30results about How to "To insulate" patented technology

The invention discloses a lightweight, high-strength and high-toughness foamed ceramic decorative integrated board. The board comprises a foamed lightweight material layer, a high-toughness decorativesurface layer and a wear-resistant coating layer; the foamed lightweight material layer comprises stone tailings, graphene, zirconia, a high-temperature flux, clay, a stabilizer and a dispergator; and the high-toughness decorative surface layer includes an AC foaming agent, the stabilizer, calcium carbonate, high-strength resin, a processing aid and a lubricant. The wear-resistant coating layer comprises graphene, silicon carbide whiskers, corundum powder, vermiculite, kaolin, a flame retardant, nanometer titanium dioxide, sodium phosphate, sodium silicate, hydroxyethyl cellulose, a silicone-acrylic emulsion and silica sol. The high-toughness decorative surface layer made from soft porcelain and the foamed lightweight material layer are bonded by compression molding, and the surface of the high-toughness decorative surface layer is coated with the wear-resistant coating layer, so the board has the advantages of good toughness, light weight, high strength, flame retardation, thermal insulation, good waterproof and impermeable effects and good anti-aging effect.

The invention provides a closed-loop Hall current sensor, belongs to the technical field of sensors, and solves problems that existing sensors are poor in anti-interference capacity. The closed-loop Hall current sensor comprises an insulating shell. The insulating shell is internally hollowed so that an accommodating cavity is formed. An annular magnetic core is transversely arranged in the accommodating cavity. The external surface of the annular magnetic core is provided with coils. The annular magnetic core is provided with a notch penetrating through the annular magnetic core. A Hall element is installed in the notch. An annular installing part penetrating through the insulating shell is arranged in the middle part of the annular magnetic core. The insulating shell is also internally provided with a circuit board. One end of the circuit board is respectively connected with the Hall element and the coils, and the other end of the circuit board extends so that a pin headers is formed. The pin head downwardly stretches out of the insulating shell The annular installing part is made of polyformaldehyde composite material. The closed-loop Hall current sensor has advantages of being high in sensitivity, high in anti-interference capability and convenient to install.

Provided in the invention is an open-loop hall current sensor. With the sensor, a problem of weak anti-interference capability of the existing sensor is solved. The open-loop hall current sensor comprises an insulating housing; a mounting part is arranged at the end surface of the insulating housing; and a positioning part is arranged at the side wall of the insulating housing. The middle part of the insulating housing is hollowed to form an accommodation cavity; and an annular mounting part for installing a lead is arranged in the accommodation cavity. An annular magnetic core is arranged between the annular mounting part and the insulating housing; a notch penetrating the annular magnetic core is formed in the annular magnetic core; and the annular magnetic core and the annular mounting part are arranged coaxially. A hall element and a circuit board connected with the hall element are installed in the notch. A connecting hole is formed in the insulating housing; a connecting wire connected with the circuit board is arranged in the connecting hole; and a connecting sleeve is arranged between the connecting wire and the connecting hole. The annular mounting part is made of a polyformaldehyde composite material. The open-loop hall current sensor has advantages of high anti-interference capability and convenient installation.

The invention discloses an LED bulb lamp. The LED bulb lamp comprises a lamp holder, a liner, a power module, a cooling lamp cup, a cooling substrate, an LED light-emitting plate and a lamp shade which are connected in a matched mode, wherein the lamp holder is arranged at the upper end of the liner, the liner is made of a heat-insulating material, the power module is arranged inside the liner, the liner is filled with a heat-conducting material, the cooling lamp cup comprises an inner casing and an outer casing, a cavity is formed in the center of the inner casing, the liner is arranged inside the cavity, an annular band gap space is formed between the inner casing and the outer casing and separated into a plurality of ventilating ducts which are through in an up-and-down mode, a plurality of cooling fins which are connected with the inner casing and the outer casing are arranged inside the band gap space, the band gap space is separated by the cooling fins to form the ventilating ducts, a bottom plate is arranged at the lower end of the inner casing, and the cooling substrate, the LED light-emitting plate and the lamp shade are installed on the bottom plate sequentially. According to the LED bulb lamp, the good cooling effect is achieved through the method that separated cooling of a power supply and a light-emitting portion is performed.

The invention, which belongs to the technical field of the machinery, provides a hall current sensor. With hall current sensor, a problem of weak anti-interference capability of the existing hall current sensor can be solved. The hall current sensor comprises an insulated housing; the middle part of the insulated housing is hollowed out to form an accommodation cavity; and an annular mounting part for installing a lead is arranged in the accommodation cavity. An annular magnetic core is arranged between the annular mounting part and the insulated housing; the annular mounting part and the annular magnetic core are arranged coaxially. A notch penetrating the annular magnetic core is formed in the annular magnetic core; a hall element and a circuit board connected with the hall element are installed in the notch. Besides, a connector connected with the circuit board is arranged at the outer surface of the insulated housing; and the connector contains a connecting part and a row-pin unit with four pins, wherein the connecting part and the row-pin unit are arranged in parallel. The annular mounting part is made of a paraform composite material. The hall current sensor is provided with high anti-interference capability and convenient installation.

