What is described is a placement
machine (100, 300, 500) for equipping a substrate (190) with unhoused chips (282). The placement
machine (100, 300, 500) has (a) a
chassis (112); (b) a feed device (140) for providing a
wafer (180) which has a multiplicity of chips (282), wherein the feed device (140) is mounted on the
chassis (112); (c) a lifting device (513), which is mounted on the
chassis (112); (d) a substrate-receiving device (130) for receiving the substrate (190) to be equipped, wherein the substrate-receiving device (130) is mounted on the lifting device (513) and can be moved relative to the chassis (112) along a z-direction by means of the lifting device (513); and (e) a placement head (120) for picking up chips (282) from the provided
wafer (180) and for placing the picked-up chips (282) at predefined placement positions on the received substrate (190). The substrate-receiving device (130) has (d1) a one-piece support element (132, 332, 532), which constitutes at least an upper part of the substrate-receiving device (130), wherein the substrate (190) to be equipped can be laid on the one-piece support element (132, 332, 532); and (d2) a transport device (160) for transporting the substrate (190) on an upper side of the one-piece support element (132, 332, 532) along a transport direction (T). The transport device (160) is spatially integrated in the one-piece support element (132, 332, 532) on the upper side of the one-piece support element (132, 332, 532). A method for equipping a substrate (190) with unhoused chips (282) using a placement
machine (100, 300, 500) of this type is also described.