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42results about How to "Preferable performance" patented technology

Press-forming die for glass elements

A platinum thin film having a thickness of 0.01 to 5 mum is formed by means of the sputtering method on a press face of a die based on the use of a cemented carbide base material. A nickel thin film having a thickness of 0.05 to 0.5 mum and a thin film made of an alloy of platinum and iridium are allowed to intervene between the cemented carbide base material and the platinum thin film, if necessary. Alternatively, an alloy thin film having a thickness of 0.01 to 5 mum, which contains 10 to 70% by weight of iridium and 30 to 90% by weight of one or more species of metals selected from metals of the platinum group except for iridium, may be allowed to intervene between the cemented carbide base material and the platinum thin film.
Owner:NGK INSULATORS LTD +1

Substrate structure and fabrication method thereof

A substrate structure includes a substrate body and a plurality of conductive pads formed on the substrate body and each having a first copper layer, a nickel layer, a second copper layer and a gold layer sequentially stacked. The thickness of the second copper layer is less than the thickness of the first copper layer. As such, the invention effectively enhances the bonding strength between the conductive pads and solder balls to be mounted later on the conductive pads, and prolongs the duration period of the substrate structure.
Owner:SILICONWARE PRECISION IND CO LTD
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