The invention discloses a wood-property light heat-preservation building material. The wood-property light heat-preservation building material is prepared from anhydrous magnesium chloride, calcium carbonate, magnesium oxide, magnesium phosphate, a magnesite foaming agent, fire-resistant expanded polystyrene granules or expanded perlite or expanded vermiculite and short glass fibers; the anhydrousmagnesium chloride and the magnesium phosphate are put into a container and stirred in water, the temperature of a water solution is measured through a temperature gauge, and is controlled to be 20 DEG C to 40 DEG C, then the concentration is test through a Megage meter, the anhydrous-magnesium-chloride-and-magnesium-phosphate solution after meeting the standard is poured into a stirring machine,then the magnesium oxide is put, the mixture is stirred evenly, then the fire-resistant expanded polystyrene granules are put, the mixture continues to be stirred evenly, then dispersion is carried out, the glass fibers are added, the mixture continues to be stirred, the magnesite foaming agent and the calcium carbonate are poured, then the mixture is positively and negatively stirred for 2 minutes respectively, the material can be discharged, the product is poured into a mold frame, is slightly pressed and scraped to be flat to be subjected to standing, solidified and shaped, and then is demolded, the product is quietly maintained for 5 days to 10 days, and the light building material is formed. The wood-property light heat-preservation building material can have the effects of resistingfire, insulating heat, preserving heat and insulation.

The invention provides a graphene and vermiculite-based high-temperature-resistant anticorrosive paint and a preparation method. The graphene and vermiculite-based high-temperature-resistant anticorrosive paint comprises following components in percentage by mass: 0.05-10% of bentonite, 5-20% of vermiculite, 1-10% of kaolin, 1-20% of graphene, 3-10% of fused alumina powder, 5-15% of magnesium hydrate whiskers, 10-30% of titanium dioxide, 30-40% of an inorganic binder and 3-6% of silicone acrylic emulsion; and the inorganic binder comprises following components in percentage by mass: 5-20% of sodium phosphate, 60-80% of sodium silicate, 5-20% of potassium silicate and 10-30% of hydrophobic modified silica sol. The paint is featured with relatively high adhesion and needs no blasting treatment or corroding and roughening treatment on a metal surface, thereby greatly simplifying the difficulty of construction. Meanwhile, the paint would not be trapped in blistering, crazing and dropping at high temperature and plays roles of preventing water, fire, corrosion and rust, keeping warm, resisting aging, insulating and so on.

The invention relates to a method for filling organic polymer in micropores of a conductor or a semiconductor. The method includes the steps of placing the conductor or the semiconductor, with micropores, subjected to surface pretreatment in a water phase solution to conduct chemical grafting to finally realize the purpose of filling organic polymer in the micropores from bottom to top. Filling organic polymer in micropores through chemical grafting can solve the problem that flawless filling can not be achieved through a common coating and spin coating method. The filled organic polymer provides insulating and stress buffering functions and also can increase corrosion resisting performance of porous materials according to use purposes. The method is widely applied to surface treatment of various materials, and the field of microelectronic manufacture of high-class electronic devices.

The invention discloses an optical fiber slip ring for optical communication equipment, which comprises a slip ring stator, wherein bearings are fixedly connected to the front end and the rear end ofthe inner wall of the slip ring stator, the inner walls of the bearings are fixedly connected with a slip ring rotor, the surface of the slip ring stator is provided with an insulating layer, and a corrosion-resistant layer is arranged on the side, which is away from the slip ring stator, of the insulating layer. According to the invention, the advantages of insulation and corrosion resistance ofthe optical fiber slip ring are achieved through mutual cooperation of the bearings, the insulating layer, an insulating plastic layer, an insulating rubber layer, an insulating silica gel layer, thecorrosion-resistant layer, a phenolic resin paint layer, an epoxy resin coating layer and an inorganic zinc-rich paint layer; when the optical fiber slip ring is in contact with a power supply, the optical fiber slip ring can be effectively insulated, the problem that the optical fiber is short-circuited and even damaged due to the fact that electricity is conducted into the optical fiber is prevented, the service life of the optical fiber is prolonged, the corrosion resistance of the optical fiber slip ring is improved, the optical fiber slip ring is prevented from being corroded and damaged,and the service life of the optical fiber slip ring is prolonged.

The invention discloses an LED bulb lamp. The LED bulb lamp comprises a lamp holder, a liner, a power module, a cooling lamp cup, a cooling substrate, an LED light-emitting plate and a lamp shade which are connected in a matched mode, wherein the lamp holder is arranged at the upper end of the liner, the liner is made of a heat-insulating material, the power module is arranged inside the liner, the liner is filled with a heat-conducting material, the cooling lamp cup comprises an inner casing and an outer casing, a cavity is formed in the center of the inner casing, the liner is arranged inside the cavity, an annular band gap space is formed between the inner casing and the outer casing and separated into a plurality of ventilating ducts which are through in an up-and-down mode, a plurality of cooling fins which are connected with the inner casing and the outer casing are arranged inside the band gap space, the band gap space is separated by the cooling fins to form the ventilating ducts, a bottom plate is arranged at the lower end of the inner casing, and the cooling substrate, the LED light-emitting plate and the lamp shade are installed on the bottom plate sequentially. According to the LED bulb lamp, the good cooling effect is achieved through the method that separated cooling of a power supply and a light-emitting portion is performed.

