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33 results about "Substrate channeling" patented technology
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Substrate channeling is the passing of the intermediary metabolic product of one enzyme directly to another enzyme or active site without its release into solution. When several consecutive enzymes of a metabolic pathway channel substrates between themselves, this is called a metabolon. Channeling can make a metabolic pathway more rapid and efficient than it would be if the enzymes were randomly distributed in the cytosol, or prevent the release of unstable intermediates. It can also protect an intermediate from being consumed by competing reactions catalyzed by other enzymes.
Flash memory cell and methods for programming and erasing
ActiveUS20060291282A1Facilitate device scaling effortsMitigates and avoids interface damageRead-only memoriesSemiconductor/solid-state device manufacturingElectricityElectrical battery
Owner:MONTEREY RES LLC
Spatial localization of dispersed single walled carbon nanotubes into useful structures
InactiveUS6896864B2Improve structural performanceMaterial nanotechnologyNanostructure manufactureBinding siteAqueous solution
Methods of aligning single walled carbon nanotube structures into selected orientations for a variety of different applications are achieved by initially dispersing the nanotube structures in aqueous solutions utilizing a suitable dispersal agent. The dispersal agent coats each individual nanotube structure in solution. The dispersal agent may be substituted with a suitable functional group that reacts with a corresponding binding site. Dispersed nanotube structures coated with substituted dispersal agents are exposed to a selected array of binding sites such that the nanotubes align with the binding sites due to the binding of the substituted functional groups with such binding sites. Alternatively, crystalline nanotube material is formed upon deposition of dispersed nanotube structures within solution into channels disposed on the surface of the substrate. Combining dispersal agent chemical modification techniques with deposition of the nanotubes into substrate channels is also utilized to produce useful structures.
Owner:BATTELLE MEMORIAL INST
Image sensor device
ActiveUS9899442B2Semiconductor/solid-state device detailsSolid-state devicesRedistribution layerLead bonding
Owner:INVENSAS LLC
Cooling of substrate using interposer channels
ActiveUS20060042825A1Improve cooling effectPrinted circuit assemblingSemiconductor/solid-state device detailsChannel couplingInterposer
A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.
Owner:GLOBALFOUNDRIES US INC
On-chip fluid recirculation pump for micro-fluid applications
ActiveUS8814293B2Minimize maintenanceAvoid wastingInking apparatusOther printing apparatusProduction rateEvaporation
Owner:SHANGHAI AUREFLUIDICS TECH CO LTD
Enhanced bit-line pre-charge scheme for increasing channel boosting in non-volatile storage
Owner:SANDISK TECH LLC
Enhanced bit-line pre-charge scheme for increasing channel boosting in non-volatile storage
Channel boosting is improved in non-volatile storage to reduce program disturb. A pre-charge module voltage source is used to pre-charge bit lines during a programming operation. The pre-charge module voltage source is coupled to a substrate channel via the bit lines to boost the channel. An additional source of boosting is provided by electromagnetically coupling a voltage from a conductive element to the bit lines and the channel. To achieve this, the bit lines and the channel are allowed to float together by disconnecting the bit lines from the voltage sources. The conductive element can be a source line, power supply line or substrate body, for instance, which receives an increasing voltage during the pre-charging and is proximate to the bit lines.
Owner:SANDISK TECH LLC
Spatial localization of dispersed single walled carbon nanotubes into useful structures
InactiveUS20050031526A1Improve structural performanceMaterial nanotechnologyNanostructure manufactureBinding siteAqueous solution
Methods of aligning single walled carbon nanotube structures into selected orientations for a variety of different applications are achieved by initially dispersing the nanotube structures in aqueous solutions utilizing a suitable dispersal agent. The dispersal agent coats each individual nanotube structure in solution. The dispersal agent may be substituted with a suitable functional group that reacts with a corresponding binding site. Dispersed nanotube structures coated with substituted dispersal agents are exposed to a selected array of binding sites such that the nanotubes align with the binding sites due to the binding of the substituted functional groups with such binding sites. Alternatively, crystalline nanotube material is formed upon deposition of dispersed nanotube structures within solution into channels disposed on the surface of the substrate. Combining dispersal agent chemical modification techniques with deposition of the nanotubes into substrate channels is also utilized to produce useful structures.
