Image pick-up module set, molded circuit board assembly thereof, molded circuit board assembly semi-finished product, manufacturing method and electronic device

Abstract

The invention provides an image pick-up module set, a molded circuit board assembly thereof, a molded circuit board assembly semi-finished product, a manufacturing method and an electronic device withthe image pick-up module set. The image pick-up module set comprises at least one optical lens, at least one back molded part, at least one photosensitive element, and a circuit board; the circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive region of the photosensitive element is mounted on the substrate back surface of the substrate; the photosensitive region and the other part of the non-photosensitive region of the photosensitive element are corresponding to the substrate channel of the substrate; the back molded part is integrally bonded to at least a portion of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.

Description

technical field [0001] The invention relates to the field of optical imaging, in particular to a camera module and its molded circuit board assembly, semi-finished molded circuit board assembly, manufacturing method and electronic equipment. Background technique [0002] At present, portable electronic devices are becoming thinner and thinner, which causes the lens end of the camera module configured on the portable electronic device to be forced to protrude from the surface of the portable electronic device. For example, for the rear camera module, the camera module The lens end of the camera group is forced to protrude from the back of the portable electronic device, and the more the camera module has a long focal length and a large zoom range, the more obvious the lens end protrudes. Since portable electronic devices such as smartphones and tablet computers now adopt a flat-panel design, the lens end protrudes from the surface of the portable electronic device, which will...

AI Technical Summary

Problems solved by technology

[0004] First, these passive components, the photosensitive element and the support are mounted on the same side of the circuit board, and no matter in the horizontal direction or in the height direction, adjacent to the passive components A safe distance needs to be reserved between the passive components and the photosensitive element, between the photosensitive element and the support, and between the passive components and the support, which leads to the Neither the size of the camera module in the horizontal direction nor the size in the height direction can be reduced

[0005] Secondly, after mounting the photosensitive element on the circuit board, a group of gold wires need to be formed on at least one side of the photosensitive element through a wire bonding process to electrically connect the photosensitive element and the circuit board, and in order to ensure good electrical properties of the gold wires, a safe distance needs to be reserved between the passive components and the gold wires, which further leads to the inability to reduce the length and width of the camera module

[0006] Third, these passive components and the photosensitive components are located in the same space, which leads to the shedding of the surface of the passive components due to oxidation or the connection position between the passive components and the circuit board. The exfoliated matter easily adheres to the photosensitive area of ​​the photosensitive element, or adheres to the filter element held in the photosensitive path of the photosensitive element, resulting in the undesirable phenomenon of smudged spots.

[0007] Fourth, the support is mounted on the circuit board by a fluid adhesive such as glue applied to the circuit board. During this process, the fluid glue may flow to the The photosensitive area of ​​the photosensitive element, which causes the photosensitive area of ​​the photosensitive element to be polluted

[0008] In addition, the current camera module mounts the photosensitive element on the surface of the substrate, which results in a limited distance between the photosensitive element and the optical lens. In order to reduce the height dimension of the camera module, the camera module can only be realized by reducing the distance between the photosensitive element and the optical lens, which leads to the focal length and zoom range of the camera module is reduced so as to seriously affect the performance and development space of the camera module

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