Copper plating device and copper plating process using external tank to dissolve electrolytic copper

Abstract

The invention discloses a copper plating device adopting an external tank for dissolving electrolytic copper and a copper plating technique thereof. By adopting an insoluble anode in the plating tank, phosphorus powder, copper powder and insoluble impurities can be effectively prevented from being generated by the anode, a high-purity electroplating solution is prepared, and the corrosion resistance of a clad layer and the quality of an electroplated product are improved; metallic copper is supplemented from the outside, no anode mud or copper powder or phosphorus powder is generated, the utilization rate of the metallic copper can be effectively increased, and electrolytic copper is cheaper than phosphorous copper and active copper oxide powder; meanwhile, the concentration of copper ions can be controlled, the content of copper sulfate is prevented from being increased, and the quantity of supplemented sulfuric acid can be decreased; the voltage loss of the anode is small, and the whole insoluble anode can conduct electricity extremely uniformly so that the distance between a cathode and the anode can be decreased to a large extent, the voltage of the plating tank can be effectively reduced, and energy consumption can be reduced; and the current efficiency difference between the cathode and the anode is avoided, the problems that the content of the copper sulfate is increased and sulfuric acid consumption is high are solved, maintenance is easy, and the environmental friendliness is better.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a copper plating device and a copper plating process for supplementing copper ions consumed by cathodes through electrolytic copper. Background technique [0002] In the electroplating copper industry, sulfate copper plating (referred to as acid copper) is one of the most important electroplating processes, and phosphor copper anodes are generally used. Because electrolytic copper will produce copper powder when it dissolves, resulting in a decrease in utilization rate, so an anode containing phosphorus (0.6-0.8%) in the anode is generally used, but a small amount of black insoluble cuprous phosphide will be produced during the dissolution process of the anode , will still pollute the plating solution, so the anode titanium basket must be equipped with an anode bag to improve the purity of the plating solution, but this method still treats the symptoms but not the root cau...

AI Technical Summary

Problems solved by technology

Because electrolytic copper will produce copper powder when it dissolves, resulting in a decrease in utilization rate, so an anode containing phosphorus (0.6-0.8%) in the anode is generally used, but a small amount of black insoluble cuprous phosphide will be produced during the dissolution process of the anode , it will still pollute the plating solution, so the anode titanium basket must be equipped with an anode bag to improve the purity of the plating solution, but this method still treats the symptoms but not the root cause, and the plating layer will still have defects such as burrs and pits due to the impurity of the plating solution

At present, there are also technologies that use insoluble anode copper plating. The supplement of copper ions is to add active copper oxide powder to the solution, but the copper content of active copper oxide is only 80% of the same mass of electrolytic copper, and the unit price of active copper oxide powder It is not cheaper than electrolytic copper, so the production cost is higher than that of phosphor copper anode

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