Owner:BATTELLE MEMORIAL INST
On-chip fluid recirculation pump for micro-fluid applications
ActiveUS20130182022A1Minimizing operational maintenanceAvoids wasteful fluid spittingInking apparatusOther printing apparatusProduction rateEvaporation
A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few.
Owner:SHANGHAI AUREFLUIDICS TECH CO LTD
Micro-device and method for non-invasive and selective separation and extraction of particles in polydispersed suspensions, production method, and the applications thereof
InactiveCN102026699AEfficient separationEasy to countHaemofiltrationMicroorganism separationHuman cellEngineering
The invention relates to a micro-device for non-invasive and selective separation and extraction of particles in polydispersed suspensions by means of the strategic use of ultrasounds, laminar flow and standing wave effects in a channel produced in a chip by means of microtechnology. Said device is a resonant multi-layer system comprising a modified ''lambda quarter wavelength'' treatment channel, which enables the particles to be channelled and separated in a flow inside the substrate channel without touching the walls of the device, in order to avoid problems of adherence. Said micro-device can be used in the field of biomedicine and / or biotechnology for the separation and concentration of cells, preferably human cells, that can be used for investigative and medical methods for diagnosis and treatment.
Owner:CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS (CSIC) +2
Cooling of substrate using interposer channels
ActiveUS7434308B2Printed circuit assemblingSemiconductor/solid-state device detailsChannel couplingInterposer
A structure, and method of forming and cooling the structure. The structure may include a substrate (e.g., a semiconductor chip) having N continuous substrate channels and an interposer having N continuous interposer channels (N≧2). The N interposer channels are coupled to the N substrate channels to form M continuous loops (1≦M≦N). The M loops may transfer heat from a heat source within the substrate to the interposer and then to a heat sink thermally coupled to the interposer. The structure may include an interposer having a thermally conductive enclosure surrounding a cavity. The cavity contains a thermally conductive foam material (e.g., graphite foam). The foam material contains a serpentine channel having contiguously connected channel segments. The serpentine channel may transfer heat from a heat source within a substrate (e.g., a semiconductor chip) to the interposer and then to a heat sink thermally coupled to the interposer.
Owner:GLOBALFOUNDRIES US INC
Recombinant bacillus subtilis and construction method and application thereof
ActiveCN108998402AReduce metabolic burdenDoes not affect life activitiesBacteriaHydrolasesLife activityBacterial strain
Owner:JIANGNAN UNIV
Micro-channel heat exchanger for drop-shaped pin fins
InactiveCN104576573AIncrease the heat exchange areaWell mixedSemiconductor/solid-state device detailsSolid-state devicesPlate heat exchangerGlass cover
The invention discloses a micro-channel heat exchanger for drop-shaped pin fins. A cooling working medium inlet of a channel is connected with the inlet end of the channel; the outlet end of the channel is connected with a cooling working medium outlet; a cooling silicon substrate channel is formed between the inlet end and the outlet end of the channel; the drop-shaped pin fins are placed inside the cooling silicon substrate channel; a glass cover plate is adhered to the top end of the structure for heat insulation. The cooling silicon substrate channel is etched into a micro channel for the drop-shaped pin fins. According to the micro-channel heat exchanger, without adding an additional drive or control device, the aim of enhancing heat exchange can be achieved by increasing a heat exchange area through the simple drop-shaped pin fin structure and enhancing the mixing of cold fluid and hot fluid.
