The invention discloses a method for plating
copper and
tin on a
metal circuit board through pattern plating. The method comprises steps of workpiece pre-treating, micro-
etching, primary cleaning,
copper plating, secondary cleaning,
tin plating and third cleaning. According to the method, after
copper is plated, workpieces are cleaned, and
tin plating operation is performed immediately; a tin
welding plane is smoother through
tin plating operation, so that the uniformity of a product is improved, and batch treatment can be performed; a
tin plating process is adopted, so that the conventional process concept is changed, the technical bias that a PCB (
Printed Circuit Board) cannot be plated with tin is eliminated, the performance of the product is improved, and the production efficiency of the product is increased; a
degreasing agent of CS-4-A or CS-4-B series is taken as a mailing component in a
degreasing process, so that the decomposing speed of
grease can be increased, and the efficiency is further increased; and a
bronzing agent is added into a
copper plating solution, so that the copper surface of the product is smooth and complete and has high flatness, and the quality of the product is improved.