1185results about How to "Increase transfer speed" patented technology

The pixel (1) for use in an image sensor comprises a plurality of small-sized radiation-sensitive elements (2.1-2.9) for converting incident radiation into electric signals, the radiation-sensitive elements (2.1-2.9) being properly interconnected to form a larger radiation-sensitive area. The pixel (1) further comprises a plurality of storage elements (3A-3D) for storing the electric signals. The pixel further comprises transfer means for transferring the electric signals from the radiation-sensitive elements (2.1-2.9) to any selected one of the storage elements (3A-3D). The pixel (1) exhibits a high optical sensitivity and a high demodulation speed, and is especially suited for distance-measuring sensors based on the time-of-flight (TOF) principle or interferometry.

A high-speed wireless LAN system is disclosed. The system includes a mobile station for transmitting / receiving data encrypted by a predetermined encryption method, communicating the data to associated access points by an ultra wide-band (UWB) communication method, and communicating an encryption key according to the encryption method to said associated access points by an optical or infra-red (IR) communication method; the plurality of access points, installed in a plurality of predetermined service areas, for relaying between the mobile station and a gateway of a remote place by communicating the data and the encryption key with the mobile station located in the corresponding service area by the UWB and the optical or IR communication methods and transmitting / receiving the data and the encryption key to / from the gateway by an optical communication method; and the gateway for providing an optical interface between an internal network and an external network, being provided with a plurality of gateway sub-modules for transmitting / receiving the data and the encryption key by communicating with the plurality of access points by the optical communication method, and transmitting a subscriber service transmitted from the external network to the corresponding access point.

A memory structure for storing memory vectors in at least one storage location. A plurality of storage locations store memory vectors. After configuration each storage location has a length adapted to a length of a memory vector stored therein. The storage locations are arranged parallel to each other and extend from a memory input deeper into the memory such that each memory vector is arranged to be undividedly stored in sequential order with a beginning of a vector at the memory input. Storage place addressing is made to the memory input. Input buffers are arranged to input the memory vectors in unbroken sequence according to the addressing. The vectors are inputted in a buffer-by-buffer manner. Output buffers are arranged to output the memory vectors in unbroken sequence according to the addressing in a buffer-by-buffer manner.

The present invention is a system and method for distributed, highly scalable, wide area peer-to-peer network data storage. The functionally equivalent servers in the system are divided into groups. Each server maintains a dynamic list which is polled to determine the availability of the closest neighbor servers. Each server is switched between the groups of servers to optimize network connectivity parameters. Data and directory files are divided into a plurality of pieces which are stored on different servers. Files are uniformly and independently named, utilizing a tree with a common root, logical pathways, and unique file identifiers. When a server receives a client request for file system access, the plurality of file pieces are collected and sent to the client server from the neighbor servers simultaneously in order to optimize bandwidth. Servers with maximum throughput capacity are utilized for highest transmission speed and reduced processing time.

Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes 36 and the via holes 66 to be connected to solder bumps 76 (conductive connection pins 78), respectively, are directly connected to one another, excellent reliability in connection is ensured.