Owner:BEIJING UNIV OF TECH
Separation media, multiple electrospray nozzle system and method
InactiveUS6956207B2Increase flow rateExtending useful fluid flow rate rangeComponent separationSamples introduction/extractionChromatographic separationMicro column
A microfabricated silicon chip with a separation material, such as in situ prepared porous polymer monoliths in its microchannels is disclosed. The polymer monoliths are liquid-permeable and serve as microcolumns for liquid chromatography, which are prepared by in situ radical polymerization of a mixture containing vinyl monomers and solvents (porogen) in the microchannels. A method and system are disclosed to generate one or more electrospray plumes from one or more nozzles that provide an ion intensity as measured by a mass spectrometer that is approximately proportional to the number of electrospray plumes formed for analyses contained within the fluid. A plurality of electrospray devices can be used in the form of an array of miniaturized separate electrospray devices for the purpose of generating multiple electrospray plumes from multiple nozzles for the same fluid for analysis. This invention dramatically increases the sensitivity of microchip electrospray devices compared to prior disclosed systems and methods. The silicon chip having the packed microchannels disclosed herein finds application in coupling with mass spectrometry for sample analysis. Also disclosed is a separation block having multiple through-substrate channels filled with a separation material such as polymer monolith which can be stacked in multiple blocks for sequential two-dimensional chromatographic separation and integrated with the electrospray device.
Owner:ADVION
Fluid coupler and a device arranged with the same
InactiveUS7331655B2Semiconductor/solid-state device detailsSolid-state devicesChannel couplingFluid coupling
Plural film layers are disposed on a substrate. Each film layer has regions devoid of film material, thus forming film layer cavity openings. Each film layer has its cavities arranged to provide fluid coupling with its adjacent film layer or layers. The film layer cavities form a traverse channel coupling the top and bottom film layers and also one or more lateral channels coupling cavity openings in the top film layer. The film layer traverse channel couples with a substrate channel that extends from the substrate top surface to one or more of its other surfaces. A device such as a fluid dispenser, fluid ejector, sensor or bioprocessing device is disposed on the top film layer and fluidly coupled to the plural film layers traverse and lateral channels. The traverse channel and the one or more lateral channels are arranged to transport or flow one or more fluids.
Owner:XEROX CORP
Sealing process for non-phase change inhibition heat transfer substrate channel opening
InactiveCN104308366ASmall welding heat affected zoneReduce welding difficultyLaser beam welding apparatusSurface layerEngineering
The invention relates to a sealing process for a non-phase change inhibition heat transfer substrate channel opening. The sealing process includes: using mechanical force or other external force to compress the compression area of the grid working medium channel on the upstream of a filling opening in a non-phase change inhibition heat transfer substrate; adjusting the welding head of a laser welding machine to reach a preset welding part, starting a welding program, and performing straight-line-shaped weld joint welding on the upstream of the filling opening to allow the surface layer and the inner layer of a grid working medium channel to be fused together so as to complete the sealing of the grid working medium channel opening. The sealing process has the advantages that the process is simple and high in welding efficiency, finished products are attractive in appearance and reliable in sealing, and automatic production can be achieved.
Owner:兰州陇星沃尔凯采暖设备制造集团有限公司
Ring-gate structure field effect transistor and preparation method thereof
InactiveCN106601815AReduce leakageSmall sizeSemiconductor/solid-state device manufacturingSemiconductor devicesInsulation layerField-effect transistor
The invention is suitable for a semiconductor device and provides a ring-gate structure field effect transistor, which comprises a substrate, a silicon dioxide layer deposited on the substrate, and grid, source and drain electrodes deposited on the silicon dioxide layer. The grid electrode comprises an active layer, an insulation layer wrapping around the active layer and a metal layer wrapping around the insulation layer, wherein the insulation layer is made of a high-dielectric-constant dielectric material. The ring-gate structure field effect transistor, by adopting the high-dielectric-constant dielectric material to serve as the insulation layer, has a good insulation property, can produce a higher field effect between the grid electrode and a substrate channel, can reduce transistor electric leakage amount and reduce device power consumption and heating, and enables the size of the transistor to be further reduced.
