The invention discloses a
copper plating device adopting an external tank for dissolving electrolytic
copper and a
copper plating technique thereof. By adopting an insoluble
anode in the plating tank,
phosphorus powder, copper
powder and insoluble impurities can be effectively prevented from being generated by the
anode, a high-purity
electroplating solution is prepared, and the
corrosion resistance of a clad layer and the quality of an electroplated product are improved; metallic copper is supplemented from the outside, no
anode mud or copper
powder or
phosphorus powder is generated, the
utilization rate of the metallic copper can be effectively increased, and electrolytic copper is cheaper than phosphorous copper and active
copper oxide powder; meanwhile, the concentration of copper ions can be controlled, the content of
copper sulfate is prevented from being increased, and the quantity of supplemented
sulfuric acid can be decreased; the
voltage loss of the anode is small, and the whole insoluble anode can conduct
electricity extremely uniformly so that the distance between a
cathode and the anode can be decreased to a large extent, the
voltage of the plating tank can be effectively reduced, and
energy consumption can be reduced; and the current efficiency difference between the
cathode and the anode is avoided, the problems that the content of the
copper sulfate is increased and
sulfuric acid consumption is high are solved, maintenance is easy, and the environmental friendliness is better.