The invention relates to a
printed circuit board hole
copper abnormity monitoring method, which comprises the following steps: S1, manufacturing a
test board, including S1.1, selecting raw materials;S1.2, manufacturing
copper testing PADs, namely, manufacturing a plurality of
copper testing PADs on a circuit board as surface copper testing points, and enabling the plurality of surface copper testing points to be distributed in a
square array shape; and S1.3, manufacturing through holes, namely, drilling a plurality of through holes with different sizes in the circuit board, and enabling the through holes with the same size to be arranged in the same row or the same column; and S2, carrying out a testing method, including S2.1, placing the
test board and a normal board together, and conducting
copper deposition,
electroplating and board baking according to normal steps; S2.2, testing through hole resistance and surface copper data, namely, measuring the through hole resistance by usinga universal meter, and measuring the surface copper data by using the copper measuring PADs; and S2.3, performing screening and analysis, namely, screening out normal holes and abnormal holes according to test results in the step S3, observing the deep plating capacity in the normal holes by
slicing the normal holes, and judging the cause of
abnormality by
slicing the abnormal holes and combiningsurface copper data. According to the invention, the problem of
electroplating hole copper can be periodically and diversely monitored.