Owner:SHENZHEN UNIV
Method for transforming bacillus subtilis FMMs and application thereof
ActiveCN110295135AIncrease productionIncrease the proportionBacteriaAntibody mimetics/scaffoldsN-AcetylglucosamineMicrobiology
The invention discloses a method for transforming bacillus subtilis FMMs and application thereof, and belongs to the technical field of genetic engineering. According to the method, the ratio of FMMson a plasma membrane is remarkably increased by strengthening the sterol analogue precursor synthetase, namely squalene synthase and scaffold protein. Compared with a control strain BSGN6-AY, the recombinant bacillus subtilis BSGFMM1-AY constructed through the method can immobilize more pathway enzyme required by N-acetylglucosamine in FMMs to form a substrate channel, and the catalytic efficiencyof the enzyme is remarkably improved. In a shake flask fermentation process of a composite culture medium, the GlcNAc titer of the control strain BSGN6-AY is only 2.84 g / L, and the GlcNAc titer of the BSGFMM1-AY is increased to 8.86 g / L. The construction method of the recombinant bacillus subtilis is simple, high in universality and convenient to use, and has good application prospects.
Owner:JIANGNAN UNIV
Trench-type semiconductor device structure
ActiveUS7985998B2Easy to controlExcessive diffusionTransistorSolid-state devicesGate dielectricSemiconductor
A trench-type semiconductor device structure is disclosed. The structure includes a semiconductor substrate, a gate dielectric layer and a substrate channel structure. The semiconductor substrate includes a trench having an upper portion and a lower portion. The upper portion includes a conductive layer formed therein. The lower portion includes a trench capacitor formed therein. The gate dielectric layer is located between the semiconductor substrate and the conductive layer. The substrate channel structure with openings, adjacent to the trench, is electrically connected to the semiconductor substrate via the openings.
Owner:NAN YA TECH
Split-gate SONOS (Semiconductor Oxide Nitride Oxide Semiconductor) memory device
ActiveCN109817632AImprove performanceReduce manufacturing costSolid-state devicesSemiconductor devicesManufacturing cost reductionPolysilicon gate
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Display panel film layer structure and preparation process thereof
ActiveCN109991772AImprove adhesionReduce the haze problemNon-linear opticsInput/output processes for data processingDisplay deviceEngineering
The invention relates to a display panel film layer structure. The display panel film layer structure comprises a substrate, a conductive film layer, an optical adhesive film layer and a cover body, wherein the substrate, the conductive film layer, the optical adhesive film layer and the cover body are stacked; the conductive film layer comprises a first electrode and a second electrode which aresequentially arranged from bottom to top; the optical adhesive film layer is arranged between the first electrode and the second electrode; and the substrate is provided with a substrate channel for accommodating the first electrode. Metal nano-particles are deposited in a grid channel formed by etching a TFE upper-layer film through atomic layer deposition to form macroscopic metal nanowires, sothat the adhesion between the metal nanowires and the substrate is improved, and meanwhile, the haze problem of a display device can be improved.
Owner:GUANGZHOU GOVISIONOX TECH CO LTD
Oven for baking battery substrate
InactiveCN104259078ASimple processEvenly heatedPretreated surfacesCoatingsCooking & bakingOrganic solvent
The invention provides an oven for baking a battery substrate. An upper row roller set and a lower row of roller set which are distributed alternately are arranged inside an oven box; a substrate channel is formed in a vertical direction between the upper row of roller set and the lower row of roller set; a heating pipe and a substrate channel are alternately distributed; the substrate can move inside the heating channel while being heated; an air blowing mechanism which is arranged inside the box body timely takes away evaporated water vapor and organic solvent when the substrate is heated and vacuumization and inert gas injection are not required; an unreeling mechanism, the box body and a rolling-up mechanism are sequentially connected along the movement direction of the substrate. The oven for baking the battery substrate has the advantages that enabling unreeling, baking and rolling up to be achieved in one step and simplifying working processes; enabling the substrate to be unfolded completely inside the box body and being uniform in heating; shortening the baking time and improving the baking efficiency due to the fact that the air blowing mechanism timely takes away evaporated water vapor and organic solvent when the substrate is heated; heating double sides of the substrate and being applicable to the substrate with one coated side or two coated sides due to the fact that the heating pipe and the substrate are alternately arranged.
