33results about How to "Not prone to voids" patented technology

Provided is an intermediate film for laminated glass, the intermediate film being capable of suppressing an increase in the YI value of the end of laminated glass while preventing the end of the laminated glass from generating voids. This intermediate film for laminated glass has a one-layer structure or a structure of two or more layers, and the entire intermediate film contains a polyvinyl acetal resin, a plasticizer, a hindered amine light stabilizer, and a phosphorus-containing antioxidant.

The present invention provides an interlayer film for a laminated glass that is less likely to generate voids at the end of a laminated glass and can suppress an increase in the YI value at the end of the laminated glass. The interlayer film for laminated glass of the present invention has: a first layer containing polyvinyl acetal resin and a plasticizer; a second layer containing polyvinyl acetal resin and a plasticizer, and is disposed on the first layer. On the first surface side of the first layer, the first layer also contains a hindered amine light stabilizer with an alkyl or alkoxy group bonded to the nitrogen atom of the piperidine structure, and the glass transition temperature of the second layer is above 32°C.

The present invention provides an interlayer film for a laminated glass that is less likely to generate voids at the end of a laminated glass and can suppress an increase in the YI value at the end of the laminated glass. The interlayer film 1 for laminated glass of the present invention includes a first layer 2 containing a polyvinyl acetal resin and a plasticizer, and is disposed on the first surface 2a side of the first layer 2 and contains a polyvinyl acetal resin and a plasticizer. The second layer 3 of plasticizer, said first layer 2 also contains a hindered amine light stabilizer whose alkyl or alkoxy group is bonded to the nitrogen atom of the piperidine structure.

The invention discloses a method for efficiently preparing a ternary diffusion couple. The method comprises the following steps of firstly preparing a binary diffusion couple of a component A and a component B by a clamp method, then placing the prepared binary diffusion couple into a mold, adding a block-shaped component C to be diffused, covering with a graphite crucible cover, placing the graphite crucible cover into a muffle furnace, heating the graphite crucible cover to a temperature above the melting point of the component C to melt the component C, cooling the component C to a heat treatment temperature, keeping the temperature, and performing water quenching to obtain the ternary diffusion couple. The ternary diffusion couple is prepared by utilizing the contraction force when metal solidifies, and diffusion couple interfaces prepared by the method are tightly combined, so that the problem of high probability of holes at node positions of the diffusion couple when the ternarydiffusion couple is prepared is solved. The method is simple in preparation process, gaps are not easily generated between the interfaces, and the success rate of preparing the diffusion couple is high. The method is suitable for the preparation of diffusion couples of metal materials, and the prepared diffusion couples can be used for the study of phase diagrams, diffusion kinetics and thermodynamics.

The invention discloses a hot-melt anticorrosion glue, the raw materials for which are prepared include the following components in terms of mass percentage: 25-40% of petrolatum, 20-30% of styrene-isoprene-styrene synthetic rubber, 15% of petroleum resin ~25%, mineral oil 5~10%, aluminum hydroxide 10~15%, rust inhibitor 3~5%, antifungal agent 1~3%, antioxidant 1~2%. The invention also discloses a hot-melt anti-corrosion adhesive tape and a preparation method thereof. The hot-melt anti-corrosion adhesive tape includes a composite anti-corrosion adhesive layer and a release film on the composite anti-corrosion adhesive layer. The composite anti-corrosion adhesive layer is made of a base material , non-woven fabric and hot-melt anti-corrosion adhesive composite. The hot-melt anti-corrosion tape has good adhesion and high bonding strength, and can be directly wound on the pipeline when in use. It is convenient for construction and does not require multi-step anti-corrosion process. Rust, mildew, anti-corrosion effect.

The invention discloses a splicing device of a building curtain wall aluminum plate and a splicing method thereof, and belongs to the field of curtain wall splicing devices. The splicing device of thebuilding curtain wall aluminum plate comprises a shaft barrel, two pairs of extension plates are fixed to the lower end of the shaft barrel, sliding grooves are formed in one ends, away from the shaft barrel, of the extension plates, positioning rods are slidably connected in the sliding grooves, vacuum suckers are fixedly connected to the positioning rods, the vacuum suckers are connected with curtain wall aluminum plate bodies, air cylinders are connected between the vacuum suckers and the extension plates, an electromotor is fixedly connected to the upper end of a connecting piece, the power output end of the electromotor is fixedly connected with a transmission shaft, the transmission shaft is in threaded connection with a threaded sleeve, the threaded sleeve is slidably connected inthe shaft barrel, the lower end of the threaded sleeve is fixedly connected with a push plate matched with the vacuum suckers, and the push plate is provided with the connecting piece matched with thecurtain wall aluminum plate bodies, thus, the aluminum plate can be guaranteed to be tightly spliced, the splicing work is all carried out on one device, and the working efficiency is easy to improve.

The invention relates to a plug formation method and a semiconductor device equipped with the plug. The plug formation method comprises the steps of providing a substrate, forming a dielectric layer on the surface of the substrate, and forming a hole in the dielectric layer; expanding the caliber in the opening end of the hole; forming a first conductive layer on the surface of the dielectric layer, wherein the first conductive layer comprises a plug part partially filled in the hole; and removing the gap, a part of the dielectric layer and a part of the first conductive layer to expose the conductive plug with the parallel and level surface. According to the semiconductor device, the dielectric layer is arranged on the surface of the substrate; the hole is formed in the dielectric layer; the hole is filled with the conductive plug; the surface of the conductive plug is parallel and level and exposed from the dielectric layer; and the conductive plug is a solid surface. The conductive plug formed by the method disclosed in the invention has the advantages of no gap, low resistance, high reliability and the like.

This invention provides a UV-curable resin composition for use in a touchscreen. Said resin composition makes it possible to obtain, with high productivity, an optical member, such as a display unit, that exhibits good curing performance and adhesion. When said resin composition is applied to optical substrates and cured via exposure to ultraviolet light after said optical substrates are bonded together, the resulting cured-resin layer follows the contours of the substrates, minimizing gaps. Said resin composition, which is used to bond two or more optical substrates together, is characterized by containing a liquid softening component (A), a solid softening component (B), a photopolymerizable oligomer (C), a photopolymerizable monomer (D), and a photopolymerization initiator (E), wherein the mass ratio between the liquid softening component (A) and the solid softening component (B) is between 51:49 and 99:1.