Electromagnetic shielding module structure and preparation method of electromagnetic shielding module structure

A module structure, electromagnetic shielding technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of poor shielding effect, difficult quality control, complex process, etc.

Active Publication Date: 2020-12-18
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing EMI shielding technology (electromagnetic shielding technology) usually forms a metal shielding layer directly around the high-frequency chip to achieve shielding, and the shielding effect is poor; or the plastic package is filled with conductive materials after laser slotting, which needs to be excavated and filled. The method forms a segmented shielding structure between devices, the process is complex and the quality is difficult to control, and it is easy to lead to poor shielding effect

Method used

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  • Electromagnetic shielding module structure and preparation method of electromagnetic shielding module structure
  • Electromagnetic shielding module structure and preparation method of electromagnetic shielding module structure
  • Electromagnetic shielding module structure and preparation method of electromagnetic shielding module structure

Examples

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no. 1 example

[0055] Please refer to Figure 1 to Figure 3 , this embodiment provides an electromagnetic shielding module structure 100, which avoids complex processes such as digging and filling, simplifies the process steps, reduces the difficulty of packaging, and also avoids the problem of glue overflow. The shielding device 170 is highly uniform, The sputtering of the metal layer is uniform and the shielding effect is good.

[0056] The embodiment of the present invention provides an electromagnetic shielding module structure 100, including a module substrate 110, a first chip 130, a second chip 150, a plurality of shielding devices 170, a protective plastic package 180 and a metal shielding layer 190, the first chip 130 and the second chip 150 are mounted on the module substrate 110 at intervals, a plurality of shielding devices 170 are mounted on three of the module substrate 110, and at least part of the shielding devices 170 are arranged between the first chip 130 and the second ch...

no. 2 example

[0079] see Figure 7 , the present embodiment provides a method for preparing the electromagnetic shielding module structure 100, which is used to prepare the electromagnetic shielding module structure 100 as described in the first embodiment, the method comprising the following steps:

[0080] S1: mount the first chip 130 and the second chip 150 on the module substrate 110 .

[0081] Specifically, a module substrate 110 is provided, and the first chip 130 and the second chip 150 are mounted on the front of the module substrate 110 at intervals, and are electrically connected to the module substrate 110, and the electrical connection method may be wire bonding (front mounting ), can also be connected through solder balls (flip chip), so I won’t go into details here.

[0082] S2: Mount a plurality of shielding devices 170 on the module substrate 110 , and at least part of the shielding devices 170 are arranged between the first chip 130 and the second chip 150 .

[0083] Spec...

no. 3 example

[0115] This embodiment provides a method for preparing an electromagnetic shielding module structure 100, the basic steps of which are the same as those of the second embodiment, and where not mentioned in this embodiment can refer to the second embodiment, the method includes the following steps:

[0116] S1: mount the first chip 130 and the second chip 150 on the module substrate 110 .

[0117] S2: Mount a plurality of shielding devices 170 on the module substrate 110 , and at least part of the shielding devices 170 are arranged between the first chip 130 and the second chip 150 .

[0118] Specifically, the front side of the module substrate 110 is designed with grounding pins 111 , and the shielding device 170 is mounted on the grounding pins 111 , and the external grounding is realized through the pins on the back side of the substrate. When mounting the shielding device 170 , a front mounting structure is adopted, the shielding substrate 171 is electrically connected to t...

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Abstract

The embodiment of the invention provides an electromagnetic shielding module structure and a preparation method of the electromagnetic shielding module structure, and relates to the technical field ofchip packaging. According to the electromagnetic shielding module structure and the preparation method, a plurality of shielding devices are mounted between a first chip and a second chip; a plasticpackaging body wraps the first chip and the second chip; the metal shielding layer covers the plastic package body, and the metal column of each shielding device is electrically connected with the metal shielding layer and the module substrate, so electromagnetic shielding is realized; the shielding devices are directly mounted on the module substrate, complex processes such as grooving and filling are avoided, the process steps are simplified, the packaging difficulty is reduced, and the production efficiency is improved; meanwhile, electromagnetic shielding is achieved through the metal columns and the metal shielding layer, and the shielding effect is good.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to an electromagnetic shielding module structure and a method for preparing the electromagnetic shielding module structure. Background technique [0002] With the rapid development of the semiconductor industry, the SIP module (system-in-package module) structure is widely used in the semiconductor industry. It packs chips with different functions and stacks them. The main advantages are high-density integration, small size of packaged products, superior product performance, and fast signal transmission frequency. As electronic products are used in high-frequency signals in the communication field, the required products have partitions. Electromagnetic shielding structure prevents electromagnetic interference between various chips and components. [0003] The existing EMI shielding technology (electromagnetic shielding technology) usually forms a metal shielding layer direct...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31H01L23/552H01L25/16
CPCH01L21/56H01L23/3128H01L23/552H01L25/16H01L2224/73204
Inventor 孔德荣钟磊李利
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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