Owner:SHENZHEN HAONENG TECH
A substrate glass platinum channel structure and its preparation method and filler for the substrate glass platinum channel structure
The invention discloses a substrate glass platinum channel structure and a preparation method thereof, and a filler for the substrate glass platinum channel structure, and aims to protect the platinum channel by using the ZrO2-based filler, thereby prolonging the service life of the platinum channel. The technical scheme is as follows: the substrate glass platinum channel structure comprises a platinum channel, and an upper-layer refractory material and a lower-layer refractory material which are coated on the periphery of the platinum channel, wherein the lower-layer refractory material is provided with a groove for placing the platinum channel, and the depth and width of the groove are respectively greater than the diameter of the platinum channel; the refractory materials are used for supporting and soaking the platinum channel; the fire resistance of the refractory materials is greater than 1700 DEG C; a clearance respectively is left between the platinum channel and the upper and lower refractory materials, and filled with a filler; the filler comprises the following components in percentage by mass: 70-85% of ZrO2, 5-20% of Al2O3 and 1-10% of SiO2; and the sintering temperature of the filler is 1100-1300 DEG C.
Owner:IRICO DISPLAY DEVICES
Image pick-up module set, molded circuit board assembly thereof, molded circuit board assembly semi-finished product, manufacturing method and electronic device
PendingCN108965650ATelevision system detailsColor television detailsWork in processElectronic component
The invention provides an image pick-up module set, a molded circuit board assembly thereof, a molded circuit board assembly semi-finished product, a manufacturing method and an electronic device withthe image pick-up module set. The image pick-up module set comprises at least one optical lens, at least one back molded part, at least one photosensitive element, and a circuit board; the circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive region of the photosensitive element is mounted on the substrate back surface of the substrate; the photosensitive region and the other part of the non-photosensitive region of the photosensitive element are corresponding to the substrate channel of the substrate; the back molded part is integrally bonded to at least a portion of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
Owner:NINGBO SUNNY OPOTECH CO LTD
Fusion protein for catalyzing glucose to synthesize D-psicose and construction method thereof
PendingCN114591940AReduce manufacturing costSuitable for mass productionBacteriaAntibody mimetics/scaffoldsEngineeringPsicose
The invention provides a fusion protein for catalyzing glucose to synthesize D-psicose and a construction method of the fusion protein, and relates to the field of biochemical engineering. In order to avoid the problems of low conversion efficiency and the like caused by diffusion of an intermediate product in a double-enzyme catalysis system, the fusion protein connected by connecting peptides with different lengths is constructed, and the conversion efficiency is improved by constructing a substrate channel. Specifically, a glucose isomerase gene and D-psicose 3-epimerase are connected by using a flexible connecting peptide and a rigid connecting peptide with different lengths, and a result shows that the synthesis efficiency of D psicose is improved along with the increase of the length of the connecting peptide, and the rigid connecting peptide is superior to the flexible connecting peptide. According to the fusion protein provided by the invention, an intermediate product is transferred to a next enzyme through a substrate channel, so that diffusion of the intermediate product is reduced, and the synthesis efficiency of D-psicose is improved.
Owner:ZHENGZHOU UNIV
Method for artificially constructing chitin corpuscle multienzyme complex scoford-chiC-chiA-sg and application
PendingCN112522246AImprove degradation efficiencyHigh Monosaccharide YieldEnzyme stabilisationOn/in organic carrierMultienzyme complexesChitinase
The invention provides a method for artificially constructing a chitin corpuscle multienzyme complex scoford-chiC-chiA-sg and an application. According to the multienzyme complex, interacting proteinpairs existing in cellosomes from the nature are used for artificially fusing to express cohesins in the cellosomes to construct a protein scaffold, and anchoring protein is fused and expressed on corresponding chitin incision enzymes, chitin excision enzymes and N-acetylglucosaminidase, and then extracellular self-assembly is carried out on the protein scaffold and the chitinase to obtain a chitinase multienzyme complex; and then the multienzyme complex is applied to degradation of chitin to prepare N-acetylglucosamine. The multienzyme complex not only realizes extracellular self-assembly offree chitinase, but also fixes the distance between enzymes, improves the synergistic effect of enzyme elements in a system and generates a substrate channel, so that the degradation efficiency of thechitin is improved, a single monosaccharide product is obtained, and the cost of production and subsequent separation is reduced.
