feeding network consists of a feeder line pad and a grid-shaped metal conduction band; and the metal conduction band encloses the centre of the feeder line pad into a closed structure. The three-dimensional stereo structure at least comprises three layers of horizontal planes which are in short-circuited connection by metallized through holes. The device has the advantages of high performance, low cost and miniaturization.

Description

technical field [0001] The invention relates to a high-performance and low-cost microwave and millimeter-wave transceiver assembly, in particular to a transceiver assembly integrated with LTCC (low temperature co-fired ceramic) multilayer dielectric substrates. The invention belongs to the technical field of microencapsulation. Background technique [0002] The transceiver component is one of the important components of the radar. The rapid development of modern active phased array radar puts forward higher requirements for transceiver components. How to develop high-performance, low-cost, and miniaturized transceiver components is the key. In the microwave and millimeter wave frequency bands, the spacing between antenna elements is very small, which makes it difficult to accommodate the circuit modules of the transceiver components in two dimensions. The three-dimensional packaging of the transceiver components is undoubtedly the future development direction. Currently fe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S7/02
Inventor 费元春纪建华
Owner 费元春
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