123results about How to "Low Dielectric Loss Tangent" patented technology

Examples of the present invention include high electric energy density polymer film capacitors with high dielectric constant, low dielectric dissipation tangent, and low leakage current in a broad temperature range. More particularly, examples include a polymer film capacitor in which the dielectric layer comprise a copolymer of a first monomer (such as tetrafluoroethylene) and a second polar monomer. The second monomer component may be selected from vinylidene fluoride, trifluoroethylene or their mixtures, and optionally other monomers may be included to adjust the mechanical performance. The capacitors can be made by winding metallized films, plain films with metal foils, or hybrid construction where the films comprise the new compositions. The capacitors can be used in DC bus capacitors and energy storage capacitors in pulsed power systems.

The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

The invention discloses a resin composition, which comprises the following components with solids by weight: (a) 10-90 parts of cyanate ester modified polyphenylene oxide resin; (b) 10-90 parts of allyl modified bismaleimide resin; (c) 0-30 parts of epoxy resin; (d) 0-30 parts of cyanate ester resin; (e) 10-50 parts of phosphonium flame retardant; (f) 0-5 parts of curing accelerator; and (g) 0-90 parts of inorganic filler, wherein the number-average molecular weight of the cyanate ester modified polyphenylene oxide resin is 3000-7000g / mol; and the cyanate ester modified polyphenylene oxide resin is prepared by reacting 100 parts of polyphenyl ether resin and 40-250 parts of cyanate ester resin at the temperature of 90-160 DEG C for 30-120 min. The invention provides the resin composition with favorable heat resistance, and low dielectric constant and dielectric loss tangent value, and solves the problem that in the prior art, the bismaleimide resin and the polyphenyl ether resin are difficultly combined and blended.

An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.

The invention discloses a resin composition for a high-frequency high-speed substrate. Measured according to solid weights, the resin composition comprises the following components: 10-50 parts of cyanate ester resin (a), 10-40 parts of anhydride compounds (b), 5-50 parts of benzoxazine resin (c), 5-50 parts of epoxy resin (d), 5-50 parts of flame retardant (e), 0-5 parts of curing accelerator (f) and 0-80 parts of inorganic filler (g). The resin composition disclosed by the invention has high moisture and heat resistance, high glass transition temperature as well as lower dielectric constant and dielectric loss tangent value, and can be well applied to the fields such as high-frequency, high-speed and high-density interconnection and the like; and a laminated board made of the resin composition has excellent moisture and heat resistance and good bonding power.

To provide an epoxy resin composition which can form a cured material having low dielectric constant and low dielectric loss tangent in a radio frequency region, and a film obtained by using the epoxy resin composition. An epoxy resin composition comprising: (A) at least one epoxy resin selected from the group consisting of a novolac epoxy resin having a phenolic skeleton and a biphenyl skeleton, and a bifunctional linear epoxy resin having a weight average molecular weight of 10,000 to 200,000 and having a hydroxyl group; and (B) a modified phenolic novolac having a phenolic hydroxyl group, at least part of which is esterified with a fatty acid.

To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and / or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 μm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.

The invention relates to a modified polyphenylene ether resin, a thermosetting resin composition and application thereof. The modified polyphenylene ether resin has a resin structure obtained by reacting a low-molecular-weight dihydroxy-terminated polyphenylene ether represented by formula (1-1) with a diacyl halide or dicarboxylic acid containing a structural unit represented by formula (1-2), amonofunctional aromatic phenol or a monofunctional aromatic acyl halide or a monofunctional aromatic carboxylic acid. The thermosetting resin composition contains, as essential components, an epoxy resin and the modified polyphenylene ether resin. The invention also provides application of the thermosetting resin composition in prepregs, circuit boards and laminated films. The prepreg, the circuitsubstrate and the laminated film prepared from the thermosetting resin composition provided by the invention have the advantages of low dielectric constant, low tangent of dielectric loss angle highglass transition temperature, excellent heat resistance, excellent wet heat resistance, low hygroscopicity and good binding force with metal.

A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof. H-O-YaO-X-OY-Ob-H (1)

The present invention relates to a resin composition for GHz-band electronic components, the composition comprising nanoscale carbon tubes and at least one member selected from the group consisting of thermoplastic resins, curable resins, and composite resins of thermoplastic resins and curable resins; wherein the nanoscale carbon tubes are present in an amount of 0.0001 to 0.4 wt. % based on the resin; and an electronic component obtainable from the resin composition, or the like.