Owner:NANJING UNIV OF TECH
FinFET structure and manufacture method thereof
ActiveCN105470253AImprove short channel effectIncrease working currentTransistorSemiconductor/solid-state device manufacturingEngineeringNew device
The invention provides a FinFET structure and a manufacture method thereof. The FinFET structure comprises a substrate, a first fin, a second fin, a grid lamination layer, a source region, a drain region, sidewalls and a substrate channel region, wherein the first and second fins parallel with each other are placed on the substrate; the grid lamination layer covers the substrate and part of the sidewalls of the first and second fins; the source region is placed in the area, not covered by the grid lamination layer, of the first fin; the drain region, is placed in the area, not covered by the grid lamination layer, of the second fin; the sidewalls are placed at the two sides of the first fin and the two sides of the second fin respectively and on the grid lamination layer to isolate the source region, the drain region and the grid lamination layer from one another; and the substrate channel region is placed in the substrate in an area close to the upper surface. According to the invention, the new device structure is provided on the basis of a present FinFET technology, and the grid length of the device is not limited by the footprint size, and the problem caused by the short channel effects is effectively solved.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Semiconductor device and manufacturing method thereof
ActiveCN104112665BImprove reliabilitySuppression of punch-through effectSemiconductor/solid-state device manufacturingSemiconductor devicesSemiconductorImpurity
The invention discloses a semiconductor device manufacturing method which comprises the following steps: forming a plurality of fins extending along a first direction and trenches on a substrate; forming a shallow trench isolation in the trenches, wherein the shallow trench isolation at least includes one doped isolating layer; and carrying out annealing to enable impurities in the doped isolating layers to be diffused into an adjacent substrate channel to form a punch-through barrier layer. According to the semiconductor device and the manufacturing method thereof of the invention, a plurality of stacks of doped layers and isolating layers are formed in the trenches on the sides of the fins and the uniform and steep punch-through barrier layer is formed through annealing and diffusion, which effectively restrains the parasitic channel effect and the channel punch-through effect, simplifies the process, and improves the reliability of the device.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Ketolytic acid hydroxymethyltransferase mutant, coding gene and application of mutant
PendingCN113462669AClear structureIncrease enzyme activityTransferasesMicroorganism based processesSite-directed mutagenesisEngineered genetic
The invention relates to the field of gene engineering, in particular to a corynebacterium glutamicum sourced ketolytic acid hydroxymethyltransferase mutant, a coding gene thereof and application of the mutant in preparation of ketopantoic acid and D-pantothenic acid. By means of a computer simulation technology, key amino acid sites around a substrate channel and an active pocket are predicted and mutated, and a series of mutants are obtained. The ketolytic acid hydroxymethyltransferase mutant is obtained by carrying out site-specific mutagenesis on the 18th site, the 20th site, the 21st site, the 24th site, the 25th site, the 26th site, the 27th site and the 49th site of an amino acid sequence as shown in SEQ ID NO: 1. In the finally obtained ketolytic acid hydroxymethyltransferase mutant, the enzyme activity is obviously changed, and the catalytic activity and substrate tolerance of the mutant are greatly improved when alpha-ketoisovaleric acid is catalyzed to generate ketopantoic acid compared with a wild enzyme.
Owner:ZHEJIANG UNIV OF TECH
Array image pick-up module set, molded circuit board assembly thereof, manufacturing method and electronic device
The invention provides an array image pick-up module set, a molded circuit board assembly thereof, a manufacturing method and an electronic device. The image pick-up module set comprises at least oneback molded part, at least two optical lenses, at least two photosensitive elements, and at least one circuit board; the circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive region of each photosensitive element is conductively connected with the substrate at the substrate back surfaceof the substrate, so that the photosensitive region and the other part of the non-photosensitive region of each photosensitive element are corresponding to the substrate channel of the substrate; theback molded part is integrally bonded to at least a portion of the substrate back surface of the substrate; and each optical lens is arranged in the photosensitive path of each photosensitive element.
Owner:NINGBO SUNNY OPOTECH CO LTD
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