Disclosed is a manufacturing method of a circuit board with an
electromagnetic shielding function. The manufacturing method comprises the following steps that a single-sided
copper-clad substrate is provided, wherein the single-sided
copper-clad substrate comprises a first base material layer and a first
copper foil layer; the first base material layer comprises a first surface and a second surface opposite to the first surface, and the first
copper foil layer is formed on the first surface; a first low-loss
dielectric layer is formed on the second surface; at least one first containing hole which penetrates through the first low-loss
dielectric layer and the first base material layer is formed, and a first
conductive paste is filled in the first containing hole, so as to form a first
electromagnetic shielding layer; and a circuit substrate is provided, and the first
electromagnetic shielding layer is pressed on the circuit substrate, wherein the circuit substrate comprises a first conductive circuit layer, and the first
conductive paste is directly electrically connected with the first conductive circuit layer and the first
copper foil layer. The invention further relates to the circuit board with the electromagnetic shielding function.