PCB CAF test module design method

Abstract

The invention discloses a PCB CAF test module design method. The method comprises the steps that the number of designed layers of a PCB CAF test module is determined; the CAF test module is divided into a hole-to-hole CAF test sub-module and a hole-to-copper CAF test sub-module; the hole-to-hole CAF test sub-module is designed; the hole-to-copper CAF test sub-module is designed; and the hole-to-hole CAF test sub-module and the hole-to-copper CAF test sub-module are combined and spliced into a complete CAF test module, and testing is performed. The CAF test module is divided into the hole-to-hole CAF test sub-module and the hole-to-copper CAF test sub-module, the hole-to-hole CAF test sub-module can analyze CAF probabilities under different hole center-to-hole center distances and measure the influence proportion of drilling on CAF, and the hole-to-copper CAF test sub-module can analyze CAF probabilities under different hole center-to-hole center distances, and measures the influence proportion of the distances from different holes to the copper sheet, and the refined test module design is convenient for the true cause analysis of the CAF influence factors and is beneficial to the discrimination of primary and secondary factors.

Description

technical field [0001] The invention relates to the technical field of testing electronic components, in particular to a method for designing a PCB board CAF test module. Background technique [0002] As electronic products are increasingly miniaturized and highly integrated, the electronics industry has higher and higher requirements for the reliability of PCB boards. As one of the reliability testing items of PCB board, CAF testing has been paid more and more attention by the industry. CAF refers to the leakage of copper and copper salts that occurs during the migration of copper ions inside the PCB from the anode (high voltage) along the microcrack channel between glass fibers to the cathode (low voltage). When the PCB board is working in a high temperature and high humidity environment, the CAF phenomenon may occur between two insulated conductors, which will eventually lead to poor insulation and short circuit failure. The CAF phenomenon may occur between the holes of...

AI Technical Summary

Problems solved by technology

When the PCB board is working in a high temperature and high humidity environment, the CAF phenomenon may occur between two insulated conductors, which will eventually lead to poor insulation and short circuit failure.

The CAF phenomenon may occur between the holes of the PCB board, between the holes and the inner and outer wires, and between the outer wires and the wires. In order to analyze the real cause of the CAF phenomenon on the PCB board, the commonly used CAF test module design , usually the connection between holes and holes, holes and inner and outer wires is designed together. Although the CAF test module design has a high degree of integration, it is not conducive to the analysis of influencing factors

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