The invention discloses an illumination device of an ethylene-vinyl acetate (EVA) film extruder. The illumination device is characterized in that the illumination device comprises a lamp bulb, a connection rod and a base; the bottom of the base is fixed to a frame for hoisting of a die head; one end of the connection rod is rotatingly connected to the base and the other end is connected to the lamp bulb by a lamp socket; and an electric wire in the lamp socket passes through a cavity of the connection rod, and the base, and is electrically connected to a power supply of an EVA film extruder. The illumination device is arranged on the frame above the die head, provides good illumination rays for adjustment of bolt tightness in EVA film thickness adjustment, reduces misoperation, and effectively improves work efficiency.

The invention discloses a current-conducting and light-guiding artificial cochlea electrode and a manufacturing method thereof. An optical fiber and nano-metal particles are taken as main materials; the nano-metal particles are coated on the surface of a fiber cladding by using an optical fiber metal coating device; a current-conducting metal coating is made on the fiber cladding by using a sintering technology to obtain a novel current-conductive and light-guiding artificial cochlea electrode. The novel current-conducting and light-guiding artificial cochlea electrode can be used for conducting current and guiding light, and has the advantages of an electrical cochlea and an optical cochlea; convenience is brought to research and clinical application, and an implant user can be assisted in improving the voice recognition quality; the current-conducting and light-guiding artificial cochlea electrode has great application prospects in the basic research and clinical application of artificial auditory sense. The method for manufacturing a current-conducting optical fiber by sintering nano-metal gold paste, nano-metal silver paste and nano-metal copper paste is simple in process, is free from pollution, is reliable in performance, and is suitable for manufacturing current-conducting optical fibers of various lengths.

The invention relates to a potting method applied to dairy cow electronic equipment, comprising the following steps: the first step: preparation of soft glue: two components of black fluid-like potting silica gel and white fluid-like silica gel curing agent are prepared according to 1 : 1 mass ratio, put it into a container for full mixing, and use a mixer to fully stir clockwise for 10 to 15 minutes. After the two components are fully mixed, let stand for 30 minutes at room temperature to form a mixed fluid-like soft glue, etc. The advantages of the present invention are: effective waterproof and dustproof effects can be achieved, and the electronic devices encapsulated by this process can greatly reduce the interference to the wireless signals of the electronic devices, and at the same time, can minimize the impact of the colloid on the electronic devices. The degree of corrosion damage, as well as the degree of corrosion of the equipment by the external acid and alkali liquid, play a great role in insulation, sealing, shock absorption, and anti-atmospheric aging.

The invention discloses a modular-structured elevator and its manufacturing equipment and manufacturing process, which belongs to the technical field of elevators and includes a car assembly and a shaft assembly arranged outside the car assembly. The hoistway section is a frame structure and includes a column and beams at the upper and lower ends of the column. The upper beam is provided with a slot, and the bottom of the lower beam is provided with a plug-in plate that matches the slot. The side of the section is provided with an EPS board and a buffer board in sequence from the inside to the outside, and the two boards are fastened to the column by lengthening bolts at the same time, and a first spring buffer assembly is arranged outside the buffer board, and the first spring assembly includes The first spring, one end of the first spring is sleeved on the mounting column and the other end is inserted into the slot hole in the installation wall of the well, and one end of the telescopic mounting column is movably arranged in the limit frame on the buffer press and fixed by bolts.

The invention discloses a composite adhesive film production process and application thereof in the fingerprint chip packaging field, and the composite adhesive film production process comprises the following steps: manufacturing a high-hardness wear-resistant layer, manufacturing a semi-cured bonding layer and compounding an upper layer and a lower layer: firstly coating an upper release film with the high-hardness wear-resistant layer with the thickness of 10-25 microns by using a precision coating machine; coating a semi-cured bonding layer with the thickness of 15-40 microns on the lower release film; continuously compounding the upper release film, the high-hardness wear-resistant layer, the semi-cured bonding layer and the lower release film by using a thermal compounding roller to form a roll-shaped integrated film; the method comprises the following steps: firstly, die-cutting a roll-shaped film into a proper size, then stripping a lower release film to expose a semi-cured bonding layer, and aligning to a coverage area of a fingerprint chip; and the semi-cured bonding layer and the coverage area of the fingerprint chip are hot-pressed together through a hot roller or hot pressing mode. According to the invention, the hardness and wear resistance of the adhesive film can be improved, the layer can be endowed with different colors, and the effects of toughening, bonding, insulating and sweat erosion resistance can be improved.