The invention relates to modified PTFE (polytetrafluoroethylene) fiberglass cloth for copper-clad plates and a preparation method of the fiberglass cloth. The modified PTFE fiberglass cloth comprises a fiberglass cloth body which is coated with modified polytetrafluoroethylene glue solution in the coating amount of 80-260g / m<2>. The preparation method includes uniformly mixing ceramic powder, silicon dioxide powder, silane coupling agent, water and PTFE emulsion to form the modified polytetrafluoroethylene glue solution, soaking the fiberglass cloth in the modified polytetrafluoroethylene glue solution at constant speed, removing excessive glue solution via extrusion of an extrusion roll, putting the soaked fiberglass cloth in a drying oven for drying, and finally cutting and reeling. The preparation method is simple and easy for step operation, the prepared modified PTFE fiberglass cloth can meet the requirements for electrical performance of the plates, subsequent processing cost can be lowered, addition amount of the ceramic powder is controlled to regulate the size of dielectric constant, and the copper-clad plates prepared can be applied to more fields.

To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and / or a thermoplastic elastomer.

Disclosed is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically disclosed is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100 mol% of X is composed of OCN.

A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

Disclosed is a method for producing a curing agent having an acidic substituent and an unsaturated maleimide group, wherein a maleimide compound (a) having at least two N-substituted maleimide groups in a molecule and an amine compound (b) having an acidic substituent represented by the general formula (I) below are reacted in an organic solvent. Also disclosed is a thermosetting resin composition containing a curing agent (A) obtained by the above-described method, and a compound (B) which is cured with the curing agent. A cured product of such a thermosetting resin composition has a glass transition temperature of not less than 200 DEG C. Further disclosed are a prepreg using such a thermosetting resin composition, and a laminate. The curing agent produced by this method enables to obtain a thermosetting resin composition having good solubility in an organic solvent, while being excellent in adhesion to metal foils, heat resistance, moisture resistance, flame retardance, copper cladding heat resistance, low dielectric characteristics and low dielectric loss tangent property. Consequently, the curing agent enables to obtain a prepreg or a laminate having excellent properties useful for printed wiring boards for electronic devices.

The invention discloses an anti-reduction dielectric ceramic material matched with a copper inner electrode and sintered under high frequency and low temperature. The dielectric ceramic material can be used for manufacturing multi-layer ceramic capacitors made of copper inner electrodes. The dielectric ceramic material comprises main crystal phase, modified additives and sintering fluxing agents,wherein the structure of the main crystal phase is MgxBa(1-x)ZrySi(1-y)O3, x is not less than 0.8 and not more than 0.95 and y is not less than 0.05 and not more than 0.2; the modified additive is one or more of MnO2, CaO, Li2O, Bi2O3 and TiO2; and the sintering fluxing agent is one or more of B2O3, SiO2, ZnO, CuO, K2O and BaO. The dielectric ceramic material meets the EIA standard, conforms to COG characteristic, has the characteristics of uniformity, uniform grain size distribution, high dispersibility and good forming process, conforms to the environment protection requirement and has excellent dielectric property.

To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent.A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007.

To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group) / (sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

The invention discloses a thermosetting laser-induced metallization thermal-conduction composite material with a stable high dielectric constant. The material comprises the following components in percentage by weight, 20-50% of thermosetting matrix resin, 0.1-0.5% of an initiator, 0.05-0.1% of a thickener, 5-10% of a laser induction additive, 15-60% of a high dielectric ceramic filler, 0.01-0.08% of a surfactant, 0-1.5% of a low-shrinkage additive, and 10-45% of a high-thermal-conductivity filler. The total of the components is 100%. Under high frequency, the material provided by the invention has good high dielectric constant stability, low dielectric loss angle tangent, and good laser-induced metallization property. The composite material also has a good linear expansion coefficient, an effectively controlled shrinkage rate, and good dimensional stability.

The present invention relates to a coupling agent containing diphenylsulfone amino-silane and the related preparation method, which is technically characterized in that 4,4-diphenylsulfone and gamma-chloropropthyl type silane are taken as raw materials and dimethyl formamide is used as the solvent. Preparation steps are as follows: the solvent dimethyl formamide and the raw materials 4,4-diphenylsulfone are sequentially added to three flasks to be stirred until dissolved, then nitrogen gas is input to the flasks; when the flasks are slowly heated to 100 or 150 DEG C, a certain amount of gamma-chloropropthyl type silane are dropped into the flasks, after that, the liquid in the flasks is reflowed to 5 - 15 h at the right temperature; then, the coupling agent can be produced after decompression distillation and the removal of the solvent. The introduction of diphenylsulfone reduces the polarity of active amido, so that the coupling agent is provided with a low dielectric loss angle tangent value. When the coupling agent is used for glass fiber-reinforced epoxy resin or cyanate ester resin and other thermosetting resin composite materials, the dielectric performance of such composite materials can be increased, therefore, the coupling agent is widely applied to wave-transparent composite material field, such as antennas and radomes.

A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.