36 results about "Excimer laser irradiation" patented technology

The present invention provides an optical synthetic quartz glass material which substantially does not cause changes in transmitted wave surface (TWS) by solarization, compaction (TWS delayed), rarefaction (TWS progressed) and photorefractive effect when ArF excimer laser irradiation is applied at a low energy density, e.g. at energy density per pulse of 0.3 mJ / cm2 or less. The present invention further provides a method for manufacturing the same. In order to solve the above-mentioned problems, the optical synthetic quartz glass material of the present invention is characterized in that, in a synthetic quartz glass prepared by a flame hydrolysis method using a silicon compound as a material, the followings are satisfied that the amount of SiOH is within a range of more than 10 ppm by weight to 400 ppm by weight, content of fluorine is 30 to 1000 ppm by weight, content of hydrogen is 0.1×1017 to 10×1017 molecules / cm3 and, when the amounts of SiOH and fluorine are A and B, respectively, total amount of A and B is 100 ppm by weight or more and B / A is 0.25 to 25.

In the present invention, in a water soluble resin composition for use in a method for pattern formation in which a covering layer is provided on a resist pattern formed of a radiation-sensitive resin composition capable of coping with ArF exposure to increase the width of the resist pattern and thus to realize effective formation of higher density trench or hole pattern, the size reduction level of the resist pattern layer can be further increased as compared with that in the prior art technique, and, in addition, the size reduction level dependency of the coarse-and-fine resist pattern can be reduced. A method for pattern formation using the water soluble resin composition is also provided. The water soluble resin composition which is usable for the method for pattern formation applicable to ArF excimer laser irradiation comprises a water soluble resin, an acid generating agent capable of generating an acid upon heating, a surfactant, a crosslinking agent, and a water-containing solvent.

An object of the present invention is to provide a half-tone phase shift mask blank and a half-tone phase shift mask of which a translucent film has improved acid resistance, alkali resistance and resistance to excimer laser irradiation while maintaining the internal stress of the film within an acceptable range for the intended use. To achieve the aforementioned object, the present invention provides a half-tone phase shift mask blank which comprises a transparent substrate having provided thereon a translucent film comprising at least one thin layer containing silicon and at least one of nitrogen and oxygen and which is to be exposed to light whose center wavelength is 248 nm or shorter, wherein said translucent film is dense such that it has a center-line surface roughness (Ra) of 0.3 nm or smaller.

Concerns lithium-doped diamond: Low-resistivity n-type semiconductor diamond doped with lithium and nitrogen, and a method of manufacturing such diamond are provided. Low-resistivity n-type semiconductor diamond containing 1017 cm-3 or more of lithium atoms and nitrogen atoms together, in which are respectively doped lithium atoms into carbon-atom interstitial lattice sites, and nitrogen atoms into carbon-atom substitutional sites, with the lithium and the nitrogen holding arrangements that neighbor each other. To obtain low-resistivity n-type semiconductor diamond, in a method for the vapor synthesis of diamond, photodissociating source materials by photoexcitation utilizing vacuum ultraviolet light and irradiating a lithium source material with an excimer laser to scatter and supply lithium atoms enables the diamond to be produced.

A water-soluble resin composition for use in a pattern forming method involving applying a coating layer to a resist pattern formed by an ArF-responsive radiation-sensitive resin composition and expanding the width of the resist pattern so as to attain effective miniaturization of trench pattern and hole pattern, wherein the degree of dimensional shrinkage of resist pattern layer is increased over that of the prior art and wherein the dependence of rough / dense resist pattern on dimensional shrinkage degree is reduced; and a method of forming a pattern with the use of the water-soluble resin composition. There is provided a water-soluble resin composition for use in the above pattern forming method applicable to ArF excimer laser irradiation, comprising a water-soluble resin, a generator capable of generating an acid when heated, a surfactant, a crosslinking agent and a solvent containing water. Further, there is provided a method of forming a pattern with the use of the water-soluble resin composition.

A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device, developing the resist exposed by the light pattern to form a wafer pattern with the resist, and etching the substrate on which the wafer pattern with the resist is formed. In the step of exposing the light pattern is formed by illuminating a mask with excimer laser light having an annular shape.